| Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product! |
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| Part Number: |
XC7Z045-L2FFG900I |
XC7Z100-L2FFG900I |
| Manufacturer: |
Xilinx Inc. |
Xilinx Inc. |
| Description: |
IC SOC CORTEX-A9 KINTEX7 900BGA |
IC SOC CORTEX-A9 KINTEX7 900BGA |
| Quantity Available: |
Available |
Available |
| Datasheets: |
-
|
-
|
| Factory Lead Time |
10 Weeks |
10 Weeks |
| Package / Case |
900-BBGA, FCBGA |
900-BBGA, FCBGA |
| Surface Mount |
YES |
- |
| Operating Temperature |
-40°C~100°C TJ |
-40°C~100°C TJ |
| Packaging |
Tray |
Tray |
| Published |
2010 |
2010 |
| Series |
Zynq®-7000 |
Zynq®-7000 |
| JESD-609 Code |
e1 |
e1 |
| Part Status |
Active |
Active |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
4 (72 Hours) |
| Number of Terminations |
900 |
900 |
| ECCN Code |
3A991.D |
3A991.D |
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Additional Feature |
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| HTS Code |
8542.39.00.01 |
8542.39.00.01 |
| Technology |
CMOS |
CMOS |
| Terminal Position |
BOTTOM |
BOTTOM |
| Terminal Form |
BALL |
BALL |
| Peak Reflow Temperature (Cel) |
245 |
245 |
| Supply Voltage |
1V |
1V |
| Terminal Pitch |
1mm |
1mm |
| Frequency |
800MHz |
800MHz |
| Reflow Temperature-Max (s) |
30 |
30 |
| JESD-30 Code |
S-PBGA-B900 |
- |
| Supply Voltage-Max (Vsup) |
1.05V |
- |
| Supply Voltage-Min (Vsup) |
0.95V |
- |
| Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O |
130 |
130 |
| RAM Size |
256KB |
256KB |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals |
DMA |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
MCU, FPGA |
| Core Architecture |
ARM |
ARM |
| Boundary Scan |
YES |
YES |
| RAM (words) |
256000 |
256000 |
| Primary Attributes |
Kintex™-7 FPGA, 350K Logic Cells |
Kintex™-7 FPGA, 444K Logic Cells |
| Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) |
3.35mm |
3.35mm |
| Length |
31mm |
31mm |
| Width |
31mm |
31mm |
| RoHS Status |
ROHS3 Compliant |
ROHS3 Compliant |
| Contact Plating |
- |
Copper, Silver, Tin |
| Mount |
- |
Surface Mount |
| Number of Pins |
- |
900 |
| Max Supply Voltage |
- |
1.05V |
| Min Supply Voltage |
- |
950mV |
| Propagation Delay |
- |
120 ps |
| Turn On Delay Time |
- |
120 ps |
| Number of Registers |
- |
554800 |
| Submit RFQ: |
Submit |
Submit |
