CY2DP1504ZXI
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Cypress Semiconductor Corp CY2DP1504ZXI

Part Number:
CY2DP1504ZXI
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
2974589-CY2DP1504ZXI
Description:
IC CLK BUFFER 2:4 1.5GHZ 20TSSOP
ECAD Model:
Datasheet:
CY2DP1504ZXI
Payment:
Payment
Delivery:
Delivery

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Reference Price ( In US Dollars )

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Qty

Unit Price

Ext Price

  • 1

    $6.5008

    $6.50

  • 200

    $2.5162

    $503.24

  • 500

    $2.4280

    $1214.00

  • 1000

    $2.3846

    $2384.60

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Quantity
Comments
Part Overview
Description
Ultralow noise, lowskew, lowpropagation delay 1:4 LVPECL fanout buffer
Selectable between two LVPECL input clock pairs
Synchronous clock enable function for glitchfree output transitions
Fully differential internal architecture for low additive jitter and skew
Operating frequencies up to 1.5 GHz

Features
30 ps maximum outputtooutput skew
480 ps maximum propagation delay
0.15 ps maximum additive RMS phase jitter at 156.25 MHz (12 kHz to 20 MHz offset)
2.5 V or 3.3 V operating voltage
Commercial and industrial operating temperature range
20pin thin shrunk small outline package (TSSOP)

Applications
Highspeed clock distribution
Specifications
Cypress Semiconductor Corp CY2DP1504ZXI technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CY2DP1504ZXI.
  • Factory Lead Time
    15 Weeks
  • Contact Plating
    Tin
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    20-TSSOP (0.173, 4.40mm Width)
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    20
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tube
  • Published
    2002
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Number of Terminations
    20
  • ECCN Code
    EAR99
  • Subcategory
    Clock Drivers
  • Voltage - Supply
    2.375V~3.465V
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    2.5V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    CY2DP1504
  • Pin Count
    20
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    4
  • Supply Voltage-Max (Vsup)
    2.625V
  • Power Supplies
    2.53.3V
  • Supply Voltage-Min (Vsup)
    2.375V
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Propagation Delay
    480 ps
  • Frequency (Max)
    1.5GHz
  • Family
    2DL
  • Input
    LVPECL
  • Ratio - Input:Output
    2:4
  • Differential - Input:Output
    Yes/Yes
  • Same Edge Skew-Max (tskwd)
    0.03 ns
  • Duty Cycle

    Duty cycle is a parameter that describes the proportion of time that a signal is active in relation to its period. It is typically expressed as a percentage, with a duty cycle of 50% indicating that the signal is active for half of its period. Duty cycle is an important parameter in many electronic applications, such as power supplies, motor controllers, and audio amplifiers. By adjusting the duty cycle, it is possible to control the output power, speed, or volume of a device.

    52 %
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    6.5mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Product Comparison
The three parts on the right have similar specifications to CY2DP1504ZXI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Subcategory
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Number of Outputs
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of Circuits
    Propagation Delay
    Frequency (Max)
    Family
    Input
    Ratio - Input:Output
    Differential - Input:Output
    Same Edge Skew-Max (tskwd)
    Duty Cycle
    Length
    Radiation Hardening
    RoHS Status
    Lead Free
    Terminal Finish
    Technology
    Qualification Status
    Width
    Mount
    Output
    Operating Supply Voltage
    Propagation Delay (tpd)
    Additional Feature
    Quiescent Current
    Max Duty Cycle
    View Compare
  • CY2DP1504ZXI
    CY2DP1504ZXI
    15 Weeks
    Tin
    Surface Mount
    20-TSSOP (0.173, 4.40mm Width)
    YES
    20
    -40°C~85°C
    Tube
    2002
    e3
    Obsolete
    3 (168 Hours)
    20
    EAR99
    Clock Drivers
    2.375V~3.465V
    DUAL
    GULL WING
    260
    1
    2.5V
    0.65mm
    30
    CY2DP1504
    20
    4
    2.625V
    2.53.3V
    2.375V
    1
    480 ps
    1.5GHz
    2DL
    LVPECL
    2:4
    Yes/Yes
    0.03 ns
    52 %
    6.5mm
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • CY2DP1510AXIT
    7 Weeks
    -
    Surface Mount
    32-TQFP Exposed Pad
    YES
    32
    -40°C~85°C
    Tape & Reel (TR)
    2002
    e3
    Obsolete
    3 (168 Hours)
    32
    EAR99
    Clock Drivers
    2.375V~3.465V
    QUAD
    GULL WING
    260
    1
    2.5V
    0.8mm
    30
    -
    32
    10
    2.625V
    2.53.3V
    2.375V
    1
    600 ps
    1.5GHz
    2DL
    LVPECL
    2:10
    Yes/Yes
    0.04 ns
    52 %
    7mm
    -
    ROHS3 Compliant
    Lead Free
    Matte Tin (Sn)
    CMOS
    Not Qualified
    7mm
    -
    -
    -
    -
    -
    -
    -
  • CY2DP818ZXI-2
    -
    -
    Surface Mount
    38-TFSOP (0.173, 4.40mm Width)
    -
    38
    -40°C~85°C
    Tube
    2003
    -
    Obsolete
    3 (168 Hours)
    38
    -
    -
    3.135V~3.465V
    DUAL
    GULL WING
    -
    1
    3.3V
    0.5mm
    -
    CY2DP818
    38
    -
    3.465V
    -
    -
    1
    -
    350MHz
    2DP
    LVDS, LVPECL, LVTTL
    1:8
    Yes/Yes
    0.2 ns
    -
    9.7mm
    -
    ROHS3 Compliant
    -
    -
    CMOS
    Not Qualified
    4.4mm
    Surface Mount
    LVPECL
    3.3V
    5 ns
    -
    -
    -
  • CY2DL15110AZIT
    15 Weeks
    -
    Surface Mount
    32-TQFP
    YES
    32
    -40°C~85°C
    Tape & Reel (TR)
    2011
    -
    Obsolete
    3 (168 Hours)
    32
    EAR99
    Clock Drivers
    2.375V~3.465V
    QUAD
    GULL WING
    NOT SPECIFIED
    1
    2.5V
    0.8mm
    NOT SPECIFIED
    -
    -
    10
    2.625V
    2.5/3.3V
    2.375V
    1
    -
    1.5GHz
    2DL
    LVDS
    2:10
    Yes/Yes
    0.04 ns
    -
    7mm
    -
    ROHS3 Compliant
    Lead Free
    -
    -
    Not Qualified
    7mm
    -
    -
    -
    0.6 ns
    CAN ALSO OPERATE AT 3.3V NOMINAL VOLTAGE
    125mA
    55 %
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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