NXP USA Inc. MM912H634DM1AE
- Part Number:
- MM912H634DM1AE
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3666065-MM912H634DM1AE
- Description:
- IC MCU 64KB LS/HS SWITCH 48LQFP
- Datasheet:
- MM912H634DM1AE
NXP USA Inc. MM912H634DM1AE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MM912H634DM1AE.
- Factory Lead Time16 Weeks
- Mounting TypeSurface Mount
- Package / Case48-LQFP Exposed Pad
- Operating Temperature-40°C~105°C
- PackagingTray
- Published2006
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Terminal FinishMatte Tin (Sn)
- ApplicationsAutomotive
- Voltage - Supply2.25V~5.5V
- Peak Reflow Temperature (Cel)260
- Reflow Temperature-Max (s)40
- Base Part NumberMM912H634
- InterfaceLIN, SCI
- Analog IC - Other TypeANALOG CIRCUIT
- Number of I/O9
- RAM Size6K x 8
- Core ProcessorS12
- Program Memory TypeFLASH (64kB)
- Controller SeriesHCS12
- RoHS StatusROHS3 Compliant
MM912H634DM1AE Overview
The NXP USA Inc. brand is well-known for its high-quality Embedded - Microcontrollers - Application Specific chips. These chips are specifically designed for embedded systems and microcontroller applications. They fall under the category of Embedded - Microcontrollers - Application Specific, which means they are tailored to meet the specific needs of various applications. In terms of physical characteristics, the NXP USA Inc. chip has a Surface Mount mounting type, ensuring easy installation and integration into electronic devices. The package or case of the chip is 48-LQFP Exposed Pad, which provides a secure and reliable enclosure for the internal components. The chip complies with the JESD-609 Code e3, indicating its adherence to industry standards and specifications. The NXP USA Inc. chip is currently in an Active status, meaning it is readily available for purchase and implementation. It has a Moisture Sensitivity Level (MSL) of 3 (168 Hours), indicating its ability to withstand moisture exposure for a specified duration without any adverse effects on its performance. The chip operates within a voltage supply range of 2.25V~5.5V, making it suitable for a wide range of applications. Its Reflow Temperature-Max is 40, ensuring that it can withstand high-temperature soldering processes without any damage or degradation. In terms of functionality, the NXP USA Inc. chip offers an interface that supports LIN (Local Interconnect Network) and SCI (Serial Communication Interface) protocols. This allows for seamless communication and data transfer between the chip and other connected devices. The chip also features a RAM size of 6K x 8, providing ample memory space for storing and processing data. Its Controller Series is HCS12, indicating its compatibility and integration with other HCS12 series microcontrollers. Overall, the NXP USA Inc. chip is a reliable and versatile component that offers advanced features and specifications for embedded systems and microcontroller applications. Its parameters ensure optimal performance and compatibility, making it a popular choice among electronic device manufacturers and developers.
MM912H634DM1AE Features
48-LQFP Exposed Pad package
Mounting type of Surface Mount
MM912H634DM1AE Applications
There are a lot of NXP USA Inc. MM912H634DM1AE Microcontroller applications.
Hand-held metering systems
Industrial robot
Monitoring-temperature level, oil level, speed, distance, acceleration
Traditional industrial transformation
Home video and audio
Home appliances
ECG machine
Gas monitoring systems
Microwave ovens
Playstation
The NXP USA Inc. brand is well-known for its high-quality Embedded - Microcontrollers - Application Specific chips. These chips are specifically designed for embedded systems and microcontroller applications. They fall under the category of Embedded - Microcontrollers - Application Specific, which means they are tailored to meet the specific needs of various applications. In terms of physical characteristics, the NXP USA Inc. chip has a Surface Mount mounting type, ensuring easy installation and integration into electronic devices. The package or case of the chip is 48-LQFP Exposed Pad, which provides a secure and reliable enclosure for the internal components. The chip complies with the JESD-609 Code e3, indicating its adherence to industry standards and specifications. The NXP USA Inc. chip is currently in an Active status, meaning it is readily available for purchase and implementation. It has a Moisture Sensitivity Level (MSL) of 3 (168 Hours), indicating its ability to withstand moisture exposure for a specified duration without any adverse effects on its performance. The chip operates within a voltage supply range of 2.25V~5.5V, making it suitable for a wide range of applications. Its Reflow Temperature-Max is 40, ensuring that it can withstand high-temperature soldering processes without any damage or degradation. In terms of functionality, the NXP USA Inc. chip offers an interface that supports LIN (Local Interconnect Network) and SCI (Serial Communication Interface) protocols. This allows for seamless communication and data transfer between the chip and other connected devices. The chip also features a RAM size of 6K x 8, providing ample memory space for storing and processing data. Its Controller Series is HCS12, indicating its compatibility and integration with other HCS12 series microcontrollers. Overall, the NXP USA Inc. chip is a reliable and versatile component that offers advanced features and specifications for embedded systems and microcontroller applications. Its parameters ensure optimal performance and compatibility, making it a popular choice among electronic device manufacturers and developers.
