IDT, Integrated Device Technology Inc 7204L25TPI
- Part Number:
- 7204L25TPI
- Manufacturer:
- IDT, Integrated Device Technology Inc
- Ventron No:
- 3706434-7204L25TPI
- Description:
- IC FIFO ASYNCH 4KX9 25NS 28DIP
- Datasheet:
- IDT Suffixes
IDT, Integrated Device Technology Inc 7204L25TPI technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 7204L25TPI.
- Contact PlatingLead, Tin
- MountThrough Hole
- Package / CasePDIP
- Number of Pins28
- Weight4.190003g
- PackagingBulk
- Published2009
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)1
- Number of Terminations28
- ECCN CodeEAR99
- Terminal FinishTin/Lead (Sn85Pb15)
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- Additional FeatureRETRANSMIT
- SubcategoryFIFOs
- TechnologyCMOS
- Peak Reflow Temperature (Cel)245
- Number of Functions1
- Supply Voltage5V
- Pin Count28
- Operating Supply Voltage5V
- Power Supplies5V
- Temperature GradeINDUSTRIAL
- Number of Circuits2
- Max Supply Voltage5.5V
- Min Supply Voltage4.5V
- Element ConfigurationDual
- Nominal Supply Current120mA
- Max Supply Current120mA
- Frequency (Max)28.5MHz
- Access Time25 ns
- Data Bus Width9b
- DirectionBidirectional
- Organization4KX9
- Density36 kb
- Parallel/SerialPARALLEL
- Sync/AsyncAsynchronous
- Word Size9b
- Memory IC TypeOTHER FIFO
- Bus DirectionalUnidirectional
- Retransmit CapabilityYes
- FWFT SupportNo
- Output EnableNO
- Cycle Time35 ns
- Height Seated (Max)4.57mm
- Length34.3mm
- Width7.62mm
- Thickness3.3mm
- RoHS StatusRoHS Compliant
- Lead FreeContains Lead
7204L25TPI Overview
Contact plating is an essential process in the manufacturing of electronic components. The most commonly used materials for contact plating are lead and tin, which provide excellent conductivity and corrosion resistance. One such example is a memory IC type known as OTHER FIFO, which has a weight of 4.190003g and a data bus width of 9b. This IC also has an additional feature of retransmit, allowing for data to be sent multiple times if needed. The RoHS status of this IC is compliant, meaning it follows strict guidelines for the restriction of hazardous substances. Furthermore, it has a maximum supply current of 120mA and is classified as EAR99 under the Pbfree code, indicating that it does not contain any lead. Finally, the output enable for this IC is set to no, ensuring that data is not unintentionally transmitted. Overall, the combination of these features makes this IC a reliable and compliant option for electronic devices.
7204L25TPI Features
FIFOs category
Frequency at most
7204L25TPI Applications
There are a lot of Integrated Device Technology (IDT) 7204L25TPI FIFOs Memory applications.
Thermal Management for DDR3 Memory Modules
Emulators
Down-Hole Energy Drilling
One assembly
Network bridges
Controlled baseline
Product traceability
Firmware loaders
IP Radio
Communications
Contact plating is an essential process in the manufacturing of electronic components. The most commonly used materials for contact plating are lead and tin, which provide excellent conductivity and corrosion resistance. One such example is a memory IC type known as OTHER FIFO, which has a weight of 4.190003g and a data bus width of 9b. This IC also has an additional feature of retransmit, allowing for data to be sent multiple times if needed. The RoHS status of this IC is compliant, meaning it follows strict guidelines for the restriction of hazardous substances. Furthermore, it has a maximum supply current of 120mA and is classified as EAR99 under the Pbfree code, indicating that it does not contain any lead. Finally, the output enable for this IC is set to no, ensuring that data is not unintentionally transmitted. Overall, the combination of these features makes this IC a reliable and compliant option for electronic devices.
7204L25TPI Features
FIFOs category
Frequency at most
7204L25TPI Applications
There are a lot of Integrated Device Technology (IDT) 7204L25TPI FIFOs Memory applications.
Thermal Management for DDR3 Memory Modules
Emulators
Down-Hole Energy Drilling
One assembly
Network bridges
Controlled baseline
Product traceability
Firmware loaders
IP Radio
Communications
7204L25TPI More Descriptions
FIFO Mem Async Dual Depth/Width Uni-Dir 4K x 9 28-Pin PDIP
IC FIFO ASYNCH 4KX9 25NS 28DIP
4K x 9 AsyncFIFO, 5.0V
FIFO 4KX9 CMOS PARALLEL FIF
IC FIFO ASYNCH 4KX9 25NS 28DIP
4K x 9 AsyncFIFO, 5.0V
FIFO 4KX9 CMOS PARALLEL FIF
The three parts on the right have similar specifications to 7204L25TPI.
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ImagePart NumberManufacturerContact PlatingMountPackage / CaseNumber of PinsWeightPackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishMax Operating TemperatureMin Operating TemperatureAdditional FeatureSubcategoryTechnologyPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltagePin CountOperating Supply VoltagePower SuppliesTemperature GradeNumber of CircuitsMax Supply VoltageMin Supply VoltageElement ConfigurationNominal Supply CurrentMax Supply CurrentFrequency (Max)Access TimeData Bus WidthDirectionOrganizationDensityParallel/SerialSync/AsyncWord SizeMemory IC TypeBus DirectionalRetransmit CapabilityFWFT SupportOutput EnableCycle TimeHeight Seated (Max)LengthWidthThicknessRoHS StatusLead FreeFactory Lead TimeTerminal PositionTerminal FormTerminal PitchClock FrequencyStandby Current-MaxHTS CodeMemory SizeView Compare
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7204L25TPILead, TinThrough HolePDIP284.190003gBulk2009e0noDiscontinued128EAR99Tin/Lead (Sn85Pb15)85°C-40°CRETRANSMITFIFOsCMOS24515V285V5VINDUSTRIAL25.5V4.5VDual120mA120mA28.5MHz25 ns9bBidirectional4KX936 kbPARALLELAsynchronous9bOTHER FIFOUnidirectionalYesNoNO35 ns4.57mm34.3mm7.62mm3.3mmRoHS CompliantContains Lead---------
-
Lead, TinSurface MountPLCC32--2005e0noActive132EAR99Tin/Lead (Sn85Pb15)85°C-40°CRETRANSMITFIFOsCMOS22515V325V5VINDUSTRIAL-5.5V4.5VDual120mA120mA-15 ns--4KX936 kbPARALLELAsynchronous9bOTHER FIFOUnidirectionalYesNoNO25 ns3.556mm13.97mm11.43mm2.79mmRoHS CompliantContains Lead7 WeeksQUADJ BEND1.27mm40MHz0.012A--
-
Lead, TinThrough HolePDIP284.190003gBulk2009e0noDiscontinued128EAR99Tin/Lead (Sn85Pb15)70°C0°CRETRANSMITFIFOsCMOS24515V285V5VCOMMERCIAL-5.5V4.5VDual120mA120mA-20 ns--4KX936 kbPARALLELAsynchronous9bOTHER FIFOUnidirectionalYesNoNO30 ns4.572mm34.3mm7.62mm3.3mmRoHS CompliantContains Lead---2.54mm33.3MHz0.002A8542.32.00.71-
-
TinSurface MountSOIC28--2009e3yesActive3---70°C0°C------285V--15.5V4.5VDual120mA120mA50MHz12 ns9b--36 kb-Asynchronous9b-UnidirectionalYesNo---17.9mm8.4mm2.62mmRoHS CompliantLead Free7 Weeks------4.5kB
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