XC5VFX70T-1FFG1136I

Xilinx Inc. XC5VFX70T-1FFG1136I

Part Number:
XC5VFX70T-1FFG1136I
Manufacturer:
Xilinx Inc.
Ventron No:
3130974-XC5VFX70T-1FFG1136I
Description:
IC FPGA 640 I/O 1136FCBGA
ECAD Model:
Datasheet:
XC5VFX70T-1FFG1136I

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Specifications
Xilinx Inc. XC5VFX70T-1FFG1136I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC5VFX70T-1FFG1136I.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    1136-BBGA, FCBGA
  • Number of Pins
    1136
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Virtex®-5 FXT
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    0.95V~1.05V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC5VFX70T
  • Number of Outputs
    640
  • Qualification Status
    Not Qualified
  • Number of I/O
    640
  • RAM Size
    666kB
  • Organization
    6080 CLBS
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    71680
  • Total RAM Bits
    5455872
  • Number of LABs/CLBs
    5600
  • Speed Grade
    1
  • Number of CLBs
    6080
  • Height Seated (Max)
    3.4mm
  • Length
    35mm
  • Width
    35mm
  • RoHS Status
    ROHS3 Compliant
Description
XC5VFX70T-1FFG1136I Overview
The number of pins for this particular electronic component is 1136. It has an operating temperature range of -40°C to 100°C TJ, making it suitable for use in a wide variety of environments. The packaging for this component is a tray, which is commonly used for shipping and storing electronic parts. The terminal position is located at the bottom of the component, allowing for easy installation and connection. The peak reflow temperature for this component is 245°C, ensuring that it can withstand high heat during the manufacturing process. It has a total of 640 outputs, providing ample connectivity options. The RAM size is 666kB, providing enough memory for efficient operation. With 71680 logic elements/cells and 5600 LABs/CLBs, this component offers powerful processing capabilities. It has a speed grade of 1, indicating high performance and fast data processing.

XC5VFX70T-1FFG1136I Features
640 I/Os
Up to 5455872 RAM bits
1136 LABs/CLBs

XC5VFX70T-1FFG1136I Applications
There are a lot of Xilinx Inc. XC5VFX70T-1FFG1136I FPGAs applications.

Scientific Instruments
Audio
OpenCL
Distributed Monetary Systems
Enterprise networking
Aircraft navigation
Defense Applications
Integrating multiple SPLDs
Data center hardware accelerators
Artificial intelligence (AI)
XC5VFX70T-1FFG1136I More Descriptions
FPGA Virtex-5 FXT Family 65nm (CMOS) Technology 1V 1136-Pin FC-BGA
FPGA - Field Programmable Gate Array XC5VFX70T-1FFG1136I
Product Description Demo for Development.
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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