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NXP USA Inc. CLRC66303HNE

Part Number:

CLRC66303HNE

Manufacturer:

NXP USA Inc.

Ventron No:

8291619-CLRC66303HNE

Description:

CLRC66303HNE datasheet pdf and RFID, RF Access, Monitoring ICs product details from NXP USA Inc. stock available at Ventron

Datasheet:

CLRC66303HNE

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Specifications

NXP USA Inc. CLRC66303HNE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. CLRC66303HNE.

  • Factory Lead Time
    8 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    32-VFQFN Exposed Pad
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -25°C~85°C
  • Packaging
    Tray
  • Published
    2010
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    2 (1 Year)
  • Voltage - Supply
    2.5V~5.5V
  • Peak Reflow Temperature (Cel)
    260
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    13.56MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    I2C, SPI, UART
  • Standards
    ISO 14443
  • RoHS Status
    ROHS3 Compliant

Description

Description:

The NXP Semiconductors CLRC663 Series RFID Reader IC is a 13.56 MHz contactless reader IC designed for use in RFID and access control applications. It supports I²C, SPI, and UART interfaces and operates on a voltage range of 2.5 V to 5.5 V. The IC is packaged in a HVQFN-32 package.

Features:
• 13.56 MHz contactless reader IC
• Supports I²C, SPI, and UART interfaces
• Operating voltage range of 2.5 V to 5.5 V
• HVQFN-32 package
• Low power consumption
• High data rate
• High sensitivity
• High ESD protection

Applications:
• RFID and access control
• Monitoring
• Automotive
• Industrial
• Medical
• Security
CLRC66303HNE More Descriptions
CLR663 Series RFID Reader 13.56 MHz I²C, SPI, UART 2.5 V ~ 5.5 V - HVQFN-32
NFC/RFID Read/Write 13.56MHz 8KByte 32-Pin HVQFN EP Tray
NFC Reader/Writer 13.56MHz 17mA 2.5V to 5.5V 32-Pin HVQFN Tray
HVQFN-32-EP(5x5) RF Chips ROHS
multi-protocol frontend, HVQFN32, RoHSNXP Semiconductors SCT
IC RFID RDR/TRAN 13.56MZ 32HVQFN
IC NFC CONTACTLESS TXRX 32HVQFN
IC MCU 16BIT 32KB FLASH 64LQFP
RFID, READ, WRITE, 13.56MHZ, HVQFN-32; Frequency Min: -; Frequency Max: 13.56MHz; RFID IC Type: Read, Write; Programmable Memory: -; Output Power: -; RF IC Case Style: HVQFN; No. of Pins: 32Pins; Supply Voltage Min: 2.5V; Supply Voltage Max: 5.5V; Current Consumption: 17mA; Product Range: -; MSL: MSL 2 - 1 year; SVHC: No SVHC (15-Jan-2019)

Product Comparison

The three parts on the right have similar specifications to CLRC66303HNE.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Peak Reflow Temperature (Cel)
    Frequency
    Time@Peak Reflow Temperature-Max (s)
    Interface
    Standards
    RoHS Status
    View Compare
  • CLRC66303HNE
    CLRC66303HNE
    8 Weeks
    Surface Mount
    32-VFQFN Exposed Pad
    -25°C~85°C
    Tray
    2010
    Active
    2 (1 Year)
    2.5V~5.5V
    260
    13.56MHz
    NOT SPECIFIED
    I2C, SPI, UART
    ISO 14443
    ROHS3 Compliant
    -
  • CLRC66303HNK
    -
    -
    -
    -
    -
    2017
    Obsolete
    2 (1 Year)
    -
    -
    -
    -
    -
    -
    -
  • CLRC66303HNY
    8 Weeks
    Surface Mount
    32-VFQFN Exposed Pad
    -40°C~105°C
    Tape & Reel (TR)
    2010
    Active
    2 (1 Year)
    2.5V~5.5V
    260
    13.56MHz
    NOT SPECIFIED
    I2C, SPI, UART
    ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
    ROHS3 Compliant
  • CLRC66103HNE
    -
    -
    -
    -
    -
    -
    Active
    2 (1 Year)
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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