MTFC64GAPALBH-AIT

Micron Technology Inc. MTFC64GAPALBH-AIT

Part Number:
MTFC64GAPALBH-AIT
Manufacturer:
Micron Technology Inc.
Ventron No:
7374704-MTFC64GAPALBH-AIT
Description:
e•MMC™ Memory IC e•MMC™ Series 13mm mm
ECAD Model:
Datasheet:
MTFC64GAPALBH-AIT

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Micron Technology Inc. MTFC64GAPALBH-AIT technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MTFC64GAPALBH-AIT.
  • Factory Lead Time
    6 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    153-TFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Series
    e•MMC™
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Number of Terminations
    153
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Technology
    FLASH - NAND
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Terminal Pitch
    0.5mm
  • Reach Compliance Code
    compliant
  • Time@Peak Reflow Temperature-Max (s)
    30
  • JESD-30 Code
    R-PBGA-B153
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    512Gb 64G x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Memory Format
    FLASH
  • Memory Interface
    MMC
  • Organization
    64GX8
  • Memory Width
    8
  • Memory Density
    549755813888 bit
  • Parallel/Serial
    PARALLEL
  • Programming Voltage
    2.7V
  • Length
    13mm
  • Height Seated (Max)
    1.2mm
  • Width
    11.5mm
  • RoHS Status
    RoHS Compliant
Description
MTFC64GAPALBH-AIT Overview
As far as memory types are concerned, Non-Volatile is considered to be its memory type. In addition, memory ics is available in a Tray case as well. In the case of 153-TFBGA, it is embedded within the case. A memory chip with a capacity of 512Gb 64G x 8 is used on this device. There is a mainstream memory format used by this device, which is called FLASH-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. As far as the mounting type is concerned, Surface Mount is recommended. On the chip, there are 153 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. This part plays an important role in applications that target the e•MMC™ series of memory devices. There is a need for a programming voltage of 2.7V in order to modify the state of some nonvolatile memory arrays.

MTFC64GAPALBH-AIT Features
Package / Case: 153-TFBGA


MTFC64GAPALBH-AIT Applications
There are a lot of Micron Technology Inc.
MTFC64GAPALBH-AIT Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
MTFC64GAPALBH-AIT More Descriptions
Active PARALLEL BOTTOM Non-Volatile ic memory -40C~85C TA 2.7V 549755813888bit 11.5mm
Managed NAND, e.MMC for Automotive, 64GB, 2.7V-3.6V, 153-ball TFBGA, RoHSMicron SCT
Product Description Demo for Development.
Flash Memory, 512Gbit, -40 To 85Deg C; Flash Memory Type:Emmc Nand; Memory Configuration:64G X 8Bit; Interfaces:Parallel; Ic Case/Package:Tfbga; No. Of Pins:153Pins; Clock Frequency Max:200Mhz; Access Time:-; Supply Voltage Nom:- Rohs Compliant: Yes |Micron MTFC64GAPALBH-AIT
Product Comparison
The three parts on the right have similar specifications to MTFC64GAPALBH-AIT.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Number of Terminations
    Terminal Finish
    Technology
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Terminal Pitch
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Supplier Device Package
    View Compare
  • MTFC64GAPALBH-AIT
    MTFC64GAPALBH-AIT
    6 Weeks
    Surface Mount
    153-TFBGA
    YES
    -40°C~85°C TA
    Tray
    e•MMC™
    e1
    Active
    153
    Tin/Silver/Copper (Sn/Ag/Cu)
    FLASH - NAND
    BOTTOM
    260
    1
    0.5mm
    compliant
    30
    R-PBGA-B153
    3.6V
    2.7V
    512Gb 64G x 8
    Non-Volatile
    SYNCHRONOUS
    FLASH
    MMC
    64GX8
    8
    549755813888 bit
    PARALLEL
    2.7V
    13mm
    1.2mm
    11.5mm
    RoHS Compliant
    -
    -
    -
    -
  • MTFC4GACAANA-4M IT TR
    -
    Surface Mount
    100-TBGA
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    e•MMC™
    -
    Not For New Designs
    -
    -
    FLASH - NAND
    -
    -
    -
    -
    -
    -
    -
    -
    -
    32Gb 4G x 8
    Non-Volatile
    -
    FLASH
    MMC
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    3 (168 Hours)
    2.7V~3.6V
    -
  • MTFC32GAMAKAM-WT ES TR
    -
    -
    -
    -
    -25°C~85°C TA
    Tape & Reel (TR)
    e•MMC™
    -
    Obsolete
    -
    -
    FLASH - NAND
    -
    -
    -
    -
    -
    -
    -
    -
    -
    256Gb 32G x 8
    Non-Volatile
    -
    FLASH
    MMC
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1 (Unlimited)
    -
    -
  • MTFC32GJWDQ-4M AIT Z TR
    -
    Surface Mount
    100-LBGA
    -
    -40°C~85°C
    Tape & Reel (TR)
    -
    -
    Obsolete
    -
    -
    FLASH - NAND
    -
    -
    -
    -
    -
    -
    -
    -
    -
    256Gb 32G x 8
    Non-Volatile
    -
    FLASH
    MMC
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    3 (168 Hours)
    2.7V~3.6V
    100-LBGA (14x18)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 03 January 2024

    Application Guide for LL4148 Small Signal Diode

    Ⅰ. Overview of LL4148Ⅱ. Working principle of LL4148 diodeⅢ. Technical parameters of LL4148 diodeⅣ. Electrical characteristics of LL4148 diodeⅤ. Where is LL4148 diode used?Ⅵ. What is the difference between LL4148...
  • 03 January 2024

    Exploring the 2SK2225 Transistor's Capabilities

    Ⅰ. Introduction to 2SK2225Ⅱ. Specifications of 2SK2225Ⅲ. The manufacturer of 2SK2225Ⅳ. Absolute maximum ratings of 2SK2225Ⅴ. How to use 2SK2225?Ⅵ. Where is 2SK2225 used?Ⅶ. How to improve the...
  • 04 January 2024

    ULN2003ADR: A Powerful Chip that Drives High Current Loads

    Ⅰ. ULN2003ADR descriptionⅡ. Symbol, footprint and pin configuration of ULN2003ADRⅢ. Specifications of ULN2003ADRⅣ. What are the application fields of ULN2003ADR?Ⅴ. Simplified block diagram of ULN2003ADRⅥ. How to correctly...
  • 04 January 2024

    TPS5430DDAR Converter Replacements, Characteristics, Applications and Development

    Ⅰ. What is TPS5430DDAR?Ⅱ. Characteristics of TPS5430DDARⅢ. Specifications of TPS5430DDARⅣ. Market trend of TPS5430DDARⅤ. Pin configuration and functions of TPS5430DDARⅥ. Typical applications of TPS5430DDARⅦ. Development of TPS5430DDARTPS5430DDAR is...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.