Micron Technology Inc. MT53B512M32D2DS-062 AAT:C
- Part Number:
- MT53B512M32D2DS-062 AAT:C
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7373937-MT53B512M32D2DS-062 AAT:C
- Description:
- Memory IC
- Datasheet:
- MT53B512M32D2DS-062 AAT:C
Micron Technology Inc. MT53B512M32D2DS-062 AAT:C technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53B512M32D2DS-062 AAT:C.
- Factory Lead Time6 Weeks
- Mounting TypeSurface Mount
- Package / Case200-WFBGA
- Operating Temperature-40°C~105°C TA
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - Mobile LPDDR4
- Voltage - Supply1.1V
- Memory Size16Gb 512M x 32
- Memory TypeVolatile
- Clock Frequency1600MHz
- Memory FormatDRAM
- RoHS StatusROHS3 Compliant
MT53B512M32D2DS-062 AAT:C Overview
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. Embedded in the 200-WFBGA case, memory ics is a single file. On the chip, there is an 16Gb 512M x 32 memory, which is the size of the chip's memory. There is a DRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~105°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 1.1V volts. The recommended mounting type for memory ics is Surface Mount. A clock frequency rotation within 1600MHz is used for the ic memory chip to rotate data.
MT53B512M32D2DS-062 AAT:C Features
Package / Case: 200-WFBGA
MT53B512M32D2DS-062 AAT:C Applications
There are a lot of Micron Technology Inc.
MT53B512M32D2DS-062 AAT:C Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. Embedded in the 200-WFBGA case, memory ics is a single file. On the chip, there is an 16Gb 512M x 32 memory, which is the size of the chip's memory. There is a DRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~105°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 1.1V volts. The recommended mounting type for memory ics is Surface Mount. A clock frequency rotation within 1600MHz is used for the ic memory chip to rotate data.
MT53B512M32D2DS-062 AAT:C Features
Package / Case: 200-WFBGA
MT53B512M32D2DS-062 AAT:C Applications
There are a lot of Micron Technology Inc.
MT53B512M32D2DS-062 AAT:C Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
MT53B512M32D2DS-062 AAT:C More Descriptions
DRAM LPDDR4 16G 512MX32 FBGA DDP
IC DRAM 16GBIT 1600MHZ 200WFBGA
IC SDRAM 16GBIT 933MHZ FBGA
IC DRAM 16GBIT 1600MHZ 200WFBGA
IC SDRAM 16GBIT 933MHZ FBGA
The three parts on the right have similar specifications to MT53B512M32D2DS-062 AAT:C.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatRoHS StatusSeriesView Compare
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MT53B512M32D2DS-062 AAT:C6 WeeksSurface Mount200-WFBGA-40°C~105°C TATrayActive3 (168 Hours)SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1600MHzDRAMROHS3 Compliant--
-
-Surface Mount200-VFBGA-30°C~85°C TCTape & Reel (TR)Not For New Designs3 (168 Hours)SDRAM - Mobile LPDDR41.1V24Gb 768M x 32Volatile1600MHzDRAMROHS3 Compliant-
-
6 WeeksSurface Mount200-WFBGA-40°C~105°C TATape & Reel (TR)Not For New Designs3 (168 Hours)SDRAM - Mobile LPDDR40.6V 1.1V16Gb 512M x 32Volatile1.6GHzDRAMROHS3 CompliantAutomotive, AEC-Q100
-
-Surface Mount200-WFBGA-30°C~85°C TCTrayActive3 (168 Hours)SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1866MHzDRAMROHS3 Compliant-
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