NXP USA Inc. MM912H634DV1AER2

MM912H634DV1AER2 Overview
The mounting type of this electronic component is surface mount, which means it can be directly mounted onto a circuit board. The package or case of the component is 48-LQFP exposed pad, providing a protective covering for the internal circuitry. The packaging for this component is tape and reel, making it easy to handle and transport. The terminal finish is matte tin, which ensures a reliable and durable connection. The voltage supply range for this component is 2.25V to 5.5V, allowing for flexibility in various applications. The peak reflow temperature is 260 degrees Celsius, ensuring proper soldering during the manufacturing process. The reflow temperature maximum is 40 seconds, indicating the time it takes for the solder to properly melt and bond. This component has 9 input/output pins, providing connectivity options. The core processor of this component is S12, which is known for its efficiency and performance. Lastly, this component is ROHS3 compliant, meaning it meets the necessary environmental standards.

MM912H634DV1AER2 Features
48-LQFP Exposed Pad package
Mounting type of Surface Mount

MM912H634DV1AER2 Applications
There are a lot of NXP USA Inc. MM912H634DV1AER2 Microcontroller applications.

Industrial instrumentation devices
Magnetic resonance imaging (MRI)
Information appliances (networking of household appliances)
Broadband technology, video and voice processing
Process control devices
Air fryers
Dialysis machines (performs function of liver)
Volt meter
Aerospace navigation systems
Digital TVs