ISSI, Integrated Silicon Solution Inc IS46DR16128C-3DBLA1
- Part Number:
- IS46DR16128C-3DBLA1
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 7374375-IS46DR16128C-3DBLA1
- Description:
- 1.8V V Memory IC 12.5mm mm
- Datasheet:
- IS46DR16128C-3DBLA1
ISSI, Integrated Silicon Solution Inc IS46DR16128C-3DBLA1 technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS46DR16128C-3DBLA1.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case84-TFBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations84
- ECCN CodeEAR99
- Additional FeaturePROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
- TechnologySDRAM - DDR2
- Voltage - Supply1.7V~1.9V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- JESD-30 CodeR-PBGA-B84
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.9V
- Power Supplies1.8V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size2Gb 128M x 16
- Number of Ports1
- Memory TypeVolatile
- Operating ModeSYNCHRONOUS
- Clock Frequency333MHz
- Supply Current-Max0.485mA
- Access Time450ps
- Memory FormatDRAM
- Memory InterfaceParallel
- Organization128MX16
- Output Characteristics3-STATE
- Memory Width16
- Write Cycle Time - Word, Page15ns
- Standby Current-Max0.03A
- Memory Density2147483648 bit
- Screening LevelAEC-Q100
- I/O TypeCOMMON
- Refresh Cycles8192
- Sequential Burst Length48
- Interleaved Burst Length48
- Length12.5mm
- Height Seated (Max)1.2mm
- Width8mm
- RoHS StatusROHS3 Compliant
IS46DR16128C-3DBLA1 Overview
As far as memory types are concerned, Volatile is considered to be its memory type. In addition, memory ics is available in a Tray case as well. In the case of 84-TFBGA, it is embedded within the case. A memory chip with a capacity of 2Gb 128M x 16 is used on this device. There is a mainstream memory format used by this device, which is called DRAM-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.7V~1.9V. As far as the mounting type is concerned, Surface Mount is recommended. On the chip, there are 84 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. In the memory, there is a clock frequency rotation that ranges 333MHz. The memory chip also offers PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH to level up system performance despite its merits. The memory chip has 1 ports for granting read/write access to one memory address. There is only a single power supply required for this memory chip. There are I/O ports on this memory ics that have COMMON-bit memory mapping. As far as the supply current is concerned, it can be operated with a maximum of 0.485mA of current
IS46DR16128C-3DBLA1 Features
Package / Case: 84-TFBGA
Additional Feature:PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
I/O Type: COMMON
IS46DR16128C-3DBLA1 Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS46DR16128C-3DBLA1 Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
As far as memory types are concerned, Volatile is considered to be its memory type. In addition, memory ics is available in a Tray case as well. In the case of 84-TFBGA, it is embedded within the case. A memory chip with a capacity of 2Gb 128M x 16 is used on this device. There is a mainstream memory format used by this device, which is called DRAM-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.7V~1.9V. As far as the mounting type is concerned, Surface Mount is recommended. On the chip, there are 84 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. In the memory, there is a clock frequency rotation that ranges 333MHz. The memory chip also offers PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH to level up system performance despite its merits. The memory chip has 1 ports for granting read/write access to one memory address. There is only a single power supply required for this memory chip. There are I/O ports on this memory ics that have COMMON-bit memory mapping. As far as the supply current is concerned, it can be operated with a maximum of 0.485mA of current
IS46DR16128C-3DBLA1 Features
Package / Case: 84-TFBGA
Additional Feature:PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
I/O Type: COMMON
IS46DR16128C-3DBLA1 Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS46DR16128C-3DBLA1 Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
IS46DR16128C-3DBLA1 More Descriptions
DRAM Chip DDR2 DRAM 2G-Bit 128Mx16 333MHz 1.8V -40 to 85°C AT 84-Ball BGA
DRAM Chip DDR2 SDRAM 2Gbit 128Mx16 1.8V Automotive 84-Pin TW-BGA
IC DRAM 2GBIT PARALLEL 84TWBGA
Automotive (Tc: -40 To 95C),2G, 1.8V, Ddr2, 128Mx16, 333Mhz @ Cl5, 84 Ball Bga, (8Mm X 12.5Mm), Rohs |Integrated Silicon Solution (Issi) IS46DR16128C-3DBLA1
DRAM Chip DDR2 SDRAM 2Gbit 128Mx16 1.8V Automotive 84-Pin TW-BGA
IC DRAM 2GBIT PARALLEL 84TWBGA
Automotive (Tc: -40 To 95C),2G, 1.8V, Ddr2, 128Mx16, 333Mhz @ Cl5, 84 Ball Bga, (8Mm X 12.5Mm), Rohs |Integrated Silicon Solution (Issi) IS46DR16128C-3DBLA1
The three parts on the right have similar specifications to IS46DR16128C-3DBLA1.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeNumber of PortsMemory TypeOperating ModeClock FrequencySupply Current-MaxAccess TimeMemory FormatMemory InterfaceOrganizationOutput CharacteristicsMemory WidthWrite Cycle Time - Word, PageStandby Current-MaxMemory DensityScreening LevelI/O TypeRefresh CyclesSequential Burst LengthInterleaved Burst LengthLengthHeight Seated (Max)WidthRoHS StatusNumber of PinsAddress Bus WidthDensityMax FrequencyView Compare
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IS46DR16128C-3DBLA18 WeeksSurface Mount84-TFBGAYES-40°C~85°C TATrayActive3 (168 Hours)84EAR99PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESHSDRAM - DDR21.7V~1.9VBOTTOM11.8V0.8mmR-PBGA-B84Not Qualified1.9V1.8V1.7V2Gb 128M x 161VolatileSYNCHRONOUS333MHz0.485mA450psDRAMParallel128MX163-STATE1615ns0.03A2147483648 bitAEC-Q100COMMON8192484812.5mm1.2mm8mmROHS3 Compliant-----
-
10 WeeksSurface Mount60-TFBGA--40°C~85°C TATrayActive3 (168 Hours)---SDRAM - DDR2.3V~2.7V---------512Mb 32M x 16-Volatile---700psDRAMParallel---15ns----------ROHS3 Compliant6013b512 Mb200MHz
-
10 WeeksSurface Mount66-TSSOP (0.400, 10.16mm Width)--40°C~105°C TATape & Reel (TR)Active3 (168 Hours)---SDRAM - DDR2.3V~2.7V---------512Mb 32M x 16-Volatile---700psDRAMParallel---15ns----------ROHS3 Compliant6613b512 Mb166MHz
-
10 WeeksSurface Mount60-TFBGA--40°C~105°C TATrayActive3 (168 Hours)---SDRAM - DDR2.3V~2.7V---------512Mb 32M x 16-Volatile---700psDRAMParallel---15ns----------ROHS3 Compliant6013b512 Mb166MHz
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