MT53E256M32D2DS-053 WT:B

Micron Technology Inc. MT53E256M32D2DS-053 WT:B

Part Number:
MT53E256M32D2DS-053 WT:B
Manufacturer:
Micron Technology Inc.
Ventron No:
7374352-MT53E256M32D2DS-053 WT:B
Description:
Memory IC
ECAD Model:
Datasheet:
MT53E256M32D2DS-053 WT:B

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Specifications
Micron Technology Inc. MT53E256M32D2DS-053 WT:B technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53E256M32D2DS-053 WT:B.
  • Mounting Type
    Surface Mount
  • Package / Case
    200-WFBGA
  • Operating Temperature
    -30°C~85°C
  • Packaging
    Tray
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Technology
    SDRAM - Mobile LPDDR4
  • Voltage - Supply
    0.6V 1.1V
  • Memory Size
    8Gb 256M x 32
  • Memory Type
    Volatile
  • Clock Frequency
    1.866GHz
  • Memory Format
    DRAM
  • RoHS Status
    ROHS3 Compliant
Description
MT53E256M32D2DS-053 WT:B Overview
Volatile is its memory type. It is available in a case with a Tray shape. As you can see, it is embedded in 200-WFBGA case. There is an 8Gb 256M x 32 memory capacity on the chip. In this device, the memory is of the DRAM-format, which is a popular format in the mainstream computing sector. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. A voltage of 0.6V 1.1V is possible to be applied to the supply. There is a recommendation that Surface Mount mounting type should be used for this product. With a clock frequency of 1.866GHz, the memory rotates on its own.

MT53E256M32D2DS-053 WT:B Features
Package / Case: 200-WFBGA


MT53E256M32D2DS-053 WT:B Applications
There are a lot of Micron Technology Inc.
MT53E256M32D2DS-053 WT:B Memory applications.


telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
MT53E256M32D2DS-053 WT:B More Descriptions
Active Volatile ROHS3Compliant DRAM ic memory -30C~85C 0.6V 1.1V 8Gb 256M x 32 1.866GHz
SDRAM, 256M X 32BIT, -25 TO 85DEG C; DRAM Memory Configuration: 256M x 32bit; Memory Case Style: WFBGA; No. of Pins: 200Pins; IC Interface Type: Parallel; Access Time: 535ps; Page Size: 2048Byte; Operating Temperature Min: -25°
DRAM, 256M X 32BIT, -30 TO 85DEG C; DRAM Type:Mobile LPDDR4; Memory Configuration:256M x 32bit; Clock Frequency Max:1.866GHz; IC Case / Package:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; IC Mounting:Surface Mount RoHS Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to MT53E256M32D2DS-053 WT:B.
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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