IDT, Integrated Device Technology Inc 72265LA10PFG

72265LA10PFG Overview
Contact plating refers to the thin layer of tin that is applied to the contact points of a component. In this case, the mount is surface mount, meaning that the component is designed to be mounted directly onto a surface rather than inserted into a socket. The package or case of this component is LQFP, which stands for Low Profile Quad Flat Package. This indicates that the component has a square shape and a low profile, making it suitable for use in compact electronic devices. The part status is active, meaning that the component is currently in production and readily available for purchase. The maximum operating temperature for this component is 70°C, while the minimum operating temperature is 0°C. It operates at a supply voltage of 5V and has a dual element configuration. This means that it has two separate elements within the component. The access time for this component is 8 ns, which is the time it takes for data to be accessed from the component. Additionally, this component has retransmit capability, meaning that it is capable of resending data if it is not received correctly the first time.

72265LA10PFG Features
Frequency at most

72265LA10PFG Applications
There are a lot of Integrated Device Technology (IDT) 72265LA10PFG FIFOs Memory applications.

SPI Bus Flash Memory Device
Data
Extended product-change notification
Test Equipment
Buses
Magnetic memories
Programmable Logic Controller
High-speed graphics pixel buffer
Switches
IP Camera Buffer