IDT, Integrated Device Technology Inc 70V7339S166BCI8

70V7339S166BCI8 Overview
The mounting type for this device is surface mount, meaning it can be easily attached to a surface without the need for any additional hardware. The package or case for this device is a 256-LBGA, which stands for a 256-lead ball grid array. The supplier device package is a 256-CABGA (17x17), indicating that it has 256 leads and is in a chip array ball grid array package with a size of 17x17. The operating temperature range for this device is -40°C to 85°C, making it suitable for a wide range of environments. It is packaged in tape and reel (TR) format, allowing for easy handling and storage. This device is currently active and its memory type is volatile, meaning it requires a constant power supply to retain data. With an access time of 3.6ns, this device offers fast data retrieval. It is formatted as a static random access memory (SRAM) and has a parallel memory interface.

70V7339S166BCI8 Features
Package / Case: 256-LBGA


70V7339S166BCI8 Applications
There are a lot of Renesas Electronics America Inc.
70V7339S166BCI8 Memory applications.


personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic