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Altera EP3C10F256C6N

Part Number:

EP3C10F256C6N

Manufacturer:

Altera

Ventron No:

4542015-EP3C10F256C6N

Description:

IC FPGA 182 I/O 256FBGA

Datasheet:

EP3C10F256C6N

Quantity:

- +
Total Price: $73.65

Payment:

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Delivery:

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Unit Price

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  • 1

    $73.6452

    $73.65

  • 200

    $28.5002

    $5700.04

  • 500

    $27.4985

    $13749.25

  • 1000

    $27.0046

    $27004.60

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    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

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    Same Day Delivery

Part Pictures

  • EP3C10F256C6N Detail Images
  • EP3C10F256C6N Detail Images

Specifications

Altera EP3C10F256C6N technical specifications, attributes, parameters and parts with similar specifications to Altera EP3C10F256C6N.

  • Factory Lead Time
    8 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    256-LBGA
  • Surface Mount
    YES
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~85°C TJ
  • Packaging
    Tray
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    Cyclone® III
  • JESD-609 Code
    e1
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    1.15V~1.25V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    EP3C10
  • JESD-30 Code
    R-PBGA-B256
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    182
  • Qualification Status
    Not Qualified
  • Number of I/O
    182
  • Clock Frequency

    Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

    472.5MHz
  • Number of Inputs

    The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.

    182
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    10320
  • Total RAM Bits

    Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

    423936
  • Number of LABs/CLBs

    Number of Labs/Clbs (Number of Laboratories/Clubs) is a parameter that specifies the number of laboratories or clubs that are associated with a particular electronic component. This parameter is typically used to indicate the level of support that is available for the component, as well as the number of people who are familiar with its use. A higher number of labs/clubs indicates that the component is more widely used and supported, which can be beneficial for users who need assistance with its implementation or troubleshooting.

    645
  • Height Seated (Max)
    1.55mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    17mm
  • Width
    17mm
  • RoHS Status
    RoHS Compliant

Description

EP3C10F256C6N Overview
We are pleased to announce that our product is currently in an active status, ensuring its availability for purchase. With a Moisture Sensitivity Level (MSL) of 3 (168 Hours), our product can withstand moderate levels of moisture for up to 168 hours. The Voltage-Supply ranges from 1.15V to 1.25V, providing a stable and reliable power source. The Terminal Form is BALL, allowing for easy and secure connections. Our product can withstand a Peak Reflow Temperature of 260 degrees Celsius. It has a total of 182 I/O for versatile functionality. With a Clock Frequency of 472.5MHz, our product offers high-speed performance. It is a FIELD PROGRAMMABLE GATE ARRAY, with 10320 Logic Elements/Cells and 645 LABs/CLBs, providing ample space for customization and flexibility in design.

EP3C10F256C6N Features
182 I/Os
Up to 423936 RAM bits

EP3C10F256C6N Applications
There are a lot of Intel EP3C10F256C6N FPGAs applications.

Video & Image Processing
DO-254
Data Center
ASIC prototyping
Voice recognition
Medical ultrasounds
Solar Energy
Digital signal processing
Aerospace and Defense
Automotive Applications
EP3C10F256C6N More Descriptions
Field Programmable Gate Array, 10320 CLBs, 472.5MHz, 10320-Cell, CMOS, PBGA256
FPGA Cyclone® III Family 10320 Cells 500MHz 65nm Technology 1.2V 256-Pin FBGA
10320 645 BGA-256 Programmable Logic Device (CPLDs/FPGAs) ROHS
Lead Free CMOS OTHER 2007 FPGA 85C 51.8kB 500MHz 1.25V
IC FPGA 182 I/O 256FBGA Cyclone III
IC MCU 32BIT 128KB FLASH 64LQFP
Product Description Demo for Development.
EP3C10F256C6N Detail Images

Product Comparison

The three parts on the right have similar specifications to EP3C10F256C6N.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Number of I/O
    Clock Frequency
    Number of Inputs
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Power Supplies
    View Compare
  • EP3C10F256C6N
    EP3C10F256C6N
    8 Weeks
    Surface Mount
    256-LBGA
    YES
    0°C~85°C TJ
    Tray
    Cyclone® III
    e1
    Active
    3 (168 Hours)
    256
    EAR99
    TIN SILVER COPPER
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    BOTTOM
    BALL
    260
    1.2V
    1mm
    40
    EP3C10
    R-PBGA-B256
    182
    Not Qualified
    182
    472.5MHz
    182
    FIELD PROGRAMMABLE GATE ARRAY
    10320
    423936
    645
    1.55mm
    17mm
    17mm
    RoHS Compliant
    -
    -
  • EP3C10M164C7N
    8 Weeks
    Surface Mount
    164-TFBGA
    YES
    0°C~85°C TJ
    Tray
    Cyclone® III
    -
    Active
    3 (168 Hours)
    164
    EAR99
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    BOTTOM
    BALL
    -
    2.5V
    0.5mm
    -
    EP3C10
    S-PBGA-B164
    106
    Not Qualified
    106
    -
    106
    FIELD PROGRAMMABLE GATE ARRAY
    10320
    423936
    645
    -
    -
    -
    RoHS Compliant
    1.2/3.3V
  • EP3C10U256C8
    8 Weeks
    Surface Mount
    256-LFBGA
    YES
    0°C~85°C TJ
    Tray
    Cyclone® III
    e0
    Active
    3 (168 Hours)
    256
    EAR99
    TIN LEAD
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    BOTTOM
    BALL
    235
    1.2V
    0.8mm
    30
    EP3C10
    S-PBGA-B256
    182
    Not Qualified
    182
    472.5MHz
    182
    FIELD PROGRAMMABLE GATE ARRAY
    10320
    423936
    645
    1.5mm
    14mm
    14mm
    Non-RoHS Compliant
    -
  • EP3C120F484C8
    8 Weeks
    Surface Mount
    484-BGA
    YES
    0°C~85°C TJ
    Tray
    Cyclone® III
    e0
    Active
    3 (168 Hours)
    484
    3A001.A.7.A
    TIN LEAD
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    BOTTOM
    BALL
    220
    1.2V
    1mm
    30
    EP3C120
    S-PBGA-B484
    283
    Not Qualified
    283
    472.5MHz
    283
    FIELD PROGRAMMABLE GATE ARRAY
    119088
    3981312
    7443
    2.4mm
    23mm
    23mm
    Non-RoHS Compliant
    -

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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