Xilinx Inc. XC7K70T-L2FBG676E

Name: XC7K70T-L2FBG676E
Brand: Xilinx Inc.
SKU: 3129194-XC7K70T-L2FBG676E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7K70T-L2FBG676E

Manufacturer:: Xilinx Inc.

Ventron No:: 3129194-XC7K70T-L2FBG676E

Description:: IC FPGA 300 I/O 676FCBGA

ECAD Model:

Datasheet:: XC7K70T-L2FBG676E

Specifications

Xilinx Inc. XC7K70T-L2FBG676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7K70T-L2FBG676E.

Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
676-BBGA, FCBGA
Number of Pins
676
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2010
Series
Kintex®-7
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.97V~1.03V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.9V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
XC7K70T
Pin Count
676
Number of Outputs
300
Qualification Status
Not Qualified
Operating Supply Voltage
1V
Power Supplies
0.91.83.3V
Number of I/O
300
RAM Size
607.5kB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
65600
Total RAM Bits
4976640
Number of LABs/CLBs
5125
Number of Registers
82000
Combinatorial Delay of a CLB-Max
0.91 ns
Height Seated (Max)
2.54mm
Length
27mm
Width
27mm
RoHS Status
ROHS3 Compliant

Description

XC7K70T-L2FBG676E Overview
The product is a surface mount device with a Pbfree code indicating it is lead-free. It has 676 terminations with a terminal finish of Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5). The voltage supply range is 0.97V to 1.03V. The terminal form is a ball. The qualification status is not qualified, meaning it has not passed the necessary tests for certification. The product has a RAM size of 607.5kB and a total of 5125 LABs/CLBs. The combinatorial delay of a CLB-Max is 0.91 ns.

XC7K70T-L2FBG676E Features
300 I/Os
Up to 4976640 RAM bits
676 LABs/CLBs
82000 registers

XC7K70T-L2FBG676E Applications
There are a lot of Xilinx Inc. XC7K70T-L2FBG676E FPGAs applications.

Medical Applications
Industrial IoT
High Performance Computing
Cryptography
Voice recognition
DO-254
Aircraft navigation
Medical imaging
Defense Applications
Secure Communication

XC7K70T-L2FBG676E More Descriptions

FPGA Kintex-7 Family 65600 Cells 28nm Technology 1V 676-Pin Lidless FCBGA
Field Programmable Gate Array, 1098MHz, 102400-Cell, PBGA484
Product Description Demo for Development.

Product Comparison

The three parts on the right have similar specifications to XC7K70T-L2FBG676E.

Image

Part Number

Manufacturer

Factory Lead Time

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

HTS Code

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

Pin Count

Number of Outputs

Qualification Status

Operating Supply Voltage

Power Supplies

Number of I/O

RAM Size

Programmable Logic Type

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Number of Registers

Combinatorial Delay of a CLB-Max

Height Seated (Max)

Length

Width

RoHS Status

Contact Plating

Surface Mount

JESD-30 Code

Clock Frequency

Propagation Delay

Number of Inputs

Speed Grade

Radiation Hardening

Number of Terminals

Reach Compliance Code

Number of Logic Cells

Memory Size

Memory Type

View Compare
XC7K70T-L2FBG676E

Xilinx Inc.

10 Weeks

Surface Mount

Surface Mount

676-BBGA, FCBGA

676

0°C~100°C TJ

Tray

2010

Kintex®-7

e1

yes

Active

4 (72 Hours)

676

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

0.97V~1.03V

BOTTOM

BALL

NOT SPECIFIED

0.9V

1mm

NOT SPECIFIED

XC7K70T

676

300

Not Qualified

1V

0.91.83.3V

300

607.5kB

FIELD PROGRAMMABLE GATE ARRAY

65600

4976640

5125

82000

0.91 ns

2.54mm

27mm

27mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC7K160T-2FBG676I

Xilinx Inc.

10 Weeks

-

Surface Mount

676-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2010

Kintex®-7

e1

yes

Active

4 (72 Hours)

676

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

0.97V~1.03V

BOTTOM

BALL

-

1V

1mm

-

XC7K160

676

400

-

-

11.83.3V

400

1.4MB

FIELD PROGRAMMABLE GATE ARRAY

162240

11980800

12675

202800

0.61 ns

2.54mm

27mm

27mm

ROHS3 Compliant

Copper, Silver, Tin

YES

S-PBGA-B676

1286MHz

100 ps

400

-2

No

-

-

-

-

-

XC7K70T-L2FBG676E vs XC7K160T-2FBG676I
XC7K410T-1FF676C

Xilinx Inc.

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Field Programmable Gate Arrays

CMOS

-

BOTTOM

BALL

-

-

1mm

-

-

-

400

Not Qualified

-

11.83.3V

-

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

-

-

Non-RoHS Compliant

-

YES

S-PBGA-B676

1818MHz

-

400

-

-

676

compliant

406720

-

-

XC7K70T-L2FBG676E vs XC7K410T-1FF676C
XC7K325T-3FFG900E

Xilinx Inc.

11 Weeks

-

Surface Mount

900-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2009

Kintex®-7

e1

yes

Active

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

0.97V~1.03V

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

NOT SPECIFIED

XC7K325T

900

500

Not Qualified

-

11.83.3V

500

2MB

FIELD PROGRAMMABLE GATE ARRAY

326080

16404480

25475

407600

0.58 ns

3.35mm

31mm

31mm

ROHS3 Compliant

-

YES

S-PBGA-B900

1412MHz

-

500

-3

-

-

not_compliant

-

1GB

DDR3

XC7K70T-L2FBG676E vs XC7K325T-3FFG900E