MR25H256MDF

Everspin Technologies Inc. MR25H256MDF

Part Number:
MR25H256MDF
Manufacturer:
Everspin Technologies Inc.
Ventron No:
3233086-MR25H256MDF
Description:
IC MRAM 256KBIT 40MHZ 8DFN
ECAD Model:
Datasheet:
MR25H256MDF

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Specifications
Everspin Technologies Inc. MR25H256MDF technical specifications, attributes, parameters and parts with similar specifications to Everspin Technologies Inc. MR25H256MDF.
  • Factory Lead Time
    14 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    8-VDFN Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~125°C TA
  • Packaging
    Tray
  • Published
    2013
  • Series
    Automotive, AEC-Q100
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • HTS Code
    8542.32.00.71
  • Max Power Dissipation
    600mW
  • Technology
    MRAM (Magnetoresistive RAM)
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    40
  • Pin Count
    8
  • JESD-30 Code
    R-PDSO-N8
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    3V
  • Interface
    SPI, Serial
  • Memory Size
    256Kb 32K x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    40MHz
  • Memory Format
    RAM
  • Memory Interface
    SPI
  • Data Bus Width
    8b
  • Organization
    32KX8
  • Memory Width
    8
  • Memory Density
    262144 bit
  • Height Seated (Max)
    0.9mm
  • Length
    6mm
  • RoHS Status
    ROHS3 Compliant
Description
MR25H256MDF Overview
As far as its memory type goes, it falls into the Non-Volatile category. The case comes in the Tray style. Embedded in the 8-VDFN Exposed Pad case, memory ics is a single file. There is 256Kb 32K x 8 of memory on the chip. In this device, the memory is of the RAM-format, which is a popular format in the mainstream computing sector. -40°C~125°C TA is an extended operating temperature range, making this device ideal for demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V. As far as the mounting type is concerned, Surface Mount is recommended. A total of 8 terminations have been planted on the chip. There are 1 functions supported by this part as part of the comprehensive working process. The memory device is designed to be supplied with an 3.3V volt power supply in order to operate properly. There is a clock frequency rotation of the memory within a 40MHz range. I have noticed that the memory device has 8 pins, which indicates that it has 8 locations in the memory. Among the Automotive, AEC-Q100 series of memory devices, this part is essential for its applications.

MR25H256MDF Features
Package / Case: 8-VDFN Exposed Pad

MR25H256MDF Applications
There are a lot of Everspin Technologies Inc. MR25H256MDF Memory applications.

Cache memory
servers
supercomputers
nonvolatile BIOS memory
printers
multimedia computers
eDRAM
eSRAM
DVD disk buffer
personal computers
MR25H256MDF More Descriptions
MRAM 256Kbit Serial-SPI Interface 3.3V Automotive 8-Pin DFN EP Tray
EAR99 Surface Mount Tray 32KX8 ic memory 40MHz 6mm 8b 3V
NVRAM 256Kb 3.3V 32Kx8 SPI
IC RAM 256KBIT SPI 40MHZ 8DFN
Product Comparison
The three parts on the right have similar specifications to MR25H256MDF.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    HTS Code
    Max Power Dissipation
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Memory Format
    Memory Interface
    Data Bus Width
    Organization
    Memory Width
    Memory Density
    Height Seated (Max)
    Length
    RoHS Status
    Number of Pins
    Time@Peak Reflow Temperature-Max (s)
    Qualification Status
    Power Supplies
    Nominal Supply Current
    Write Cycle Time - Word, Page
    Density
    Standby Current-Max
    Access Time (Max)
    Word Size
    Width
    Mount
    Access Time
    Radiation Hardening
    Lead Free
    View Compare
  • MR25H256MDF
    MR25H256MDF
    14 Weeks
    Surface Mount
    8-VDFN Exposed Pad
    YES
    -40°C~125°C TA
    Tray
    2013
    Automotive, AEC-Q100
    Not For New Designs
    3 (168 Hours)
    8
    EAR99
    8542.32.00.71
    600mW
    MRAM (Magnetoresistive RAM)
    2.7V~3.6V
    DUAL
    260
    1
    3.3V
    1.27mm
    40
    8
    R-PDSO-N8
    3.6V
    3V
    SPI, Serial
    256Kb 32K x 8
    Non-Volatile
    SYNCHRONOUS
    40MHz
    RAM
    SPI
    8b
    32KX8
    8
    262144 bit
    0.9mm
    6mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MR256A08BCSO35
    -
    Surface Mount
    32-SOIC (0.295, 7.50mm Width)
    YES
    -40°C~85°C TA
    Tray
    2013
    -
    Obsolete
    3 (168 Hours)
    32
    EAR99
    -
    600mW
    MRAM (Magnetoresistive RAM)
    3V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3.3V
    1.25mm
    -
    32
    -
    3.6V
    3V
    -
    256Kb 32K x 8
    Non-Volatile
    ASYNCHRONOUS
    -
    RAM
    Parallel
    8b
    -
    8
    -
    2.54mm
    20.726mm
    RoHS Compliant
    32
    NOT SPECIFIED
    Not Qualified
    3.3V
    75mA
    35ns
    256 kb
    0.007A
    35 ns
    8b
    -
    -
    -
    -
    -
  • MR256DL08BMA45R
    24 Weeks
    Surface Mount
    48-LFBGA
    YES
    0°C~70°C TA
    Cut Tape (CT)
    2012
    -
    Discontinued
    3 (168 Hours)
    48
    EAR99
    8542.32.00.71
    -
    MRAM (Magnetoresistive RAM)
    2.7V~3.6V
    BOTTOM
    260
    1
    3.3V
    0.75mm
    -
    48
    -
    3.6V
    2.7V
    -
    256Kb 32K x 8
    Non-Volatile
    ASYNCHRONOUS
    -
    RAM
    Parallel
    -
    32KX8
    8
    262144 bit
    1.35mm
    8mm
    ROHS3 Compliant
    48
    40
    -
    -
    -
    45ns
    -
    -
    -
    -
    8mm
    -
    -
    -
    -
  • MR25H256CDF
    14 Weeks
    Surface Mount
    8-VDFN Exposed Pad
    -
    -40°C~85°C TA
    Tray
    2013
    -
    Not For New Designs
    3 (168 Hours)
    8
    EAR99
    -
    600mW
    MRAM (Magnetoresistive RAM)
    2.7V~3.6V
    DUAL
    -
    1
    3V
    1.27mm
    -
    -
    -
    3.6V
    2.7V
    SPI, Serial
    256Kb 32K x 8
    Non-Volatile
    -
    40MHz
    RAM
    SPI
    8b
    -
    8
    -
    0.9mm
    6mm
    ROHS3 Compliant
    8
    -
    -
    -
    27mA
    -
    256 kb
    -
    -
    8b
    -
    Surface Mount
    10 ns
    No
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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