Cypress Semiconductor Corp CY7C2165KV18-550BZC
- Part Number:
- CY7C2165KV18-550BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3229076-CY7C2165KV18-550BZC
- Description:
- IC SRAM 18MBIT 550MHZ 165FBGA
- Datasheet:
- CY7C2165KV18-550BZC
Cypress Semiconductor Corp CY7C2165KV18-550BZC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CY7C2165KV18-550BZC.
- Factory Lead Time13 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case165-LBGA
- Number of Pins165
- Operating Temperature0°C~70°C TA
- PackagingTray
- Published2003
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations165
- Terminal FinishTin/Lead (Sn/Pb)
- Additional FeaturePIPELINED ARCHITECTURE
- TechnologySRAM - Synchronous, QDR II
- Voltage - Supply1.7V~1.9V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)235
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)20
- Base Part NumberCY7C2165
- Pin Count165
- Operating Supply Voltage1.8V
- Supply Voltage-Max (Vsup)1.9V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size18Mb 512K x 36
- Number of Ports2
- Nominal Supply Current1.1A
- Memory TypeVolatile
- Clock Frequency550MHz
- Access Time450 ps
- Memory FormatSRAM
- Memory InterfaceParallel
- Output Characteristics3-STATE
- Memory Width36
- Address Bus Width17b
- Density18 Mb
- Standby Current-Max0.34A
- I/O TypeSEPARATE
- Sync/AsyncSynchronous
- Word Size36b
- Standby Voltage-Min1.7V
- Height Seated (Max)1.4mm
- Length15mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
CY7C2165KV18-550BZC Overview
The operating temperature for this particular component is between 0°C and 70°C, making it suitable for use in a wide range of environments. It is packaged in a tray, which allows for safe and organized storage and transport. The JESD-609 code for this component is e0, indicating its compliance with industry standards. It features a total of 165 terminations, ensuring a secure connection for optimal performance. The terminal finish is comprised of tin and lead (Sn/Pb), which provides durability and stability. This component can withstand a peak reflow temperature of 235°C, making it suitable for high-temperature applications. With a pin count of 165, it has a sufficient number of connection points. It is designed for use in parallel memory interfaces and has an address bus width of 17b. The maximum seated height for this component is 1.4mm, making it compact and space-efficient. Overall, this component offers reliable performance in a variety of settings.
CY7C2165KV18-550BZC Features
Package / Case: 165-LBGA
165 Pins
Operating Supply Voltage:1.8V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: SEPARATE
CY7C2165KV18-550BZC Applications
There are a lot of Cypress Semiconductor Corp
CY7C2165KV18-550BZC Memory applications.
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
The operating temperature for this particular component is between 0°C and 70°C, making it suitable for use in a wide range of environments. It is packaged in a tray, which allows for safe and organized storage and transport. The JESD-609 code for this component is e0, indicating its compliance with industry standards. It features a total of 165 terminations, ensuring a secure connection for optimal performance. The terminal finish is comprised of tin and lead (Sn/Pb), which provides durability and stability. This component can withstand a peak reflow temperature of 235°C, making it suitable for high-temperature applications. With a pin count of 165, it has a sufficient number of connection points. It is designed for use in parallel memory interfaces and has an address bus width of 17b. The maximum seated height for this component is 1.4mm, making it compact and space-efficient. Overall, this component offers reliable performance in a variety of settings.
CY7C2165KV18-550BZC Features
Package / Case: 165-LBGA
165 Pins
Operating Supply Voltage:1.8V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: SEPARATE
CY7C2165KV18-550BZC Applications
There are a lot of Cypress Semiconductor Corp
CY7C2165KV18-550BZC Memory applications.
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
CY7C2165KV18-550BZC More Descriptions
Synchronous SRAM, QDR-II , ODT, 18432 Kb Density, 550 MHz Frequency, BGA-165Cypress Semiconductor SCT
SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray
Synchronous Active 3-STATE 2003 SRAM Memory 0C~70C TA 1.7V 18Mb 1.1A
SRAM 18MB (512Kx36) 1.8v 550MHz QDR II SRAM
IC SRAM 18MBIT PARALLEL 165FBGA
Product Description Demo for Development.
QDR SRAM, 512KX36, 0.45NS, CMOS,
SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray
Synchronous Active 3-STATE 2003 SRAM Memory 0C~70C TA 1.7V 18Mb 1.1A
SRAM 18MB (512Kx36) 1.8v 550MHz QDR II SRAM
IC SRAM 18MBIT PARALLEL 165FBGA
Product Description Demo for Development.
QDR SRAM, 512KX36, 0.45NS, CMOS,
The three parts on the right have similar specifications to CY7C2165KV18-550BZC.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeNumber of PortsNominal Supply CurrentMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceOutput CharacteristicsMemory WidthAddress Bus WidthDensityStandby Current-MaxI/O TypeSync/AsyncWord SizeStandby Voltage-MinHeight Seated (Max)LengthRadiation HardeningRoHS StatusOrganizationLead FreeECCN CodeReach Compliance CodeFrequencyQualification StatusPower SuppliesWrite Cycle Time - Word, PageAccess Time (Max)Output EnableSurface MountPbfree CodeJESD-30 CodeMemory DensityWidthView Compare
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CY7C2165KV18-550BZC13 WeeksSurface MountSurface Mount165-LBGA1650°C~70°C TATray2003e0Active3 (168 Hours)165Tin/Lead (Sn/Pb)PIPELINED ARCHITECTURESRAM - Synchronous, QDR II1.7V~1.9VBOTTOM23511.8V1mm20CY7C21651651.8V1.9V1.7V18Mb 512K x 3621.1AVolatile550MHz450 psSRAMParallel3-STATE3617b18 Mb0.34ASEPARATESynchronous36b1.7V1.4mm15mmNoNon-RoHS Compliant----------------
-
-Surface MountSurface Mount172-LFBGA1720°C~70°C TATray2003e1Obsolete3 (168 Hours)172Tin/Silver/Copper (Sn/Ag/Cu)PIPELINED ARCHITECTURESRAM - Dual Port, Synchronous3.135V~3.465VBOTTOM26013.3V1mm40CY7C08511723.3V3.465V3.135V2Mb 64K x 362300mAVolatile167MHz4 nsSRAMParallel3-STATE3632b2 Mb0.075ACOMMONSynchronous36b3.14V-15mmNoROHS3 Compliant64KX36Lead Free-------------
-
-Surface MountSurface Mount100-LQFP1000°C~70°C TATray2001e0Obsolete3 (168 Hours)100TIN LEADINTERRUPT FLAGSRAM - Dual Port, Asynchronous4.5V~5.5VQUAD24015V0.5mm30CY7C02511005V--144Kb 8K x 182300mAVolatile--SRAMParallel3-STATE1813b144 kb0.015ACOMMONAsynchronous18b2V1.6mm14mm-Non-RoHS Compliant8KX18Contains LeadEAR99not_compliant15GHzNot Qualified5V15ns15 nsYES-----
-
--Surface Mount100-LQFP--40°C~85°C TATray-e3/e4Obsolete3 (168 Hours)100MATTE TIN/NICKEL PALLADIUM GOLD-SRAM - Dual Port, Asynchronous4.5V~5.5VQUAD26015V0.5mm20-100-5.5V4.5V64Kb 4K x 16--Volatile--SRAMParallel-16-------1.6mm14mm-ROHS3 Compliant4KX16--unknown-COMMERCIAL-25ns25 ns-YESyesS-PQFP-G10065536 bit14mm
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