XC7Z100-1FFG1156I

Xilinx Inc. XC7Z100-1FFG1156I

Part Number:
XC7Z100-1FFG1156I
Manufacturer:
Xilinx Inc.
Ventron No:
3163005-XC7Z100-1FFG1156I
Description:
IC SOC CORTEX A-9 ZYNQ7 1156BGA
ECAD Model:
Datasheet:
XC7Z100-1FFG1156I

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Specifications
Xilinx Inc. XC7Z100-1FFG1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z100-1FFG1156I.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Frequency
    667MHz
  • Reflow Temperature-Max (s)
    30
  • JESD-30 Code
    S-PBGA-B1156
  • Supply Voltage-Max (Vsup)
    1.05V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    250
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -1
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 444K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    3.1mm
  • Length
    35mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The Embedded - System On Chip (SoC) chip, produced by Xilinx Inc., has a frequency of 667MHz and a maximum supply voltage of 1.05V. The contact plating options for this chip are copper, silver, and tin. Its package/case options include 1156-BBGA and FCBGA. The part status is active, and the terminal form is ball with a pitch of 1mm. The chip also has a variety of interfaces, including CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, and USART. It is also equipped with boundary scan capabilities and is compatible with CAN, Ethernet, I2C, SPI, UART, and USB buses.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z100-1FFG1156I System On Chip (SoC) applications.

Functional safety for critical applications in the aerospace
Cyber security for critical applications in the aerospace
Fitness
Industrial robot
CNC control
External USB hard disk/SSD
Central alarm system
Published Paper
Mobile market
Measurement testers
XC7Z100-1FFG1156I More Descriptions
MPU Zynq-7000 RISC 32-Bit 667MHz 1.5V/2V/2.5V 1156-Pin F-BGA
IC SOC CORTEX-A9 667MHZ 1156BGA
Processors - Application Specialized
CAP CER X8L 16V 1.0UF 10% 0.80MM
Product Comparison
The three parts on the right have similar specifications to XC7Z100-1FFG1156I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Frequency
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    RoHS Status
    Surface Mount
    Number of Pins
    Number of Terminations
    Base Part Number
    Operating Supply Voltage
    Memory Type
    Radiation Hardening
    Speed
    Additional Feature
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Turn On Delay Time
    Number of Registers
    Width
    View Compare
  • XC7Z100-1FFG1156I
    XC7Z100-1FFG1156I
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    1156-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    not_compliant
    667MHz
    30
    S-PBGA-B1156
    1.05V
    0.95V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    250
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -1
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.1mm
    35mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FBG676I
    10 Weeks
    Copper, Silver, Tin
    -
    676-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    -
    800MHz
    30
    -
    1.05V
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -2
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    ROHS3 Compliant
    YES
    676
    676
    XC7Z045
    1V
    ROMless
    No
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-3FFV676E
    10 Weeks
    -
    -
    676-BBGA, FCBGA
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    -
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    -
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    1GHz
    -
    -
    -
    -
    -
    -
    -
  • XC7Z100-L2FFG900I
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    -
    800MHz
    30
    -
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    -
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    ROHS3 Compliant
    -
    900
    900
    -
    -
    -
    -
    -
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    1.05V
    950mV
    120 ps
    120 ps
    554800
    31mm
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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