Xilinx Inc. XC7Z035-2FFV676E

Name: XC7Z035-2FFV676E
Brand: Xilinx Inc.
SKU: 3163408-XC7Z035-2FFV676E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z035-2FFV676E

Manufacturer:: Xilinx Inc.

Ventron No:: 3163408-XC7Z035-2FFV676E

Description:: IC FPGA

ECAD Model:

Datasheet:: XC7Z035-2FFV676E

Specifications

Xilinx Inc. XC7Z035-2FFV676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-2FFV676E.

Factory Lead Time
11 Weeks
Package / Case
676-BBGA, FCBGA
Supplier Device Package
676-FCBGA (27x27)
Operating Temperature
0°C~100°C TJ
Packaging
Bulk
Published
2010
Series
Zynq®-7000
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of I/O
130
Speed
800MHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Kintex™-7 FPGA, 275K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The supplier device package for this product is a 676-FCBGA (27x27), providing a compact and efficient design. With an operating temperature range of 0°C to 100°C TJ, this product can withstand a wide range of environmental conditions. The packaging for this product is bulk, making it suitable for mass production and cost-effective for customers. First published in 2010, this product has been on the market for over a decade and is still an active part in the industry. Its moisture sensitivity level (MSL) of 4 (72 hours) ensures its durability and reliability. With a speed of 800MHz, this product is high-performing and efficient. Its core processor is a dual ARM® Cortex®-A9 MPCore™ with CoreSight™, providing powerful processing capabilities. Its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it versatile and adaptable for various applications. This product's architecture is a combination of MCU and FPGA, making it a highly flexible and customizable solution for different needs.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XC7Z035-2FFV676E System On Chip (SoC) applications.

ARM
High-end PLC
Networked sensors
Networked Media Encode/Decode
Keywords
Robotics
Vending machines
Fitness
Central alarm system
Sensor network-on-chip (sNoC)

XC7Z035-2FFV676E More Descriptions

FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin
IC SOC CORTEX-A9 800MHZ 676FCBGA

Product Comparison

The three parts on the right have similar specifications to XC7Z035-2FFV676E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Contact Plating

Mount

JESD-609 Code

Number of Terminations

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

JESD-30 Code

Interface

Max Supply Voltage

Min Supply Voltage

Propagation Delay

Core Architecture

Boundary Scan

Speed Grade

RAM (words)

Number of Registers

Bus Compatibility

Height Seated (Max)

Length

Width

Number of Pins

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Turn On Delay Time

View Compare
XC7Z035-2FFV676E

Xilinx Inc.

11 Weeks

676-BBGA, FCBGA

676-FCBGA (27x27)

0°C~100°C TJ

Bulk

2010

Zynq®-7000

Active

4 (72 Hours)

130

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC7Z035-3FBG676E

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2010

Zynq®-7000

Active

3 (168 Hours)

130

-

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

ROHS3 Compliant

Copper, Silver, Tin

Surface Mount

e1

676

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

800MHz

NOT SPECIFIED

S-PBGA-B676

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

110 ps

ARM

YES

3

256000

343800

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

27mm

-

-

-

-

-

-

XC7Z035-2FFV676E vs XC7Z035-3FBG676E
XC7Z045-3FFV676E

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~100°C TJ

Bulk

2009

Zynq®-7000

Active

4 (72 Hours)

130

1GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

XC7Z035-2FFV676E vs XC7Z045-3FFV676E
XC7Z100-L2FFG900I

Xilinx Inc.

10 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2010

Zynq®-7000

Active

4 (72 Hours)

130

-

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 444K Logic Cells

ROHS3 Compliant

Copper, Silver, Tin

Surface Mount

e1

900

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

120 ps

ARM

YES

-

256000

554800

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

31mm

900

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

120 ps

XC7Z035-2FFV676E vs XC7Z100-L2FFG900I