Winbond Electronics W29GL512PL9B

Name: W29GL512PL9B
Brand: Winbond Electronics
SKU: 7372189-W29GL512PL9B
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: W29GL512PL9B

Manufacturer:: Winbond Electronics

Ventron No:: 7372189-W29GL512PL9B

Description:: Memory IC

ECAD Model:

Datasheet:: W29GL512PL9B

Specifications

Winbond Electronics W29GL512PL9B technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W29GL512PL9B.

Mounting Type
Surface Mount
Package / Case
64-LBGA
Number of Pins
64
Supplier Device Package
64-LFBGA (11x13)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2016
Part Status
Not For New Designs
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Interface
Parallel
Memory Size
512Mb 64M x 8 32M x 16
Memory Type
Non-Volatile
Access Time
90ns
Memory Format
FLASH
Memory Interface
Parallel
Write Cycle Time - Word, Page
90ns
RoHS Status
ROHS3 Compliant

Description

W29GL512PL9B Overview
As far as memory types are concerned, Non-Volatile is considered to be its memory type. In addition, memory ics is available in a Tray case as well. In the case of 64-LBGA, it is embedded within the case. A memory chip with a capacity of 512Mb 64M x 8 32M x 16 is used on this device. There is a mainstream memory format used by this device, which is called FLASH-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 2.7V~3.6V. As far as the mounting type is concerned, Surface Mount is recommended. The memory device has an 64-pin package, which encloses it in a small package. Temperatures below -40°C should not be used with this memory ics. It is recommended that operation of the part be restricted to temperatures not exceeding 85°C, otherwise damage to the part may occur as a result of overheating.

W29GL512PL9B Features
Package / Case: 64-LBGA
64 Pins

W29GL512PL9B Applications
There are a lot of Winbond Electronics
W29GL512PL9B Memory applications.

servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM

W29GL512PL9B More Descriptions

IC FLASH 512M PARALLEL 64LFBGA
IC FLASH 512MBIT PAR 64LFBGA
IC FLSH 512MBIT PARALLEL 64LFBGA

Product Comparison

The three parts on the right have similar specifications to W29GL512PL9B.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Published

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Technology

Voltage - Supply

Interface

Memory Size

Memory Type

Access Time

Memory Format

Memory Interface

Write Cycle Time - Word, Page

RoHS Status

Factory Lead Time

Surface Mount

Number of Terminations

ECCN Code

HTS Code

Terminal Position

Number of Functions

Supply Voltage

Terminal Pitch

Pin Count

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

Operating Mode

Supply Current-Max

Memory Width

Standby Current-Max

Access Time (Max)

Programming Voltage

Alternate Memory Width

Data Polling

Toggle Bit

Command User Interface

Number of Sectors/Size

Sector Size

Page Size

Ready/Busy

Common Flash Interface

Height Seated (Max)

Length

Width

Mount

Additional Feature

Nominal Supply Current

Address Bus Width

Density

Sync/Async

Boot Block

JESD-609 Code

Pbfree Code

Terminal Finish

Peak Reflow Temperature (Cel)

Time@Peak Reflow Temperature-Max (s)

Organization

Memory Density

View Compare
W29GL512PL9B

Winbond Electronics

Surface Mount

64-LBGA

64

64-LFBGA (11x13)

-40°C~85°C TA

Tray

2016

Not For New Designs

3 (168 Hours)

85°C

-40°C

FLASH - NOR

2.7V~3.6V

Parallel

512Mb 64M x 8 32M x 16

Non-Volatile

90ns

FLASH

Parallel

90ns

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
W29GL064CH7B

Winbond Electronics

Surface Mount

64-LBGA

64

-

-40°C~85°C TA

Tube

2016

Obsolete

3 (168 Hours)

-

-

FLASH - NOR

2.7V~3.6V

-

64Mb 8M x 8 4M x 16

Non-Volatile

-

FLASH

Parallel

70ns

ROHS3 Compliant

14 Weeks

YES

64

3A991.B.1.A

8542.32.00.51

BOTTOM

1

3V

1mm

64

Not Qualified

3.6V

3/3.3V

2.7V

ASYNCHRONOUS

0.055mA

1

0.000005A

70 ns

3V

8

YES

YES

YES

128

64K

8/16words

YES

YES

1.4mm

13mm

11mm

-

-

-

-

-

-

-

-

-

-

-

-

-

-

W29GL512PL9B vs W29GL064CH7B
W29GL064CT7B

Winbond Electronics

Surface Mount

64-LBGA

64

-

-40°C~85°C TA

Tube

2016

Obsolete

3 (168 Hours)

-

-

FLASH - NOR

2.7V~3.6V

-

64Mb 8M x 8 4M x 16

Non-Volatile

-

FLASH

Parallel

70ns

ROHS3 Compliant

14 Weeks

-

64

3A991.B.1.A

8542.32.00.51

BOTTOM

1

3V

1mm

64

Not Qualified

3.6V

3/3.3V

2.7V

-

-

1

0.000005A

70 ns

3V

8

YES

YES

YES

8127

-

8/16words

YES

YES

1.4mm

13mm

-

Surface Mount

TOP BOOT BLOCK

55mA

22b

64 Mb

Asynchronous

TOP

-

-

-

-

-

-

-

W29GL512PL9B vs W29GL064CT7B
W29GL032CH7B

Winbond Electronics

Surface Mount

64-LBGA

64

-

-40°C~85°C TA

Tube

2016

Obsolete

3 (168 Hours)

-

-

FLASH - NOR

2.7V~3.6V

-

32Mb 4M x 8 2M x 16

Non-Volatile

-

FLASH

Parallel

70ns

ROHS3 Compliant

14 Weeks

YES

64

3A991.B.1.A

8542.32.00.51

BOTTOM

1

3V

1mm

64

Not Qualified

3.6V

3/3.3V

2.7V

ASYNCHRONOUS

0.055mA

1

0.000005A

70 ns

3V

8

YES

YES

YES

64

64K

8/16words

YES

YES

1.4mm

13mm

11mm

-

-

-

-

-

-

-

e1

yes

TIN SILVER COPPER

NOT SPECIFIED

NOT SPECIFIED

32MX1

33554432 bit

W29GL512PL9B vs W29GL032CH7B