MM912F634DV2AP

NXP USA Inc. MM912F634DV2AP

Part Number:
MM912F634DV2AP
Manufacturer:
NXP USA Inc.
Ventron No:
3666053-MM912F634DV2AP
Description:
IC MCU DUAL LS/HS SWITCH 48LQFP
ECAD Model:
Datasheet:
MM912F634DV2AP

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Specifications
NXP USA Inc. MM912F634DV2AP technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MM912F634DV2AP.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    48-LQFP
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C
  • Packaging
    Tray
  • Published
    2010
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • Terminal Finish
    Matte Tin (Sn)
  • Applications
    Automotive
  • Technology
    CMOS
  • Voltage - Supply
    2.25V~5.5V
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    7V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MM912F634
  • JESD-30 Code
    S-PQFP-G48
  • Interface
    LIN, SCI
  • Number of I/O
    9
  • RAM Size
    2K x 8
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Core Processor
    S12
  • Program Memory Type
    FLASH (32KB)
  • Controller Series
    HCS12
  • Height Seated (Max)
    1.6mm
  • Length
    7mm
  • Width
    7mm
  • RoHS Status
    ROHS3 Compliant
Description
MM912F634DV2AP Overview
The operating temperature range for this device is -40°C to 105°C, making it suitable for use in a wide range of environments. Its Moisture Sensitivity Level (MSL) is 3, meaning it can withstand exposure to moisture for up to 168 hours without damage. The terminal finish is Matte Tin (Sn), providing a durable and reliable connection. With a terminal pitch of 0.5mm, this device is compact and ideal for space-constrained applications. The reflow temperature-max (s) is 40, ensuring the device can be safely and efficiently soldered. It has 9 I/Os, making it versatile and capable of handling a variety of tasks. The core processor is S12 and the program memory type is FLASH (32KB), providing ample storage and processing power. This device belongs to the HCS12 controller series and is ROHS3 compliant, meeting the highest standards for environmental friendliness.

MM912F634DV2AP Features
48-LQFP package
Mounting type of Surface Mount

MM912F634DV2AP Applications
There are a lot of NXP USA Inc. MM912F634DV2AP Microcontroller applications.

Instrument control
Smartphones-calling, video calling, texting, email
Speed meter
Sonography (Ultrasound imaging)
Microwave ovens
Binding machines
Radio
Hand-held metering systems
Instrument control
Broadband technology, video and voice processing
MM912F634DV2AP More Descriptions
MagniV S12 Relay Driver, 2x HS/LS , VReg, 16-bit MCU, 6KB RAM, 32KB Flash, LIN, QFP 48, Tray
MCU 16-Bit S12 CISC 32KB Flash 9V/12V/15V/18V/24V 48-Pin LQFP Brick
16-bit Microcontrollers - MCU 32KS12 LIN2xLS/HS Isense
IC MCU DUAL LS/HS SWITCH 48LQFP
AUDIO POWER AMP, CLASS-D, 16TSSOP
MM912F634 - MAGNIV S12 RELAY DRI
Product Comparison
The three parts on the right have similar specifications to MM912F634DV2AP.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Applications
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Interface
    Number of I/O
    RAM Size
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Program Memory Type
    Controller Series
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Analog IC - Other Type
    View Compare
  • MM912F634DV2AP
    MM912F634DV2AP
    16 Weeks
    Surface Mount
    48-LQFP
    YES
    -40°C~105°C
    Tray
    2010
    e3
    Active
    3 (168 Hours)
    48
    Matte Tin (Sn)
    Automotive
    CMOS
    2.25V~5.5V
    QUAD
    GULL WING
    260
    7V
    0.5mm
    40
    MM912F634
    S-PQFP-G48
    LIN, SCI
    9
    2K x 8
    MICROPROCESSOR CIRCUIT
    S12
    FLASH (32KB)
    HCS12
    1.6mm
    7mm
    7mm
    ROHS3 Compliant
    -
    -
  • MM912F634DV1AER2
    16 Weeks
    Surface Mount
    48-LQFP Exposed Pad
    YES
    -40°C~105°C
    Tape & Reel (TR)
    2010
    e3
    Active
    3 (168 Hours)
    48
    Matte Tin (Sn)
    Automotive
    CMOS
    2.25V~5.5V
    QUAD
    GULL WING
    260
    7V
    0.5mm
    40
    MM912F634
    S-PQFP-G48
    LIN, SCI
    9
    2K x 8
    MICROPROCESSOR CIRCUIT
    S12
    FLASH (32KB)
    HCS12
    1.6mm
    7mm
    7mm
    ROHS3 Compliant
    -
  • MM912H634DM1AE
    16 Weeks
    Surface Mount
    48-LQFP Exposed Pad
    -
    -40°C~105°C
    Tray
    2006
    e3
    Active
    3 (168 Hours)
    -
    Matte Tin (Sn)
    Automotive
    -
    2.25V~5.5V
    -
    -
    260
    -
    -
    40
    MM912H634
    -
    LIN, SCI
    9
    6K x 8
    -
    S12
    FLASH (64kB)
    HCS12
    -
    -
    -
    ROHS3 Compliant
    ANALOG CIRCUIT
  • MM912F634DV2AE
    16 Weeks
    Surface Mount
    48-LQFP Exposed Pad
    YES
    -40°C~105°C
    Tray
    2010
    e3
    Active
    3 (168 Hours)
    48
    Matte Tin (Sn)
    Automotive
    CMOS
    2.25V~5.5V
    QUAD
    GULL WING
    260
    7V
    0.5mm
    40
    MM912F634
    S-PQFP-G48
    LIN, SCI
    9
    2K x 8
    MICROPROCESSOR CIRCUIT
    S12
    FLASH (32KB)
    HCS12
    1.6mm
    7mm
    7mm
    ROHS3 Compliant
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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