Micron Technology Inc. MT53B256M32D1PX-062 XT:C
- Part Number:
- MT53B256M32D1PX-062 XT:C
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7374355-MT53B256M32D1PX-062 XT:C
- Description:
- Memory IC
- ECAD Model:
-
- Datasheet:
- MT53B256M32D1PX-062 XT:C
Micron Technology Inc. MT53B256M32D1PX-062 XT:C technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53B256M32D1PX-062 XT:C.
- Operating Temperature-30°C~105°C TC
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - Mobile LPDDR4
- Voltage - Supply1.1V
- Memory Size8Gb 256M x 32
- Memory TypeVolatile
- Clock Frequency1600MHz
- Memory FormatDRAM
- RoHS StatusROHS3 Compliant
MT53B256M32D1PX-062 XT:C Overview
Volatile is the type of memory it has. There is a Tray case available. The chip has an 8Gb 256M x 32 memory. This device uses a DRAM-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 1.1V can be supplied to memory ics. It is important to note that the memory has a clock frequency rotation within the range of 1600MHz.
MT53B256M32D1PX-062 XT:C Features
MT53B256M32D1PX-062 XT:C Applications
There are a lot of Micron Technology Inc.
MT53B256M32D1PX-062 XT:C Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
Volatile is the type of memory it has. There is a Tray case available. The chip has an 8Gb 256M x 32 memory. This device uses a DRAM-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 1.1V can be supplied to memory ics. It is important to note that the memory has a clock frequency rotation within the range of 1600MHz.
MT53B256M32D1PX-062 XT:C Features
MT53B256M32D1PX-062 XT:C Applications
There are a lot of Micron Technology Inc.
MT53B256M32D1PX-062 XT:C Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MT53B256M32D1PX-062 XT:C More Descriptions
8GX8 MCP PLASTIC WIRELESS TEMP PBF TBGA 3.3V
DRAM LPDDR4 8G 256MX32 FBGA
IC DRAM 8GBIT 1600MHZ
DRAM LPDDR4 8G 256MX32 FBGA
IC DRAM 8GBIT 1600MHZ
The three parts on the right have similar specifications to MT53B256M32D1PX-062 XT:C.
-
ImagePart NumberManufacturerOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatRoHS StatusFactory Lead TimeMounting TypePackage / CaseSeriesView Compare
-
MT53B256M32D1PX-062 XT:C-30°C~105°C TCTrayActive3 (168 Hours)SDRAM - Mobile LPDDR41.1V8Gb 256M x 32Volatile1600MHzDRAMROHS3 Compliant----- -
-40°C~95°C TCTrayActive-SDRAM - Mobile LPDDR41.1V8Gb 256M x 32Volatile1600MHzDRAM-13 WeeksSurface Mount200-WFBGA-
-
-40°C~105°C TATape & Reel (TR)Not For New Designs3 (168 Hours)SDRAM - Mobile LPDDR40.6V 1.1V16Gb 512M x 32Volatile1.6GHzDRAMROHS3 Compliant6 WeeksSurface Mount200-WFBGAAutomotive, AEC-Q100
-
-40°C~95°C TCTrayActive-SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1600MHzDRAM--Surface Mount200-WFBGA-
-
Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series
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