Micron Technology Inc. MT53E256M32D2DS-053 AIT:B

MT53E256M32D2DS-053 AIT:B Overview
In terms of its memory type, it can be classified as Volatile. The case comes in Tray size. The case is embedded in 200-WFBGA. Memory size on the chip is 8Gb 256M x 32. This device uses takes advantage of the DRAM format. The device's extended operating temperature range of -40°C~95°C makes it ideal for many demanding applications. The device is capable of handling a supply voltage of 0.6V 1.1V. The recommended mounting type for this device is Surface Mount. On the chip, there are 200 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 1.1V is required for the operation of this memory device. There is a clock frequency rotation of the memory within a 1.866GHz range. It also features SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX to boost system performance despite all its merits. In this chip, there are 1 ports providing read and/or write access to one memory address.

MT53E256M32D2DS-053 AIT:B Features
Package / Case: 200-WFBGA
Additional Feature:SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX


MT53E256M32D2DS-053 AIT:B Applications
There are a lot of Micron Technology Inc.
MT53E256M32D2DS-053 AIT:B Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer