Micron Technology Inc. MT53B128M32D1DS-062 AIT:A TR
- Part Number:
- MT53B128M32D1DS-062 AIT:A TR
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7374564-MT53B128M32D1DS-062 AIT:A TR
- Description:
- Memory IC
- ECAD Model:
-
- Datasheet:
- MT53B128M32D1DS-062 AIT:A TR
Micron Technology Inc. MT53B128M32D1DS-062 AIT:A TR technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53B128M32D1DS-062 AIT:A TR.
- Mounting TypeSurface Mount
- Package / Case200-WFBGA
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - Mobile LPDDR4
- Voltage - Supply1.1V
- Memory Size4Gb 128M x 32
- Memory TypeVolatile
- Clock Frequency1600MHz
- Memory FormatDRAM
- RoHS StatusROHS3 Compliant
MT53B128M32D1DS-062 AIT:A TR Overview
Its memory type can be classified as Volatile. It comes in a Tape & Reel (TR). It is available in 200-WFBGA case. The memory size of the chip is 4Gb 128M x 32 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. It is supplied votage within 1.1V. Its recommended mounting type is Surface Mount. The memory has a clock frequency rotation within 1600MHz.
MT53B128M32D1DS-062 AIT:A TR Features
Package / Case: 200-WFBGA
MT53B128M32D1DS-062 AIT:A TR Applications
There are a lot of Micron Technology Inc.
MT53B128M32D1DS-062 AIT:A TR Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
Its memory type can be classified as Volatile. It comes in a Tape & Reel (TR). It is available in 200-WFBGA case. The memory size of the chip is 4Gb 128M x 32 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. It is supplied votage within 1.1V. Its recommended mounting type is Surface Mount. The memory has a clock frequency rotation within 1600MHz.
MT53B128M32D1DS-062 AIT:A TR Features
Package / Case: 200-WFBGA
MT53B128M32D1DS-062 AIT:A TR Applications
There are a lot of Micron Technology Inc.
MT53B128M32D1DS-062 AIT:A TR Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
MT53B128M32D1DS-062 AIT:A TR More Descriptions
DRAM Chip Mobile LPDDR SDRAM 4G-Bit 128Mx32 1.8V 168-Pin WFBGA
DRAM LPDDR4 4G 128MX32 FBGA
IC DRAM 4G 1600MHZ
DRAM LPDDR4 4G 128MX32 FBGA
IC DRAM 4G 1600MHZ
The three parts on the right have similar specifications to MT53B128M32D1DS-062 AIT:A TR.
-
ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatRoHS StatusFactory Lead TimeSeriesView Compare
-
MT53B128M32D1DS-062 AIT:A TRSurface Mount200-WFBGA-40°C~85°C TATape & Reel (TR)Active3 (168 Hours)SDRAM - Mobile LPDDR41.1V4Gb 128M x 32Volatile1600MHzDRAMROHS3 Compliant--- -
Surface Mount200-WFBGA-40°C~105°C TATape & Reel (TR)Not For New Designs3 (168 Hours)SDRAM - Mobile LPDDR40.6V 1.1V16Gb 512M x 32Volatile1.6GHzDRAMROHS3 Compliant6 WeeksAutomotive, AEC-Q100
-
---30°C~105°C TCTrayActive-SDRAM - Mobile LPDDR41.1V16Gb 256M x 64Volatile1600MHzDRAM-9 Weeks-
-
Surface Mount200-WFBGA-30°C~85°C TCTrayActive3 (168 Hours)SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1866MHzDRAMROHS3 Compliant--
-
Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series
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