MX25L25855EXCI-12G

Macronix MX25L25855EXCI-12G

Part Number:
MX25L25855EXCI-12G
Manufacturer:
Macronix
Ventron No:
3233652-MX25L25855EXCI-12G
Description:
IC FLASH 256MBIT 80MHZ 24FBGA
ECAD Model:
Datasheet:
MX25L25855EXCI-12G

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Specifications
Macronix MX25L25855EXCI-12G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25L25855EXCI-12G.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    24-TBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2009
  • Series
    MXSMIO™
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    24
  • Additional Feature
    IT ALSO CONFIGURED AS 256M X 1
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B24
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface
    SPI, Serial
  • Memory Size
    256Mb 32M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    86MHz
  • Supply Current-Max
    0.025mA
  • Memory Format
    FLASH
  • Memory Interface
    SPI
  • Organization
    64MX4
  • Memory Width
    4
  • Write Cycle Time - Word, Page
    300μs, 5ms
  • Standby Current-Max
    0.00008A
  • Memory Density
    268435456 bit
  • Programming Voltage
    2.7V
  • Serial Bus Type
    SPI
  • Endurance
    100000 Write/Erase Cycles
  • Data Retention Time-Min
    20
  • Write Protection
    HARDWARE/SOFTWARE
  • Alternate Memory Width
    2
  • Height Seated (Max)
    1.2mm
  • Length
    8mm
  • Width
    6mm
  • RoHS Status
    ROHS3 Compliant
Description
MX25L25855EXCI-12G Overview
The Moisture Sensitivity Level (MSL) of a product is an important factor to consider when handling and storing electronic components. With an MSL of 3 (168 Hours), the product can withstand exposure to moisture for up to 168 hours before it becomes damaged. The Terminal Position of the product is at the BOTTOM, making it easy to connect to other components. The Supply Voltage of the product is 3.3V, with a maximum voltage of 3.6V (Vsup). The Memory Format is FLASH, with a Memory Width of 4. The Write Cycle Time for both Word and Page is 300μs and 5ms, respectively. The Programming Voltage required is 2.7V and the product has both HARDWARE and SOFTWARE Write Protection options. The Height Seated (Max) of the product is 1.2mm, making it compact and suitable for various applications.

MX25L25855EXCI-12G Features
Package / Case: 24-TBGA, CSPBGA
Additional Feature:IT ALSO CONFIGURED AS 256M X 1


MX25L25855EXCI-12G Applications
There are a lot of Macronix
MX25L25855EXCI-12G Memory applications.


personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
MX25L25855EXCI-12G More Descriptions
IC FLASH 256M SPI 86MHZ 24TBGA
IC FLASH 256MBIT SPI 24CSPBGA
Product Comparison
The three parts on the right have similar specifications to MX25L25855EXCI-12G.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Standby Current-Max
    Memory Density
    Programming Voltage
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Alternate Memory Width
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Number of Pins
    JESD-609 Code
    Terminal Finish
    Pin Count
    ECCN Code
    HTS Code
    Operating Supply Voltage
    Density
    Lead Free
    Pbfree Code
    Reflow Temperature-Max (s)
    View Compare
  • MX25L25855EXCI-12G
    MX25L25855EXCI-12G
    16 Weeks
    Surface Mount
    24-TBGA, CSPBGA
    YES
    -40°C~85°C TA
    Tray
    2009
    MXSMIO™
    Active
    3 (168 Hours)
    24
    IT ALSO CONFIGURED AS 256M X 1
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    NOT SPECIFIED
    1
    3.3V
    1mm
    NOT SPECIFIED
    R-PBGA-B24
    Not Qualified
    3.6V
    3/3.3V
    2.7V
    SPI, Serial
    256Mb 32M x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    0.025mA
    FLASH
    SPI
    64MX4
    4
    300μs, 5ms
    0.00008A
    268435456 bit
    2.7V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    2
    1.2mm
    8mm
    6mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L12875FMI-10G
    16 Weeks
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    YES
    -40°C~85°C TA
    Tube
    -
    MX25xxx35/36 - MXSMIO™
    Active
    3 (168 Hours)
    16
    CAN BE ORGNISED AS 128 MBIT X 1
    FLASH - NOR
    2.7V~3.6V
    DUAL
    260
    1
    3V
    1.27mm
    40
    -
    -
    3.6V
    -
    2.7V
    SPI, Serial
    128Mb 16M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    -
    FLASH
    SPI
    32MX4
    4
    30μs, 1.5ms
    -
    134217728 bit
    3V
    -
    -
    -
    -
    2
    2.65mm
    10.3mm
    7.52mm
    ROHS3 Compliant
    16
    e3
    MATTE TIN (800)
    16
    -
    -
    -
    -
    -
    -
    -
  • MX25L2006EZNI-12G
    10 Weeks
    Surface Mount
    8-WDFN Exposed Pad
    YES
    -40°C~85°C TA
    Tray
    2010
    MX25xxx05/06
    Active
    3 (168 Hours)
    8
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    NOT SPECIFIED
    R-PDSO-N8
    Not Qualified
    -
    3/3.3V
    2.7V
    SPI, Serial
    2Mb 256K x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    0.02mA
    FLASH
    SPI
    1MX2
    2
    50μs, 3ms
    0.00001A
    -
    2.7V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    1
    0.8mm
    6mm
    5mm
    ROHS3 Compliant
    -
    -
    -
    8
    EAR99
    8542.32.00.51
    3.6V
    2 Mb
    Lead Free
    -
    -
  • MX25L1606EM2I-12G
    16 Weeks
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    YES
    -40°C~85°C TA
    Tube
    2016
    MX25xxx05/06
    Not For New Designs
    3 (168 Hours)
    8
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    -
    R-PDSO-G8
    Not Qualified
    -
    3/3.3V
    2.7V
    SPI, Serial
    16Mb 2M x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    0.025mA
    FLASH
    SPI
    8MX2
    2
    50μs, 3ms
    0.00002A
    -
    2.7V
    SPI
    100000 Write/Erase Cycles
    -
    HARDWARE/SOFTWARE
    1
    2.16mm
    5.28mm
    5.23mm
    ROHS3 Compliant
    -
    e3
    Matte Tin (Sn) - annealed
    8
    EAR99
    8542.32.00.51
    3.6V
    16 Mb
    Lead Free
    yes
    NOT SPECIFIED
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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