MM912H634DM1AE Features
48-LQFP Exposed Pad package
Mounting type of Surface Mount
MM912H634DM1AE Applications
There are a lot of NXP USA Inc. MM912H634DM1AE Microcontroller applications.
Hand-held metering systems
Industrial robot
Monitoring-temperature level, oil level, speed, distance, acceleration
Traditional industrial transformation
Home video and audio
Home appliances
ECG machine
Gas monitoring systems
Microwave ovens
Playstation
MM912H634DM1AE More Descriptions
MagniV S12 Relay Driver, 2x HS/ LS, I-sense, 16-bit MCU, 6KB RAM, 64KB Flash, LIN, QFP-EP 48NXP Semiconductors SCT
MCU 16-Bit S12 CISC 64KB Flash 48-Pin LQFP EP Tray
16-bit Microcontrollers - MCU 64KS12 LIN2XLS/HS ISENSE
IC MCU 64KB LS/HS SWITCH 48LQFP
ROHS3Compliant Matte Tin (Sn) 2006 FLASH (64kB) Automotive Microcontroller 2.25V~5.5V 6K x 8 -40C~105C
MM912H634 - INTEGRATED HCS12 BAS
MCU 16-Bit S12 CISC 64KB Flash 48-Pin LQFP EP Tray
16-bit Microcontrollers - MCU 64KS12 LIN2XLS/HS ISENSE
IC MCU 64KB LS/HS SWITCH 48LQFP
ROHS3Compliant Matte Tin (Sn) 2006 FLASH (64kB) Automotive Microcontroller 2.25V~5.5V 6K x 8 -40C~105C
MM912H634 - INTEGRATED HCS12 BAS
The three parts on the right have similar specifications to MM912H634DM1AE.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Terminal FinishApplicationsVoltage - SupplyPeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Base Part NumberInterfaceAnalog IC - Other TypeNumber of I/ORAM SizeCore ProcessorProgram Memory TypeController SeriesRoHS StatusSurface MountNumber of TerminationsTechnologyTerminal PositionTerminal FormSupply VoltageTerminal PitchJESD-30 CodeuPs/uCs/Peripheral ICs TypeHeight Seated (Max)LengthWidthView Compare
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MM912H634DM1AE16 WeeksSurface Mount48-LQFP Exposed Pad-40°C~105°CTray2006e3Active3 (168 Hours)Matte Tin (Sn)Automotive2.25V~5.5V26040MM912H634LIN, SCIANALOG CIRCUIT96K x 8S12FLASH (64kB)HCS12ROHS3 Compliant-------------
-
-Surface Mount48-LQFP Exposed Pad-40°C~125°CTape & Reel (TR)2010-Obsolete3 (168 Hours)-Automotive2.25V~5.25V--MM912H634LIN, SCI-96K x 8S12FLASH (64kB)HCS12ROHS3 Compliant------------
-
16 WeeksSurface Mount48-LQFP-40°C~105°CTray2010e3Active3 (168 Hours)Matte Tin (Sn)Automotive2.25V~5.5V26040MM912F634LIN, SCI-92K x 8S12FLASH (32KB)HCS12ROHS3 CompliantYES48CMOSQUADGULL WING7V0.5mmS-PQFP-G48MICROPROCESSOR CIRCUIT1.6mm7mm7mm
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16 WeeksSurface Mount48-LQFP Exposed Pad-40°C~105°CTray2010e3Active3 (168 Hours)Matte Tin (Sn)Automotive2.25V~5.5V26040MM912F634LIN, SCI-92K x 8S12FLASH (32KB)HCS12ROHS3 CompliantYES48CMOSQUADGULL WING7V0.5mmS-PQFP-G48MICROPROCESSOR CIRCUIT1.6mm7mm7mm
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