Xilinx Inc. XC7Z045-L2FFG900I

Name: XC7Z045-L2FFG900I
Brand: Xilinx Inc.
SKU: 3162949-XC7Z045-L2FFG900I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z045-L2FFG900I

Manufacturer:: Xilinx Inc.

Ventron No:: 3162949-XC7Z045-L2FFG900I

Description:: IC SOC CORTEX-A9 KINTEX7 900BGA

ECAD Model:

Datasheet:: XC7Z045-L2FFG900I

Specifications

Xilinx Inc. XC7Z045-L2FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-L2FFG900I.

Factory Lead Time
10 Weeks
Package / Case
900-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2010
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
800MHz
Reflow Temperature-Max (s)
30
JESD-30 Code
S-PBGA-B900
Supply Voltage-Max (Vsup)
1.05V
Supply Voltage-Min (Vsup)
0.95V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Boundary Scan
YES
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
3.35mm
Length
31mm
Width
31mm
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This product features a Surface Mount design, making it easy to install and integrate into various electronic systems. It is packaged in a Tray for convenient handling and storage. With an ECCN Code of 3A991.D, this product is compliant with export regulations. The Terminal Finish is Tin/Silver/Copper (Sn/Ag/Cu), ensuring reliable and efficient connectivity. An additional feature of this product is its PL BLOCK, which operates within a range of 0.97V to 1.03V supply. The Terminal Position is located at the bottom for ease of use. It has a maximum reflow temperature of 30 seconds and a minimum supply voltage of 0.95V. With 130 I/Os, this product is suitable for use in both MCU and FPGA architectures.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z045-L2FFG900I System On Chip (SoC) applications.

Vending machines
Functional safety for critical applications in the aerospace
Keyboard
Print Special Issue Flyer
Automotive gateway
USB hard disk enclosure
Industrial robot
Cyber security for critical applications in the aerospace
CNC control
POS Terminals

XC7Z045-L2FFG900I More Descriptions

FPGA Zynq-7000 Family 350000 Cells 28nm Technology 1V 900-Pin FC-BGA
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900BGA
Product Description Demo for Development.
Processors - Application Specialized

Product Comparison

The three parts on the right have similar specifications to XC7Z045-L2FFG900I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Interface

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Boundary Scan

RAM (words)

Primary Attributes

Bus Compatibility

Height Seated (Max)

Length

Width

RoHS Status

Contact Plating

Mount

Max Supply Voltage

Min Supply Voltage

Propagation Delay

Speed Grade

Number of Registers

Number of Pins

Turn On Delay Time

Operating Supply Voltage

View Compare
XC7Z045-L2FFG900I

Xilinx Inc.

10 Weeks

900-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

S-PBGA-B900

1.05V

0.95V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 350K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

31mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-
XC7Z035-3FBG676E

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

3 (168 Hours)

676

-

-

-

-

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

800MHz

NOT SPECIFIED

S-PBGA-B676

-

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 275K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

27mm

ROHS3 Compliant

Copper, Silver, Tin

Surface Mount

1.05V

950mV

110 ps

3

343800

-

-

-

XC7Z045-L2FFG900I vs XC7Z035-3FBG676E
XC7Z100-L2FFG900I

Xilinx Inc.

10 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

800MHz

30

-

-

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 444K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

31mm

ROHS3 Compliant

Copper, Silver, Tin

Surface Mount

1.05V

950mV

120 ps

-

554800

900

120 ps

-

XC7Z045-L2FFG900I vs XC7Z100-L2FFG900I
XC7Z035-1FFG900I

Xilinx Inc.

10 Weeks

900-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

CMOS

BOTTOM

BALL

245

1V

-

667MHz

30

-

-

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 275K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

-

-

ROHS3 Compliant

-

-

-

-

130 ps

1

343800

900

-

1V

XC7Z045-L2FFG900I vs XC7Z035-1FFG900I