IS61DDP2B22M18A-400M3L

ISSI, Integrated Silicon Solution Inc IS61DDP2B22M18A-400M3L

Part Number:
IS61DDP2B22M18A-400M3L
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Ventron No:
3237174-IS61DDP2B22M18A-400M3L
Description:
IC SDRAM 36MBIT 400MHZ 165BGA
ECAD Model:
Datasheet:
IS61DDP2B22M18A-400M3L

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Specifications
ISSI, Integrated Silicon Solution Inc IS61DDP2B22M18A-400M3L technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS61DDP2B22M18A-400M3L.
  • Factory Lead Time
    12 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    165-LBGA
  • Surface Mount
    YES
  • Number of Pins
    165
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tray
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    165
  • ECCN Code
    3A991.B.2.A
  • HTS Code
    8542.32.00.41
  • Technology
    SRAM - Synchronous, DDR IIP
  • Voltage - Supply
    1.71V~1.89V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    165
  • Supply Voltage-Max (Vsup)
    1.89V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Memory Size
    36Mb 2M x 18
  • Memory Type
    Volatile
  • Clock Frequency
    400MHz
  • Memory Format
    SRAM
  • Memory Interface
    Parallel
  • Organization
    2MX18
  • Memory Width
    18
  • Memory Density
    37748736 bit
  • Access Time (Max)
    0.45 ns
  • Height Seated (Max)
    1.4mm
  • Length
    17mm
  • Width
    15mm
  • RoHS Status
    ROHS3 Compliant
Description
IS61DDP2B22M18A-400M3L Overview
Surface Mount technology has become increasingly popular in the electronics industry due to its compact size and efficient production process. This technology allows for components to be directly mounted onto the surface of a printed circuit board, eliminating the need for through-hole mounting. One such component is the memory chip, with a pin count of 165 and a memory size of 36Mb 2M x 18. This volatile memory type is ideal for applications that require fast data access, with an access time of only 0.45 ns. The memory interface is parallel, providing high-speed data transfer. The operating temperature range for this chip is 0°C~70°C TA, making it suitable for a wide range of environments. Additionally, its ECCN Code is 3A991.B.2.A, indicating that it is export-controlled for national security reasons. With a compact length of 17mm, this surface mount memory chip is a versatile and efficient choice for various electronic devices.

IS61DDP2B22M18A-400M3L Features
Package / Case: 165-LBGA
165 Pins


IS61DDP2B22M18A-400M3L Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61DDP2B22M18A-400M3L Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
IS61DDP2B22M18A-400M3L More Descriptions
SRAM Chip Sync Single 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin LFBGA
1.71V~1.89V 36Mbit FBGA-165(15x17) SRAM ROHS
IC SRAM 36MBIT PARALLEL 165LFBGA
SRAM 36Mb 400Mhz 2Mx18 DDR IIP Sync SRAM
36Mb, Ddr Iip (Burst Of 2) Cio, Sync Sram, 2M X 18, 2.0 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution (Issi) IS61DDP2B22M18A-400M3L
Product Comparison
The three parts on the right have similar specifications to IS61DDP2B22M18A-400M3L.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Memory Density
    Access Time (Max)
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Additional Feature
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Operating Supply Voltage
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Number of Ports
    Nominal Supply Current
    Access Time
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Sync/Async
    Word Size
    Radiation Hardening
    Reach Compliance Code
    JESD-30 Code
    View Compare
  • IS61DDP2B22M18A-400M3L
    IS61DDP2B22M18A-400M3L
    12 Weeks
    Surface Mount
    165-LBGA
    YES
    165
    0°C~70°C TA
    Tray
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    8542.32.00.41
    SRAM - Synchronous, DDR IIP
    1.71V~1.89V
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    1.89V
    1.71V
    36Mb 2M x 18
    Volatile
    400MHz
    SRAM
    Parallel
    2MX18
    18
    37748736 bit
    0.45 ns
    1.4mm
    17mm
    15mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61DDB24M18A-300M3L
    12 Weeks
    Surface Mount
    165-LBGA
    YES
    165
    0°C~70°C TA
    Tray
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    8542.32.00.41
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    1.89V
    1.71V
    72Mb 4M x 18
    Volatile
    300MHz
    SRAM
    Parallel
    4MX18
    18
    75497472 bit
    0.45 ns
    1.4mm
    17mm
    15mm
    ROHS3 Compliant
    PIPELINED ARCHITECTURE
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61C25616AL-10KLI-TR
    8 Weeks
    Surface Mount
    44-BSOJ (0.400, 10.16mm Width)
    -
    44
    -40°C~85°C TA
    Tape & Reel (TR)
    Active
    2 (1 Year)
    -
    -
    -
    SRAM - Asynchronous
    4.5V~5.5V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    4Mb 256K x 16
    Volatile
    -
    SRAM
    Parallel
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    44-SOJ
    85°C
    -40°C
    5V
    Parallel
    5.5V
    4.5V
    1
    50mA
    10ns
    10ns
    18b
    4 Mb
    Asynchronous
    16b
    No
    -
    -
  • IS61DDB44M18A-300M3I
    -
    Surface Mount
    165-LBGA
    YES
    -
    -40°C~85°C TA
    Tray
    Last Time Buy
    3 (168 Hours)
    165
    3A991.B.2.A
    8542.32.00.41
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    BOTTOM
    -
    1
    1.8V
    1mm
    -
    165
    1.89V
    1.71V
    72Mb 4M x 18
    Volatile
    300MHz
    SRAM
    Parallel
    4MX18
    18
    75497472 bit
    -
    1.4mm
    17mm
    15mm
    -
    PIPELINED ARCHITECTURE
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1.48ns
    -
    -
    -
    -
    -
    -
    compliant
    R-PBGA-B165
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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