Xilinx Inc. XC6SLX9-3TQG144C

XC6SLX9-3TQG144C Overview
The package or case for this particular device is a 144-LQFP, which stands for Low Profile Quad Flat Package. This package is commonly used for integrated circuits and provides a compact and efficient design. The operating temperature for this device is 0°C to 85°C, which is a wide range that allows for reliable operation in various environments. The JESD-609 code for this device is e3, indicating that it meets the industry standards for electrostatic discharge sensitivity. The terminal position is QUAD, meaning that the pins are arranged in a square pattern. With a supply voltage of 1.2V, this device is able to operate efficiently while consuming minimal power. The reflow temperature-max (s) is 30, indicating the maximum temperature that the device can withstand during the soldering process. This device also boasts an impressive number of LABs/CLBs, with 715 available for use. The speed grade of 3 ensures fast and efficient performance, while the number of registers, which is 11440, allows for a high level of customization and control. With a width of 20mm, this device offers a compact yet powerful solution for various electronic designs.

XC6SLX9-3TQG144C Features
102 I/Os
Up to 589824 RAM bits
144 LABs/CLBs
11440 registers

XC6SLX9-3TQG144C Applications
There are a lot of Xilinx Inc. XC6SLX9-3TQG144C FPGAs applications.

ASIC prototyping
Aircraft navigation
Cryptography
Software-defined radios
Device controllers
Automotive advanced driver assistance systems (ADAS)
Defense Applications
Aerospace and Defense
Data Center
Security systems