NXP USA Inc. HEF40240BP,652

HEF40240BP,652 Overview
Surface Mount technology has become the go-to method for electronic component placement due to its compact size and efficient production process. In this method, components are mounted directly onto the surface of a printed circuit board, eliminating the need for holes or leads. One important aspect to consider when using Surface Mount technology is the Moisture Sensitivity Level (MSL). With a MSL of 1 (Unlimited), these components can withstand unlimited exposure to moisture without any damage. The Voltage - Supply for these components ranges from 3V to 15V, making them suitable for a variety of applications. The Peak Reflow Temperature (Cel) for these components is 260, ensuring their durability during the soldering process. With 2 functions, these components offer versatility and efficiency. The Reflow Temperature-Max (s) is 30, providing sufficient time for the components to reach their required temperature during the reflow process. The Current - Output High and Low for these components is 62mA and 45mA respectively, making them suitable for low power applications. The Logic Type is Buffer, Inverting, offering both buffering and inverting capabilities. With a Propagation Delay (tpd) of 190 ns, these components provide fast and accurate signal transmission. Furthermore, these components are also RoHS3 Compliant, ensuring their compliance with environmental regulations. In conclusion, Surface Mount technology offers compact and versatile components that are suitable for a wide range of applications.

HEF40240BP,652 Features
Bus Driver/Transceivers

HEF40240BP,652 Applications
There are a lot of NXP USA Inc. HEF40240BP,652 Buffers & Transceivers applications.

WDM transmission
Wireless access points
Wireless smart house
Fiber-to-the-desktop
Wireless projection application for conferences and business talks
Gigabit Ethernet
Automation systems
Clock radio
interconnection between computers
Satellite ground stations