Alliance Memory, Inc. AS7C325632-10BINTR
- Part Number:
- AS7C325632-10BINTR
- Manufacturer:
- Alliance Memory, Inc.
- Ventron No:
- 7374386-AS7C325632-10BINTR
- Description:
- Memory IC
- Datasheet:
- AS7C325632-10BINTR
Alliance Memory, Inc. AS7C325632-10BINTR technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS7C325632-10BINTR.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case90-TFBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations90
- HTS Code8542.32.00.41
- TechnologySRAM - Asynchronous
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Supply Voltage3.3V
- Reach Compliance Codecompliant
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B90
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size8Mb 1M x 8
- Memory TypeVolatile
- Memory FormatSRAM
- Memory InterfaceParallel
- Organization256KX32
- Memory Width32
- Write Cycle Time - Word, Page10ns
- Memory Density8388608 bit
- Access Time (Max)10 ns
- RoHS StatusRoHS Compliant
AS7C325632-10BINTR Overview
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tape & Reel (TR) case as well. Embedded in the 90-TFBGA case, memory ics is a single file. On the chip, there is an 8Mb 1M x 8 memory, which is the size of the chip's memory. There is a SRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~85°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V volts. The recommended mounting type for memory ics is Surface Mount. A total of 90 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3.3V will be necessary.
AS7C325632-10BINTR Features
Package / Case: 90-TFBGA
AS7C325632-10BINTR Applications
There are a lot of Alliance Memory, Inc.
AS7C325632-10BINTR Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tape & Reel (TR) case as well. Embedded in the 90-TFBGA case, memory ics is a single file. On the chip, there is an 8Mb 1M x 8 memory, which is the size of the chip's memory. There is a SRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~85°C TA, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V volts. The recommended mounting type for memory ics is Surface Mount. A total of 90 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3.3V will be necessary.
AS7C325632-10BINTR Features
Package / Case: 90-TFBGA
AS7C325632-10BINTR Applications
There are a lot of Alliance Memory, Inc.
AS7C325632-10BINTR Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
AS7C325632-10BINTR More Descriptions
High Speed CMOS SRAM 2MB 3.3V 256K X 32 90-ball TFBGA
SRAM Chip Single 8Mbit 256K X 32 90-Pin TFBGA T/R
SRAM 8M, 3.3V, 10ns, FAST 256K X 32 Asyn SRAM
IC SRAM 8MBIT PARALLEL 90TFBGA
SRAM Chip Single 8Mbit 256K X 32 90-Pin TFBGA T/R
SRAM 8M, 3.3V, 10ns, FAST 256K X 32 Asyn SRAM
IC SRAM 8MBIT PARALLEL 90TFBGA
The three parts on the right have similar specifications to AS7C325632-10BINTR.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageMemory DensityAccess Time (Max)RoHS StatusPublishedTerminal PitchLengthHeight Seated (Max)WidthView Compare
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AS7C325632-10BINTR10 WeeksSurface Mount90-TFBGAYES-40°C~85°C TATape & Reel (TR)Active3 (168 Hours)908542.32.00.41SRAM - Asynchronous2.7V~3.6VBOTTOMNOT SPECIFIED13.3VcompliantNOT SPECIFIEDR-PBGA-B903.6V2.7V8Mb 1M x 8VolatileSRAMParallel256KX323210ns8388608 bit10 nsRoHS Compliant------
-
8 WeeksThrough Hole28-DIP (0.300, 7.62mm)NO0°C~70°C TATubeActive3 (168 Hours)288542.32.00.41SRAM - Asynchronous4.5V~5.5VDUALNOT SPECIFIED15V-NOT SPECIFIEDR-PDIP-T285.5V4.5V64Kb 8K x 8VolatileSRAMParallel8KX8815ns65536 bit15 nsNon-RoHS Compliant20092.54mm35.306mm5.334mm7.62mm
-
8 WeeksThrough Hole28-DIP (0.300, 7.62mm)NO0°C~70°C TATape & Reel (TR)Active3 (168 Hours)288542.32.00.41SRAM - Asynchronous4.5V~5.5VDUALNOT SPECIFIED15VcompliantNOT SPECIFIEDR-PDIP-T285.5V4.5V64Kb 8K x 8VolatileSRAMParallel8KX8815ns65536 bit15 nsRoHS Compliant20092.54mm35.306mm5.334mm7.62mm
-
8 WeeksThrough Hole28-DIP (0.300, 7.62mm)--40°C~85°C TATape & Reel (TR)Active3 (168 Hours)--SRAM - Asynchronous4.5V~5.5V---------64Kb 8K x 8VolatileSRAMParallel--15ns--ROHS3 Compliant-----
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