Nexperia USA Inc. IP4855CX25Z

IP4855CX25Z Overview
The Mount is Surface Mount, meaning it is designed to be mounted directly onto the surface of a printed circuit board. The Mounting Type is also Surface Mount, indicating that this package is suitable for use in surface mount applications. The Package / Case is 25-XFBGA, WLCSP, which refers to the size and shape of the package. This particular package is 25-XFBGA, which stands for eXposed Pad Ball Grid Array, and WLCSP, which stands for Wafer Level Chip Scale Package. The Packaging for this component is Tape & Reel (TR), which is a common method used for shipping and handling electronic components. The Part Status is Obsolete, meaning this component is no longer in production. However, it is still available for purchase from some suppliers. The Moisture Sensitivity Level (MSL) is 1 (Unlimited), indicating that this component has no moisture sensitivity and can be exposed to unlimited levels of moisture without any negative effects. This makes it suitable for use in various applications, such as Digital Cameras, Mobile Phones, and Portable Video devices. The Voltage - Supply for this component is 2.5V~5.5V, meaning it can operate within this range of voltage. It has a Pin Count of 25, which refers to the number of pins on the package. Finally, the RoHS Status is RoHS Compliant, indicating that this component is in compliance with the Restriction of Hazardous Substances directive, making it environmentally friendly.

IP4855CX25Z Features

IP4855CX25Z Applications
There are a lot of Nexperia USA Inc. IP4855CX25Z Specialized Interface ICs applications.

Industrial control systems
Multiplexers
High-Voltage
Avionics and Military Systems
Video signal routing
Channelized and Unchannelized DS3 applications
nonfault-protected)
Audio and video routing
High reliability control systems
Automatic test equipment