IDT, Integrated Device Technology Inc 70V7519S133BC8

70V7519S133BC8 Overview
The mounting type for this particular device is surface mount, meaning that it can be easily mounted onto a surface using soldering techniques. The supplier device package is 256-CABGA (17x17), which refers to the type of package that the device comes in. In this case, it is a ceramic ball grid array with 256 pins arranged in a 17x17 grid. The packaging for this device is tape and reel (TR), which is a common method for storing and transporting electronic components. The moisture sensitivity level (MSL) for this device is 4, indicating that it can withstand up to 72 hours of exposure to moisture without any adverse effects. This device utilizes SRAM technology, specifically dual port and synchronous, making it ideal for high-speed data transfer. With a memory size of 9Mb (256K x 36), this device offers a large storage capacity. It is a volatile memory, meaning that it requires power to retain data. The access time for this device is 4.2ns, making it a fast and efficient option. The memory format is SRAM, and the memory interface is parallel, allowing for easy communication with other components.

70V7519S133BC8 Features
Package / Case: 256-LBGA


70V7519S133BC8 Applications
There are a lot of Renesas Electronics America Inc.
70V7519S133BC8 Memory applications.


telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)