Xilinx Inc. XC7Z100-1FFG1156I
- Part Number:
- XC7Z100-1FFG1156I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3163005-XC7Z100-1FFG1156I
- Description:
- IC SOC CORTEX A-9 ZYNQ7 1156BGA
- Datasheet:
- XC7Z100-1FFG1156I
Xilinx Inc. XC7Z100-1FFG1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z100-1FFG1156I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- MountSurface Mount
- Package / Case1156-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Frequency667MHz
- Reflow Temperature-Max (s)30
- JESD-30 CodeS-PBGA-B1156
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O250
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-1
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 444K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.1mm
- Length35mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The Embedded - System On Chip (SoC) chip, produced by Xilinx Inc., has a frequency of 667MHz and a maximum supply voltage of 1.05V. The contact plating options for this chip are copper, silver, and tin. Its package/case options include 1156-BBGA and FCBGA. The part status is active, and the terminal form is ball with a pitch of 1mm. The chip also has a variety of interfaces, including CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, and USART. It is also equipped with boundary scan capabilities and is compatible with CAN, Ethernet, I2C, SPI, UART, and USB buses.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z100-1FFG1156I System On Chip (SoC) applications.
Functional safety for critical applications in the aerospace
Cyber security for critical applications in the aerospace
Fitness
Industrial robot
CNC control
External USB hard disk/SSD
Central alarm system
Published Paper
Mobile market
Measurement testers
The Embedded - System On Chip (SoC) chip, produced by Xilinx Inc., has a frequency of 667MHz and a maximum supply voltage of 1.05V. The contact plating options for this chip are copper, silver, and tin. Its package/case options include 1156-BBGA and FCBGA. The part status is active, and the terminal form is ball with a pitch of 1mm. The chip also has a variety of interfaces, including CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, and USART. It is also equipped with boundary scan capabilities and is compatible with CAN, Ethernet, I2C, SPI, UART, and USB buses.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z100-1FFG1156I System On Chip (SoC) applications.
Functional safety for critical applications in the aerospace
Cyber security for critical applications in the aerospace
Fitness
Industrial robot
CNC control
External USB hard disk/SSD
Central alarm system
Published Paper
Mobile market
Measurement testers
XC7Z100-1FFG1156I More Descriptions
MPU Zynq-7000 RISC 32-Bit 667MHz 1.5V/2V/2.5V 1156-Pin F-BGA
IC SOC CORTEX-A9 667MHZ 1156BGA
Processors - Application Specialized
CAP CER X8L 16V 1.0UF 10% 0.80MM
IC SOC CORTEX-A9 667MHZ 1156BGA
Processors - Application Specialized
CAP CER X8L 16V 1.0UF 10% 0.80MM
The three parts on the right have similar specifications to XC7Z100-1FFG1156I.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountPackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)ECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeFrequencyReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRoHS StatusSurface MountNumber of PinsNumber of TerminationsBase Part NumberOperating Supply VoltageMemory TypeRadiation HardeningSpeedAdditional FeatureMax Supply VoltageMin Supply VoltagePropagation DelayTurn On Delay TimeNumber of RegistersWidthView Compare
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XC7Z100-1FFG1156I10 WeeksCopper, Silver, TinSurface Mount1156-BBGA, FCBGA-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)3A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mmnot_compliant667MHz30S-PBGA-B11561.05V0.95VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB250256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-1256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.1mm35mmROHS3 Compliant----------------
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10 WeeksCopper, Silver, Tin-676-BBGA, FCBGA-40°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)3A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm-800MHz30-1.05V-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmROHS3 CompliantYES676676XC7Z0451VROMlessNo--------
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10 Weeks--676-BBGA, FCBGA0°C~100°C TJBulk2009Zynq®-7000-Active4 (72 Hours)----------------130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-----Kintex™-7 FPGA, 350K Logic Cells---ROHS3 Compliant-------1GHz-------
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10 WeeksCopper, Silver, TinSurface Mount900-BBGA, FCBGA-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)3A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm-800MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES-256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mmROHS3 Compliant-900900-----PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY1.05V950mV120 ps120 ps55480031mm
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