Micron Technology Inc. MT53D1G64D8NZ-046 WT:E TR
- Part Number:
- MT53D1G64D8NZ-046 WT:E TR
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7374243-MT53D1G64D8NZ-046 WT:E TR
- Description:
- Memory IC
- Datasheet:
- MT53D1G64D8NZ-046 WT:E TR
Micron Technology Inc. MT53D1G64D8NZ-046 WT:E TR technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53D1G64D8NZ-046 WT:E TR.
- Mounting TypeSurface Mount
- Package / Case376-WFBGA
- Operating Temperature-30°C~85°C TC
- PackagingTape & Reel (TR)
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - Mobile LPDDR4
- Voltage - Supply1.1V
- Memory Size64Gb 1G x 64
- Memory TypeVolatile
- Clock Frequency2133MHz
- Memory FormatDRAM
- RoHS StatusROHS3 Compliant
MT53D1G64D8NZ-046 WT:E TR Overview
Its memory type can be classified as Volatile. It comes in a Tape & Reel (TR). It is available in 376-WFBGA case. The memory size of the chip is 64Gb 1G x 64 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -30°C~85°C TC, this device is capable of lots of demanding applications. It is supplied votage within 1.1V. Its recommended mounting type is Surface Mount. The memory has a clock frequency rotation within 2133MHz.
MT53D1G64D8NZ-046 WT:E TR Features
Package / Case: 376-WFBGA
MT53D1G64D8NZ-046 WT:E TR Applications
There are a lot of Micron Technology Inc.
MT53D1G64D8NZ-046 WT:E TR Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
Its memory type can be classified as Volatile. It comes in a Tape & Reel (TR). It is available in 376-WFBGA case. The memory size of the chip is 64Gb 1G x 64 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -30°C~85°C TC, this device is capable of lots of demanding applications. It is supplied votage within 1.1V. Its recommended mounting type is Surface Mount. The memory has a clock frequency rotation within 2133MHz.
MT53D1G64D8NZ-046 WT:E TR Features
Package / Case: 376-WFBGA
MT53D1G64D8NZ-046 WT:E TR Applications
There are a lot of Micron Technology Inc.
MT53D1G64D8NZ-046 WT:E TR Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
MT53D1G64D8NZ-046 WT:E TR More Descriptions
Mobile DRAM Chip LPDDR4X SDRAM 64G-bit 1Gx64 376-Pin WFBGA
IC DRAM 64GBIT 2.133GHZ 376WFBGA
DRAM LPDDR4 64G 1GX64 FBGA 8DP
IC DRAM 64GBIT 2.133GHZ 376WFBGA
DRAM LPDDR4 64G 1GX64 FBGA 8DP
The three parts on the right have similar specifications to MT53D1G64D8NZ-046 WT:E TR.
-
ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatRoHS StatusView Compare
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MT53D1G64D8NZ-046 WT:E TRSurface Mount376-WFBGA-30°C~85°C TCTape & Reel (TR)Active3 (168 Hours)SDRAM - Mobile LPDDR41.1V64Gb 1G x 64Volatile2133MHzDRAMROHS3 Compliant-
-
Surface Mount200-VFBGA-30°C~85°C TCTape & Reel (TR)Not For New Designs3 (168 Hours)SDRAM - Mobile LPDDR41.1V24Gb 768M x 32Volatile1600MHzDRAMROHS3 Compliant
-
Surface Mount200-VFBGA-30°C~85°C TCTrayNot For New Designs3 (168 Hours)SDRAM - Mobile LPDDR41.1V24Gb 768M x 32Volatile1600MHzDRAMROHS3 Compliant
-
Surface Mount200-WFBGA-40°C~95°C TCTrayActive-SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1600MHzDRAM-
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