MM912H634DM1AE

NXP USA Inc. MM912H634DM1AE

Part Number:
MM912H634DM1AE
Manufacturer:
NXP USA Inc.
Ventron No:
3666065-MM912H634DM1AE
Description:
IC MCU 64KB LS/HS SWITCH 48LQFP
ECAD Model:
Datasheet:
MM912H634DM1AE

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Specifications
NXP USA Inc. MM912H634DM1AE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MM912H634DM1AE.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    48-LQFP Exposed Pad
  • Operating Temperature
    -40°C~105°C
  • Packaging
    Tray
  • Published
    2006
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    Matte Tin (Sn)
  • Applications
    Automotive
  • Voltage - Supply
    2.25V~5.5V
  • Peak Reflow Temperature (Cel)
    260
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MM912H634
  • Interface
    LIN, SCI
  • Analog IC - Other Type
    ANALOG CIRCUIT
  • Number of I/O
    9
  • RAM Size
    6K x 8
  • Core Processor
    S12
  • Program Memory Type
    FLASH (64kB)
  • Controller Series
    HCS12
  • RoHS Status
    ROHS3 Compliant
Description
MM912H634DM1AE Overview
The NXP USA Inc. brand is well-known for its high-quality Embedded - Microcontrollers - Application Specific chips. These chips are specifically designed for embedded systems and microcontroller applications. They fall under the category of Embedded - Microcontrollers - Application Specific, which means they are tailored to meet the specific needs of various applications. In terms of physical characteristics, the NXP USA Inc. chip has a Surface Mount mounting type, ensuring easy installation and integration into electronic devices. The package or case of the chip is 48-LQFP Exposed Pad, which provides a secure and reliable enclosure for the internal components. The chip complies with the JESD-609 Code e3, indicating its adherence to industry standards and specifications. The NXP USA Inc. chip is currently in an Active status, meaning it is readily available for purchase and implementation. It has a Moisture Sensitivity Level (MSL) of 3 (168 Hours), indicating its ability to withstand moisture exposure for a specified duration without any adverse effects on its performance. The chip operates within a voltage supply range of 2.25V~5.5V, making it suitable for a wide range of applications. Its Reflow Temperature-Max is 40, ensuring that it can withstand high-temperature soldering processes without any damage or degradation. In terms of functionality, the NXP USA Inc. chip offers an interface that supports LIN (Local Interconnect Network) and SCI (Serial Communication Interface) protocols. This allows for seamless communication and data transfer between the chip and other connected devices. The chip also features a RAM size of 6K x 8, providing ample memory space for storing and processing data. Its Controller Series is HCS12, indicating its compatibility and integration with other HCS12 series microcontrollers. Overall, the NXP USA Inc. chip is a reliable and versatile component that offers advanced features and specifications for embedded systems and microcontroller applications. Its parameters ensure optimal performance and compatibility, making it a popular choice among electronic device manufacturers and developers.

MM912H634DM1AE Features
48-LQFP Exposed Pad package
Mounting type of Surface Mount

MM912H634DM1AE Applications
There are a lot of NXP USA Inc. MM912H634DM1AE Microcontroller applications.

Hand-held metering systems
Industrial robot
Monitoring-temperature level, oil level, speed, distance, acceleration
Traditional industrial transformation
Home video and audio
Home appliances
ECG machine
Gas monitoring systems
Microwave ovens
Playstation
MM912H634DM1AE More Descriptions
MagniV S12 Relay Driver, 2x HS/ LS, I-sense, 16-bit MCU, 6KB RAM, 64KB Flash, LIN, QFP-EP 48NXP Semiconductors SCT
MCU 16-Bit S12 CISC 64KB Flash 48-Pin LQFP EP Tray
16-bit Microcontrollers - MCU 64KS12 LIN2XLS/HS ISENSE
IC MCU 64KB LS/HS SWITCH 48LQFP
ROHS3Compliant Matte Tin (Sn) 2006 FLASH (64kB) Automotive Microcontroller 2.25V~5.5V 6K x 8 -40C~105C
MM912H634 - INTEGRATED HCS12 BAS
Product Comparison
The three parts on the right have similar specifications to MM912H634DM1AE.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Applications
    Voltage - Supply
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Base Part Number
    Interface
    Analog IC - Other Type
    Number of I/O
    RAM Size
    Core Processor
    Program Memory Type
    Controller Series
    RoHS Status
    Surface Mount
    Number of Terminations
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    JESD-30 Code
    uPs/uCs/Peripheral ICs Type
    Height Seated (Max)
    Length
    Width
    View Compare
  • MM912H634DM1AE
    MM912H634DM1AE
    16 Weeks
    Surface Mount
    48-LQFP Exposed Pad
    -40°C~105°C
    Tray
    2006
    e3
    Active
    3 (168 Hours)
    Matte Tin (Sn)
    Automotive
    2.25V~5.5V
    260
    40
    MM912H634
    LIN, SCI
    ANALOG CIRCUIT
    9
    6K x 8
    S12
    FLASH (64kB)
    HCS12
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MM912H634CM1AER2
    -
    Surface Mount
    48-LQFP Exposed Pad
    -40°C~125°C
    Tape & Reel (TR)
    2010
    -
    Obsolete
    3 (168 Hours)
    -
    Automotive
    2.25V~5.25V
    -
    -
    MM912H634
    LIN, SCI
    -
    9
    6K x 8
    S12
    FLASH (64kB)
    HCS12
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MM912F634DV2AP
    16 Weeks
    Surface Mount
    48-LQFP
    -40°C~105°C
    Tray
    2010
    e3
    Active
    3 (168 Hours)
    Matte Tin (Sn)
    Automotive
    2.25V~5.5V
    260
    40
    MM912F634
    LIN, SCI
    -
    9
    2K x 8
    S12
    FLASH (32KB)
    HCS12
    ROHS3 Compliant
    YES
    48
    CMOS
    QUAD
    GULL WING
    7V
    0.5mm
    S-PQFP-G48
    MICROPROCESSOR CIRCUIT
    1.6mm
    7mm
    7mm
  • MM912F634DV2AE
    16 Weeks
    Surface Mount
    48-LQFP Exposed Pad
    -40°C~105°C
    Tray
    2010
    e3
    Active
    3 (168 Hours)
    Matte Tin (Sn)
    Automotive
    2.25V~5.5V
    260
    40
    MM912F634
    LIN, SCI
    -
    9
    2K x 8
    S12
    FLASH (32KB)
    HCS12
    ROHS3 Compliant
    YES
    48
    CMOS
    QUAD
    GULL WING
    7V
    0.5mm
    S-PQFP-G48
    MICROPROCESSOR CIRCUIT
    1.6mm
    7mm
    7mm
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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