NXP USA Inc. MM912F634DV2AP
- Part Number:
- MM912F634DV2AP
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3666053-MM912F634DV2AP
- Description:
- IC MCU DUAL LS/HS SWITCH 48LQFP
- Datasheet:
- MM912F634DV2AP
NXP USA Inc. MM912F634DV2AP technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MM912F634DV2AP.
- Factory Lead Time16 Weeks
- Mounting TypeSurface Mount
- Package / Case48-LQFP
- Surface MountYES
- Operating Temperature-40°C~105°C
- PackagingTray
- Published2010
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations48
- Terminal FinishMatte Tin (Sn)
- ApplicationsAutomotive
- TechnologyCMOS
- Voltage - Supply2.25V~5.5V
- Terminal PositionQUAD
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Supply Voltage7V
- Terminal Pitch0.5mm
- Reflow Temperature-Max (s)40
- Base Part NumberMM912F634
- JESD-30 CodeS-PQFP-G48
- InterfaceLIN, SCI
- Number of I/O9
- RAM Size2K x 8
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
- Core ProcessorS12
- Program Memory TypeFLASH (32KB)
- Controller SeriesHCS12
- Height Seated (Max)1.6mm
- Length7mm
- Width7mm
- RoHS StatusROHS3 Compliant
MM912F634DV2AP Overview
The operating temperature range for this device is -40°C to 105°C, making it suitable for use in a wide range of environments. Its Moisture Sensitivity Level (MSL) is 3, meaning it can withstand exposure to moisture for up to 168 hours without damage. The terminal finish is Matte Tin (Sn), providing a durable and reliable connection. With a terminal pitch of 0.5mm, this device is compact and ideal for space-constrained applications. The reflow temperature-max (s) is 40, ensuring the device can be safely and efficiently soldered. It has 9 I/Os, making it versatile and capable of handling a variety of tasks. The core processor is S12 and the program memory type is FLASH (32KB), providing ample storage and processing power. This device belongs to the HCS12 controller series and is ROHS3 compliant, meeting the highest standards for environmental friendliness.
MM912F634DV2AP Features
48-LQFP package
Mounting type of Surface Mount
MM912F634DV2AP Applications
There are a lot of NXP USA Inc. MM912F634DV2AP Microcontroller applications.
Instrument control
Smartphones-calling, video calling, texting, email
Speed meter
Sonography (Ultrasound imaging)
Microwave ovens
Binding machines
Radio
Hand-held metering systems
Instrument control
Broadband technology, video and voice processing
The operating temperature range for this device is -40°C to 105°C, making it suitable for use in a wide range of environments. Its Moisture Sensitivity Level (MSL) is 3, meaning it can withstand exposure to moisture for up to 168 hours without damage. The terminal finish is Matte Tin (Sn), providing a durable and reliable connection. With a terminal pitch of 0.5mm, this device is compact and ideal for space-constrained applications. The reflow temperature-max (s) is 40, ensuring the device can be safely and efficiently soldered. It has 9 I/Os, making it versatile and capable of handling a variety of tasks. The core processor is S12 and the program memory type is FLASH (32KB), providing ample storage and processing power. This device belongs to the HCS12 controller series and is ROHS3 compliant, meeting the highest standards for environmental friendliness.
MM912F634DV2AP Features
48-LQFP package
Mounting type of Surface Mount
MM912F634DV2AP Applications
There are a lot of NXP USA Inc. MM912F634DV2AP Microcontroller applications.
Instrument control
Smartphones-calling, video calling, texting, email
Speed meter
Sonography (Ultrasound imaging)
Microwave ovens
Binding machines
Radio
Hand-held metering systems
Instrument control
Broadband technology, video and voice processing
MM912F634DV2AP More Descriptions
MagniV S12 Relay Driver, 2x HS/LS , VReg, 16-bit MCU, 6KB RAM, 32KB Flash, LIN, QFP 48, Tray
MCU 16-Bit S12 CISC 32KB Flash 9V/12V/15V/18V/24V 48-Pin LQFP Brick
16-bit Microcontrollers - MCU 32KS12 LIN2xLS/HS Isense
IC MCU DUAL LS/HS SWITCH 48LQFP
AUDIO POWER AMP, CLASS-D, 16TSSOP
MM912F634 - MAGNIV S12 RELAY DRI
MCU 16-Bit S12 CISC 32KB Flash 9V/12V/15V/18V/24V 48-Pin LQFP Brick
16-bit Microcontrollers - MCU 32KS12 LIN2xLS/HS Isense
IC MCU DUAL LS/HS SWITCH 48LQFP
AUDIO POWER AMP, CLASS-D, 16TSSOP
MM912F634 - MAGNIV S12 RELAY DRI
The three parts on the right have similar specifications to MM912F634DV2AP.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishApplicationsTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberJESD-30 CodeInterfaceNumber of I/ORAM SizeuPs/uCs/Peripheral ICs TypeCore ProcessorProgram Memory TypeController SeriesHeight Seated (Max)LengthWidthRoHS StatusAnalog IC - Other TypeView Compare
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MM912F634DV2AP16 WeeksSurface Mount48-LQFPYES-40°C~105°CTray2010e3Active3 (168 Hours)48Matte Tin (Sn)AutomotiveCMOS2.25V~5.5VQUADGULL WING2607V0.5mm40MM912F634S-PQFP-G48LIN, SCI92K x 8MICROPROCESSOR CIRCUITS12FLASH (32KB)HCS121.6mm7mm7mmROHS3 Compliant--
-
16 WeeksSurface Mount48-LQFP Exposed PadYES-40°C~105°CTape & Reel (TR)2010e3Active3 (168 Hours)48Matte Tin (Sn)AutomotiveCMOS2.25V~5.5VQUADGULL WING2607V0.5mm40MM912F634S-PQFP-G48LIN, SCI92K x 8MICROPROCESSOR CIRCUITS12FLASH (32KB)HCS121.6mm7mm7mmROHS3 Compliant-
-
16 WeeksSurface Mount48-LQFP Exposed Pad--40°C~105°CTray2006e3Active3 (168 Hours)-Matte Tin (Sn)Automotive-2.25V~5.5V--260--40MM912H634-LIN, SCI96K x 8-S12FLASH (64kB)HCS12---ROHS3 CompliantANALOG CIRCUIT
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16 WeeksSurface Mount48-LQFP Exposed PadYES-40°C~105°CTray2010e3Active3 (168 Hours)48Matte Tin (Sn)AutomotiveCMOS2.25V~5.5VQUADGULL WING2607V0.5mm40MM912F634S-PQFP-G48LIN, SCI92K x 8MICROPROCESSOR CIRCUITS12FLASH (32KB)HCS121.6mm7mm7mmROHS3 Compliant-
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