Micron Technology Inc. MT53D512M32D2DS-053 AIT:D
- Part Number:
- MT53D512M32D2DS-053 AIT:D
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7373914-MT53D512M32D2DS-053 AIT:D
- Description:
- Memory IC
- ECAD Model:
-
- Datasheet:
- MT53D512M32D2DS-053 AIT:D
Micron Technology Inc. MT53D512M32D2DS-053 AIT:D technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53D512M32D2DS-053 AIT:D.
- Factory Lead Time6 Weeks
- Mounting TypeSurface Mount
- Package / Case200-WFBGA
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - Mobile LPDDR4
- Voltage - Supply1.1V
- Memory Size16Gb 512M x 32
- Memory TypeVolatile
- Clock Frequency1866MHz
- Memory FormatDRAM
- RoHS StatusROHS3 Compliant
MT53D512M32D2DS-053 AIT:D Overview
Volatile is the type of memory it has. There is a Tray case available. The 200-WFBGA case contains it. The chip has an 16Gb 512M x 32 memory. This device uses a DRAM-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 1.1V can be supplied to memory ics. Its recommended mounting type is Surface Mount. It is important to note that the memory has a clock frequency rotation within the range of 1866MHz.
MT53D512M32D2DS-053 AIT:D Features
Package / Case: 200-WFBGA
MT53D512M32D2DS-053 AIT:D Applications
There are a lot of Micron Technology Inc.
MT53D512M32D2DS-053 AIT:D Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
Volatile is the type of memory it has. There is a Tray case available. The 200-WFBGA case contains it. The chip has an 16Gb 512M x 32 memory. This device uses a DRAM-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 1.1V can be supplied to memory ics. Its recommended mounting type is Surface Mount. It is important to note that the memory has a clock frequency rotation within the range of 1866MHz.
MT53D512M32D2DS-053 AIT:D Features
Package / Case: 200-WFBGA
MT53D512M32D2DS-053 AIT:D Applications
There are a lot of Micron Technology Inc.
MT53D512M32D2DS-053 AIT:D Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MT53D512M32D2DS-053 AIT:D More Descriptions
Active Volatile ROHS3Compliant DRAM ic memory -40C~85C TA 1.1V 16Gb 512M x 32 1866MHz
SDRAM, 512M X 32BIT, -40 TO 95DEG C; DRAM Memory Configuration: 512M x 32bit; Memory Case Style: WFBGA; No. of Pins: 200Pins; IC Interface Type: Parallel; Access Time: 535ps; Page Size: 2048Byte; Operating Temperature Min: -40°
DRAM, 512M X 32BIT, -40 TO 85DEG C; DRAM Type:Mobile LPDDR4; Memory Configuration:512M x 32bit; Clock Frequency Max:1.866GHz; IC Case / Package:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; IC Mounting:Surface Mount RoHS Compliant: Yes
SDRAM, 512M X 32BIT, -40 TO 95DEG C; DRAM Memory Configuration: 512M x 32bit; Memory Case Style: WFBGA; No. of Pins: 200Pins; IC Interface Type: Parallel; Access Time: 535ps; Page Size: 2048Byte; Operating Temperature Min: -40°
DRAM, 512M X 32BIT, -40 TO 85DEG C; DRAM Type:Mobile LPDDR4; Memory Configuration:512M x 32bit; Clock Frequency Max:1.866GHz; IC Case / Package:WFBGA; No. of Pins:200Pins; Supply Voltage Nom:1.1V; IC Mounting:Surface Mount RoHS Compliant: Yes
The three parts on the right have similar specifications to MT53D512M32D2DS-053 AIT:D.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatRoHS StatusView Compare
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MT53D512M32D2DS-053 AIT:D6 WeeksSurface Mount200-WFBGA-40°C~85°C TATrayActive3 (168 Hours)SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1866MHzDRAMROHS3 Compliant- -
-Surface Mount200-VFBGA-30°C~85°C TCTape & Reel (TR)Not For New Designs3 (168 Hours)SDRAM - Mobile LPDDR41.1V24Gb 768M x 32Volatile1600MHzDRAMROHS3 Compliant
-
-Surface Mount200-VFBGA-30°C~85°C TCTrayNot For New Designs3 (168 Hours)SDRAM - Mobile LPDDR41.1V24Gb 768M x 32Volatile1600MHzDRAMROHS3 Compliant
-
-Surface Mount200-WFBGA-30°C~85°C TCTrayActive3 (168 Hours)SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1866MHzDRAMROHS3 Compliant
-
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