Xilinx Inc. XC6SLX75-2FGG676C
- Part Number:
- XC6SLX75-2FGG676C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3632284-XC6SLX75-2FGG676C
- Description:
- IC FPGA 408 I/O 676FBGA
- Datasheet:
- XC6SLX75-2FGG676C
Xilinx Inc. XC6SLX75-2FGG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6SLX75-2FGG676C.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case676-BGA
- Number of Pins676
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2008
- SeriesSpartan®-6 LX
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC6SLX75
- Pin Count676
- Number of Outputs400
- Qualification StatusNot Qualified
- Number of I/O408
- RAM Size387kB
- Clock Frequency667MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells74637
- Total RAM Bits3170304
- Number of LABs/CLBs5831
- Speed Grade2
- Number of Registers93296
- Height1.84mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
XC6SLX75-2FGG676C Overview
Xilinx Inc. is the brand behind this particular part, which falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. The specific model is part of the Spartan®-6 LX series and is currently active in the market. It is surface mounted and has a 676-BGA package/case. The terminal finish is Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) and has a maximum reflow temperature of 30 seconds. This part has not yet been qualified, but has a RAM size of 387kB and a width of 27mm. Additionally, it is compliant with the ROHS3 standards.
XC6SLX75-2FGG676C Features
408 I/Os
Up to 3170304 RAM bits
676 LABs/CLBs
93296 registers
XC6SLX75-2FGG676C Applications
There are a lot of Xilinx Inc. XC6SLX75-2FGG676C FPGAs applications.
Computer hardware emulation
Data center search engines
Automation
Industrial IoT
Embedded Vision
Software-defined radio
Automotive
Medical Applications
High Performance Computing
DO-254
Xilinx Inc. is the brand behind this particular part, which falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. The specific model is part of the Spartan®-6 LX series and is currently active in the market. It is surface mounted and has a 676-BGA package/case. The terminal finish is Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) and has a maximum reflow temperature of 30 seconds. This part has not yet been qualified, but has a RAM size of 387kB and a width of 27mm. Additionally, it is compliant with the ROHS3 standards.
XC6SLX75-2FGG676C Features
408 I/Os
Up to 3170304 RAM bits
676 LABs/CLBs
93296 registers
XC6SLX75-2FGG676C Applications
There are a lot of Xilinx Inc. XC6SLX75-2FGG676C FPGAs applications.
Computer hardware emulation
Data center search engines
Automation
Industrial IoT
Embedded Vision
Software-defined radio
Automotive
Medical Applications
High Performance Computing
DO-254
XC6SLX75-2FGG676C More Descriptions
FPGA XC6SLX75 Family 46648 Logic Units 74637 Cells 333MHz 1.2V 676-Pin FPBGA
FPGA Spartan-6 LX Family 74637 Cells 45nm (CMOS) Technology 1.2V 676-Pin FBGA
Field Programmable Gate Array, 5831 CLBs, 667MHz, 74637-Cell, CMOS, PBGA676
FPGA Spartan-6 LX Family 74637 Cells 45nm (CMOS) Technology 1.2V 676-Pin FBGA
Field Programmable Gate Array, 5831 CLBs, 667MHz, 74637-Cell, CMOS, PBGA676
The three parts on the right have similar specifications to XC6SLX75-2FGG676C.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountNumber of OutputsQualification StatusNumber of I/ORAM SizeClock FrequencyProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsSpeed GradeNumber of RegistersHeightLengthWidthRoHS StatusHTS CodeOperating Supply VoltagePower SuppliesCombinatorial Delay of a CLB-MaxNumber of CLBsHeight Seated (Max)Surface MountTime@Peak Reflow Temperature-Max (s)JESD-30 CodeNumber of InputsView Compare
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XC6SLX75-2FGG676C10 WeeksSurface MountSurface Mount676-BGA6760°C~85°C TJTray2008Spartan®-6 LXe1yesActive3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate ArraysCMOS1.14V~1.26VBOTTOMBALL2501.2V1mm30XC6SLX75676400Not Qualified408387kB667MHzFIELD PROGRAMMABLE GATE ARRAY74637317030458312932961.84mm27mm27mmROHS3 Compliant-----------
-
10 WeeksSurface MountSurface Mount256-LBGA256-40°C~100°C TJTray2008Spartan®-6 LXe1yesActive3 (168 Hours)256EAR99Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate ArraysCMOS1.14V~1.26VBOTTOMBALL2601V1mm30XC6SLX9256186Not Qualified18672kB-FIELD PROGRAMMABLE GATE ARRAY9152589824715-11440-17mm17mmROHS3 Compliant8542.39.00.011V12.5/3.3V0.46 ns7151.55mm----
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10 WeeksSurface MountSurface Mount256-LBGA2560°C~85°C TJTray2008Spartan®-6 LXe1yesActive3 (168 Hours)256EAR99Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate ArraysCMOS1.14V~1.26VBOTTOMBALL2601V1mm30XC6SLX9256186Not Qualified18672kB-FIELD PROGRAMMABLE GATE ARRAY9152589824715-11440-17mm17mmROHS3 Compliant8542.39.00.011V12.5/3.3V0.46 ns7151.55mm----
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--Surface Mount484-BBGA-0°C~85°C TJTray2008Spartan®-6 LXTe0-Obsolete3 (168 Hours)4843A991.DTin/Lead (Sn63Pb37)Field Programmable Gate ArraysCMOS1.14V~1.26VBOTTOMBALL2251.2V1mm-XC6SLX150-296Not Qualified296-806MHzFIELD PROGRAMMABLE GATE ARRAY147443493977611519---23mm23mmNon-RoHS Compliant8542.39.00.01-1.21.2/3.32.5/3.3V0.26 ns-2.6mmYES30S-PBGA-B484296
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