XC6SLX100T-3FGG484I

Xilinx Inc. XC6SLX100T-3FGG484I

Part Number:
XC6SLX100T-3FGG484I
Manufacturer:
Xilinx Inc.
Ventron No:
3634633-XC6SLX100T-3FGG484I
Description:
IC FPGA 296 I/O 484FBGA
ECAD Model:
Datasheet:
XC6SLX100T-3FGG484I

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Specifications
Xilinx Inc. XC6SLX100T-3FGG484I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6SLX100T-3FGG484I.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    484-BBGA
  • Number of Pins
    484
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2008
  • Series
    Spartan®-6 LXT
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC6SLX100
  • Pin Count
    484
  • Number of Outputs
    296
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    296
  • RAM Size
    603kB
  • Clock Frequency
    862MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    101261
  • Total RAM Bits
    4939776
  • Number of LABs/CLBs
    7911
  • Speed Grade
    3
  • Number of Registers
    126576
  • Combinatorial Delay of a CLB-Max
    0.21 ns
  • Height Seated (Max)
    2.6mm
  • RoHS Status
    ROHS3 Compliant
Description
XC6SLX100T-3FGG484I Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip known as Embedded - FPGAs (Field Programmable Gate Array), which falls under the category of Embedded - FPGAs (Field Programmable Gate Array). It was first released in 2008 and is considered to be environmentally friendly as it is Pbfree (lead-free). Its Moisture Sensitivity Level (MSL) is 3, meaning it can withstand exposure to moisture for up to 168 hours. The chip has a total of 484 terminations and the terminals are in the form of balls. The maximum reflow temperature for this chip is 30 seconds. It has 296 outputs and a clock frequency of 862MHz. The chip has a total of 7911 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks). Currently, it has not yet been officially qualified for use.

XC6SLX100T-3FGG484I Features
296 I/Os
Up to 4939776 RAM bits
484 LABs/CLBs
126576 registers

XC6SLX100T-3FGG484I Applications
There are a lot of Xilinx Inc. XC6SLX100T-3FGG484I FPGAs applications.

Development Boards and Shields for Microcontrollers
Military DSP
Server Applications
Voice recognition
Digital signal processing
Wireless Communications
Industrial,Medical and Scientific Instruments
Security systems
Military Temperature
Enterprise networking
XC6SLX100T-3FGG484I More Descriptions
FPGA Spartan-6 LXT Family 101261 Cells 45nm (CMOS) Technology 1.2V 484-Pin FBGA
Spartan-6 FPGA, 498 Max User I/O, Speed Grade-3, Logic Cells 101261, FGG484, RoHSXilinx SCT
Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA484
FPGA, SPARTAN-6, 296 I/O, FPBGA-484; No. of Logic Blocks:15822; No. of Macrocells:101261Macrocells; FPGA Family:Spartan-6; Logic Case Style:FBGA; No. of Pins:484Pins; No. of Speed Grades:3; Total RAM Bits:4824Kbit; MSL:- RoHS Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to XC6SLX100T-3FGG484I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Number of Outputs
    Qualification Status
    Operating Supply Voltage
    Number of I/O
    RAM Size
    Clock Frequency
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Speed Grade
    Number of Registers
    Combinatorial Delay of a CLB-Max
    Height Seated (Max)
    RoHS Status
    ECCN Code
    Terminal Finish
    HTS Code
    Power Supplies
    Number of CLBs
    Length
    Width
    Surface Mount
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Inputs
    View Compare
  • XC6SLX100T-3FGG484I
    XC6SLX100T-3FGG484I
    10 Weeks
    Surface Mount
    Surface Mount
    484-BBGA
    484
    -40°C~100°C TJ
    Tray
    2008
    Spartan®-6 LXT
    e1
    yes
    Active
    3 (168 Hours)
    484
    Field Programmable Gate Arrays
    CMOS
    1.14V~1.26V
    BOTTOM
    BALL
    250
    1.2V
    1mm
    30
    XC6SLX100
    484
    296
    Not Qualified
    1.2V
    296
    603kB
    862MHz
    FIELD PROGRAMMABLE GATE ARRAY
    101261
    4939776
    7911
    3
    126576
    0.21 ns
    2.6mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC6SLX9-L1FTG256I
    10 Weeks
    Surface Mount
    Surface Mount
    256-LBGA
    256
    -40°C~100°C TJ
    Tray
    2008
    Spartan®-6 LX
    e1
    yes
    Active
    3 (168 Hours)
    256
    Field Programmable Gate Arrays
    CMOS
    1.14V~1.26V
    BOTTOM
    BALL
    260
    1V
    1mm
    30
    XC6SLX9
    256
    186
    Not Qualified
    1V
    186
    72kB
    -
    FIELD PROGRAMMABLE GATE ARRAY
    9152
    589824
    715
    -
    11440
    0.46 ns
    1.55mm
    ROHS3 Compliant
    EAR99
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.39.00.01
    12.5/3.3V
    715
    17mm
    17mm
    -
    -
    -
    -
    -
  • XC6SLX9-L1FTG256C
    10 Weeks
    Surface Mount
    Surface Mount
    256-LBGA
    256
    0°C~85°C TJ
    Tray
    2008
    Spartan®-6 LX
    e1
    yes
    Active
    3 (168 Hours)
    256
    Field Programmable Gate Arrays
    CMOS
    1.14V~1.26V
    BOTTOM
    BALL
    260
    1V
    1mm
    30
    XC6SLX9
    256
    186
    Not Qualified
    1V
    186
    72kB
    -
    FIELD PROGRAMMABLE GATE ARRAY
    9152
    589824
    715
    -
    11440
    0.46 ns
    1.55mm
    ROHS3 Compliant
    EAR99
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.39.00.01
    12.5/3.3V
    715
    17mm
    17mm
    -
    -
    -
    -
    -
  • XC6SLX16-N3FT256I
    -
    -
    Surface Mount
    256-LBGA
    -
    -40°C~100°C TJ
    Tray
    2008
    Spartan®-6 LX
    e0
    -
    Obsolete
    3 (168 Hours)
    256
    Field Programmable Gate Arrays
    CMOS
    1.14V~1.26V
    BOTTOM
    BALL
    240
    1.2V
    1mm
    -
    XC6SLX16
    -
    186
    Not Qualified
    -
    186
    -
    806MHz
    FIELD PROGRAMMABLE GATE ARRAY
    14579
    589824
    1139
    -
    -
    0.26 ns
    1.55mm
    Non-RoHS Compliant
    EAR99
    Tin/Lead (Sn63Pb37)
    8542.39.00.01
    1.21.2/3.32.5/3.3V
    -
    17mm
    17mm
    YES
    not_compliant
    30
    S-PBGA-B256
    186
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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