CY7C1312CV18-200BZC

Cypress Semiconductor Corp CY7C1312CV18-200BZC

Part Number:
CY7C1312CV18-200BZC
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
3252317-CY7C1312CV18-200BZC
Description:
IC SRAM 18MBIT 200MHZ 165FBGA
ECAD Model:
Datasheet:
CY7C1312/14CV18

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Comments
Specifications
Cypress Semiconductor Corp CY7C1312CV18-200BZC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CY7C1312CV18-200BZC.
  • Mounting Type
    Surface Mount
  • Package / Case
    165-LBGA
  • Surface Mount
    YES
  • Number of Pins
    165
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tray
  • Published
    2003
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    165
  • ECCN Code
    3A991.B.2.A
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Additional Feature
    PIPELINED ARCHITECTURE
  • HTS Code
    8542.32.00.41
  • Technology
    SRAM - Synchronous, QDR II
  • Voltage - Supply
    1.7V~1.9V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    220
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    CY7C1312
  • Pin Count
    165
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.8V
  • Supply Voltage-Max (Vsup)
    1.9V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Memory Size
    18Mb 1M x 18
  • Memory Type
    Volatile
  • Clock Frequency
    200MHz
  • Supply Current-Max
    0.675mA
  • Access Time
    450 ps
  • Memory Format
    SRAM
  • Memory Interface
    Parallel
  • Organization
    1MX18
  • Output Characteristics
    3-STATE
  • Memory Width
    18
  • Density
    18 Mb
  • Standby Current-Max
    0.38A
  • I/O Type
    SEPARATE
  • Standby Voltage-Min
    1.7V
  • Height Seated (Max)
    1.4mm
  • Length
    15mm
  • Width
    13mm
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Contains Lead
Description
CY7C1312CV18-200BZC Overview
In 2003, a new additional feature was published for a specific product. This feature is known as PIPELINED ARCHITECTURE and it has proven to be a significant improvement in the overall functionality of the product. The terminal position for this feature is located at the bottom, making it easily accessible for users. The peak reflow temperature for this product is 220 degrees Celsius, ensuring that it can withstand high temperatures without any damage. However, it is important to note that this product is not compliant with Reach Compliance Code. It has a pin count of 165, and a memory size of 18Mb 1M x 18, making it suitable for storing large amounts of data. The memory type is volatile, meaning it can be quickly accessed and modified. The standby voltage-min for this product is 1.7V, ensuring low power consumption. Lastly, the length of this product is 15mm, making it compact and easy to transport.

CY7C1312CV18-200BZC Features
Package / Case: 165-LBGA
165 Pins
Operating Supply Voltage:1.8V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: SEPARATE


CY7C1312CV18-200BZC Applications
There are a lot of Cypress Semiconductor Corp
CY7C1312CV18-200BZC Memory applications.


Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
CY7C1312CV18-200BZC More Descriptions
Obsolete 3-STATE 2003 BOTTOM SRAM Memory 0C~70C TA 1.7V 18Mb 0.38A
SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA
IC SRAM 18MBIT PARALLEL 165FBGA
Product Comparison
The three parts on the right have similar specifications to CY7C1312CV18-200BZC.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Qualification Status
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Clock Frequency
    Supply Current-Max
    Access Time
    Memory Format
    Memory Interface
    Organization
    Output Characteristics
    Memory Width
    Density
    Standby Current-Max
    I/O Type
    Standby Voltage-Min
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Lead Free
    Mount
    Number of Ports
    Nominal Supply Current
    Address Bus Width
    Sync/Async
    Word Size
    Radiation Hardening
    Power Supplies
    Write Cycle Time - Word, Page
    Access Time (Max)
    JESD-30 Code
    Memory Density
    View Compare
  • CY7C1312CV18-200BZC
    CY7C1312CV18-200BZC
    Surface Mount
    165-LBGA
    YES
    165
    0°C~70°C TA
    Tray
    2003
    e0
    Obsolete
    3 (168 Hours)
    165
    3A991.B.2.A
    Tin/Lead (Sn/Pb)
    PIPELINED ARCHITECTURE
    8542.32.00.41
    SRAM - Synchronous, QDR II
    1.7V~1.9V
    BOTTOM
    220
    1
    1.8V
    1mm
    not_compliant
    NOT SPECIFIED
    CY7C1312
    165
    Not Qualified
    1.8V
    1.9V
    1.7V
    18Mb 1M x 18
    Volatile
    200MHz
    0.675mA
    450 ps
    SRAM
    Parallel
    1MX18
    3-STATE
    18
    18 Mb
    0.38A
    SEPARATE
    1.7V
    1.4mm
    15mm
    13mm
    Non-RoHS Compliant
    Contains Lead
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • CY7C0851AV-167BBXC
    Surface Mount
    172-LFBGA
    -
    172
    0°C~70°C TA
    Tray
    2003
    e1
    Obsolete
    3 (168 Hours)
    172
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    PIPELINED ARCHITECTURE
    -
    SRAM - Dual Port, Synchronous
    3.135V~3.465V
    BOTTOM
    260
    1
    3.3V
    1mm
    -
    40
    CY7C0851
    172
    -
    3.3V
    3.465V
    3.135V
    2Mb 64K x 36
    Volatile
    167MHz
    -
    4 ns
    SRAM
    Parallel
    64KX36
    3-STATE
    36
    2 Mb
    0.075A
    COMMON
    3.14V
    -
    15mm
    -
    ROHS3 Compliant
    Lead Free
    Surface Mount
    2
    300mA
    32b
    Synchronous
    36b
    No
    -
    -
    -
    -
    -
  • CY7C0241-55AXI
    Surface Mount
    100-LQFP
    -
    100
    -40°C~85°C TA
    Tray
    2004
    e3
    Obsolete
    3 (168 Hours)
    100
    EAR99
    Matte Tin (Sn)
    -
    -
    SRAM - Dual Port, Asynchronous
    4.5V~5.5V
    QUAD
    260
    1
    5V
    0.5mm
    unknown
    20
    CY7C0241
    100
    Not Qualified
    5V
    -
    -
    72Kb 4K x 18
    Volatile
    -
    -
    -
    SRAM
    Parallel
    4KX18
    3-STATE
    18
    72 kb
    0.015A
    COMMON
    -
    1.6mm
    14mm
    -
    ROHS3 Compliant
    -
    Surface Mount
    2
    260mA
    24b
    Asynchronous
    18b
    -
    5V
    55ns
    55 ns
    -
    -
  • CY7C038V-15AXC
    Surface Mount
    100-LQFP
    YES
    -
    0°C~70°C TA
    Tray
    2004
    e3
    Obsolete
    3 (168 Hours)
    100
    3A991.B.2.A
    Matte Tin (Sn)
    -
    8542.32.00.41
    SRAM - Dual Port, Asynchronous
    3V~3.6V
    QUAD
    260
    1
    3.3V
    0.5mm
    unknown
    20
    CY7C038
    100
    Not Qualified
    -
    3.6V
    3V
    1.152Mb 64K x 18
    Volatile
    -
    0.185mA
    -
    SRAM
    Parallel
    64KX18
    3-STATE
    18
    -
    0.00005A
    COMMON
    2V
    1.6mm
    14mm
    14mm
    ROHS3 Compliant
    Lead Free
    -
    2
    -
    -
    -
    -
    -
    3.3V
    15ns
    15 ns
    S-PQFP-G100
    1179648 bit
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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