Winbond Electronics W632GG6KB-09

Name: W632GG6KB-09
Brand: Winbond Electronics
SKU: 7096503-W632GG6KB-09
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: W632GG6KB-09

Manufacturer:: Winbond Electronics

Ventron No:: 7096503-W632GG6KB-09

Description:: Memory IC

ECAD Model:

Datasheet:: W632GG6KB-09

Specifications

Winbond Electronics W632GG6KB-09 technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W632GG6KB-09.

Mounting Type
Surface Mount
Package / Case
96-TFBGA
Operating Temperature
0°C~95°C TC
Packaging
Tray
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Technology
SDRAM - DDR3
Voltage - Supply
1.425V~1.575V
Memory Size
2Gb 128M x 16
Memory Type
Volatile
Clock Frequency
1066MHz
Access Time
20ns
Memory Format
DRAM
Memory Interface
Parallel
RoHS Status
ROHS3 Compliant

Description

W632GG6KB-09 Overview
The Winbond Electronics product features a Memory electronic component categorized under Memory components. This part has a surface mount installation method and operates within a temperature range of 0°C to 95°C TC. It comes in a tray packaging with an Moisture Sensitivity Level (MSL) rating of 3 (168 hours). The technology used is SDRAM - DDR3, making it volatile in nature. The memory interface is set to parallel, and its clock frequency stands at 1066MHz. The memory format is DRAM, while the interface is designed for parallel communication. The product is compliant with the European Union's Restriction of Hazardous Substances (RoHS) directive, ensuring environmental safety.

W632GG6KB-09 Features
Package / Case: 96-TFBGA

W632GG6KB-09 Applications
There are a lot of Winbond Electronics
W632GG6KB-09 Memory applications.

supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card

W632GG6KB-09 More Descriptions

IC DRAM 2GBIT PAR 1066MHZ 96WBGA
IC DRAM 2G PARALLEL 1066MHZ

Product Comparison

The three parts on the right have similar specifications to W632GG6KB-09.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Operating Temperature

Packaging

Part Status

Moisture Sensitivity Level (MSL)

Technology

Voltage - Supply

Memory Size

Memory Type

Clock Frequency

Access Time

Memory Format

Memory Interface

RoHS Status

Surface Mount

Number of Terminations

ECCN Code

Additional Feature

Terminal Position

Number of Functions

Supply Voltage

Terminal Pitch

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of Ports

Operating Mode

Organization

Memory Width

Write Cycle Time - Word, Page

Memory Density

Height Seated (Max)

Length

Width

View Compare
W632GG6KB-09

Winbond Electronics

Surface Mount

96-TFBGA

0°C~95°C TC

Tray

Discontinued

3 (168 Hours)

SDRAM - DDR3

1.425V~1.575V

2Gb 128M x 16

Volatile

1066MHz

20ns

DRAM

Parallel

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
W632GG6AB-15

Winbond Electronics

-

-

0°C~95°C TC

Tray

Discontinued

3 (168 Hours)

SDRAM - DDR3

1.425V~1.575V

2Gb 128M x 16

Volatile

667MHz

20ns

DRAM

Parallel

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

W632GG6KB-09 vs W632GG6AB-15
W632GG8MB12I TR

Winbond Electronics

Surface Mount

78-VFBGA

-40°C~95°C TC

Tape & Reel (TR)

Obsolete

3 (168 Hours)

SDRAM - DDR3

1.425V~1.575V

2Gb 128M x 16

Volatile

800MHz

20ns

DRAM

Parallel

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

W632GG6KB-09 vs W632GG8MB12I TR
W632GG8MB11I

Winbond Electronics

Surface Mount

78-VFBGA

-40°C~95°C TC

Tray

Obsolete

3 (168 Hours)

SDRAM - DDR3

1.425V~1.575V

2Gb 256M x 8

Volatile

933MHz

20ns

DRAM

Parallel

ROHS3 Compliant

YES

78

EAR99

AUTO/SELF REFRESH

BOTTOM

1

1.5V

0.8mm

R-PBGA-B78

1.575V

1.425V

1

SYNCHRONOUS

256MX8

8

15ns

2147483648 bit

1mm

10.5mm

8mm

W632GG6KB-09 vs W632GG8MB11I