Xilinx Inc. XC6SLX16-N3FTG256C

XC6SLX16-N3FTG256C Overview
Fpga chips is supplied in the BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 186 I/Os for transferring data in a more coherent manner. There are 14579 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. There are 186 outputs incorporated in this device. Fpga chips is designed wFpga chipsh 256 terminations. The RAM si72kBe of this FPGA module reaches 72kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 256 pins. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga electronics operates from a 1.21.2/3.32.5/3.3V power supply. The maximal operating temperature of this module reaches 85°C. The operating temperature should be higher than 0°C. Its basic building block is composed of 1139 logic blocks (LABs). Typically, fpga semiconductor uses a crystal oscillating at 806MHz . There are 18224 registers used to store and transfer data.

XC6SLX16-N3FTG256C Features
186 I/Os
256 LABs/CLBs
85°C gates
1139 logic blocks (LABs)
18224 registers


XC6SLX16-N3FTG256C Applications
There are a lot of Xilinx
XC6SLX16-N3FTG256C FPGAs applications.


Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition