Micron Technology Inc. MT53B256M32D1DS-062 AAT:C
- Part Number:
- MT53B256M32D1DS-062 AAT:C
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7374475-MT53B256M32D1DS-062 AAT:C
- Description:
- Memory IC
- Datasheet:
- MT53B256M32D1DS-062 AAT:C
Micron Technology Inc. MT53B256M32D1DS-062 AAT:C technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53B256M32D1DS-062 AAT:C.
- Mounting TypeSurface Mount
- Package / Case200-WFBGA
- Operating Temperature-40°C~105°C TA
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - Mobile LPDDR4
- Voltage - Supply1.1V
- Memory Size8Gb 256M x 32
- Memory TypeVolatile
- Clock Frequency1600MHz
- Memory FormatDRAM
- RoHS StatusROHS3 Compliant
MT53B256M32D1DS-062 AAT:C Overview
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. Embedded in the 200-WFBGA case, memory ics is a single file. On the chip, there is an 8Gb 256M x 32 memory, which is the size of the chip's memory. There is a DRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~105°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 1.1V volts. The recommended mounting type for memory ics is Surface Mount. A clock frequency rotation within 1600MHz is used for the ic memory chip to rotate data.
MT53B256M32D1DS-062 AAT:C Features
Package / Case: 200-WFBGA
MT53B256M32D1DS-062 AAT:C Applications
There are a lot of Micron Technology Inc.
MT53B256M32D1DS-062 AAT:C Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. Embedded in the 200-WFBGA case, memory ics is a single file. On the chip, there is an 8Gb 256M x 32 memory, which is the size of the chip's memory. There is a DRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~105°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 1.1V volts. The recommended mounting type for memory ics is Surface Mount. A clock frequency rotation within 1600MHz is used for the ic memory chip to rotate data.
MT53B256M32D1DS-062 AAT:C Features
Package / Case: 200-WFBGA
MT53B256M32D1DS-062 AAT:C Applications
There are a lot of Micron Technology Inc.
MT53B256M32D1DS-062 AAT:C Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
MT53B256M32D1DS-062 AAT:C More Descriptions
Active Volatile ROHS3Compliant DRAM ic memory -40C~105C TA 1.1V 8Gb 256M x 32 1600MHz
256MX32 LPDDR4 PLASTIC AUTOMOTIVE TEMP GREEN WFBGA 1.1V Z01M
IC DRAM 8GBIT 1600MHZ 200WFBGA
Dram, 256M X 32Bit, -40 To 105Deg C; Dram Type:Lpddr4; Dram Density:8Gbit; Dram Memory Configuration:256M X 32Bit; Clock Frequency:-; Memory Case Style:Wfbga; No. Of Pins:200Pins; Supply Voltage Nom:-; Access Time:-; Product Range:- Rohs Compliant: Yes |Micron MT53B256M32D1DS-062 AAT:C
256MX32 LPDDR4 PLASTIC AUTOMOTIVE TEMP GREEN WFBGA 1.1V Z01M
IC DRAM 8GBIT 1600MHZ 200WFBGA
Dram, 256M X 32Bit, -40 To 105Deg C; Dram Type:Lpddr4; Dram Density:8Gbit; Dram Memory Configuration:256M X 32Bit; Clock Frequency:-; Memory Case Style:Wfbga; No. Of Pins:200Pins; Supply Voltage Nom:-; Access Time:-; Product Range:- Rohs Compliant: Yes |Micron MT53B256M32D1DS-062 AAT:C
The three parts on the right have similar specifications to MT53B256M32D1DS-062 AAT:C.
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ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatRoHS StatusView Compare
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MT53B256M32D1DS-062 AAT:CSurface Mount200-WFBGA-40°C~105°C TATrayActive3 (168 Hours)SDRAM - Mobile LPDDR41.1V8Gb 256M x 32Volatile1600MHzDRAMROHS3 Compliant-
-
Surface Mount200-VFBGA-30°C~85°C TCTrayNot For New Designs3 (168 Hours)SDRAM - Mobile LPDDR41.1V24Gb 768M x 32Volatile1600MHzDRAMROHS3 Compliant
-
Surface Mount200-WFBGA-40°C~95°C TCTrayActive-SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1600MHzDRAM-
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Surface Mount200-WFBGA-30°C~85°C TCTape & Reel (TR)Active3 (168 Hours)SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1866MHzDRAMROHS3 Compliant
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