Part Number: XC7Z035-2FFV676E vs XC7Z100-L2FFG900I

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Part Number: XC7Z035-2FFV676E XC7Z100-L2FFG900I
Manufacturer: Xilinx Inc. Xilinx Inc.
Description: IC FPGA IC SOC CORTEX-A9 KINTEX7 900BGA
Quantity Available: Available Available
Datasheets: - -
Factory Lead Time 11 Weeks 10 Weeks
Package / Case 676-BBGA, FCBGA 900-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27) -
Operating Temperature 0°C~100°C TJ -40°C~100°C TJ
Packaging Bulk Tray
Published 2010 2010
Series Zynq®-7000 Zynq®-7000
Part Status Active Active
Moisture Sensitivity Level (MSL) 4 (72 Hours) 4 (72 Hours)
Number of I/O 130 130
Speed 800MHz -
RAM Size 256KB 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA MCU, FPGA
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 444K Logic Cells
RoHS Status ROHS3 Compliant ROHS3 Compliant
Contact Plating - Copper, Silver, Tin
Mount - Surface Mount
Number of Pins - 900
JESD-609 Code - e1
Number of Terminations - 900
ECCN Code - 3A991.D
Terminal Finish - Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature - PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code - 8542.39.00.01
Technology - CMOS
Terminal Position - BOTTOM
Terminal Form - BALL
Peak Reflow Temperature (Cel) - 245
Supply Voltage - 1V
Terminal Pitch - 1mm
Frequency - 800MHz
Reflow Temperature-Max (s) - 30
Interface - CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage - 1.05V
Min Supply Voltage - 950mV
Propagation Delay - 120 ps
Turn On Delay Time - 120 ps
Core Architecture - ARM
Boundary Scan - YES
RAM (words) - 256000
Number of Registers - 554800
Bus Compatibility - CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) - 3.35mm
Length - 31mm
Width - 31mm
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