XC4VLX25-11SF363C

Xilinx Inc. XC4VLX25-11SF363C

Part Number:
XC4VLX25-11SF363C
Manufacturer:
Xilinx Inc.
Ventron No:
3635668-XC4VLX25-11SF363C
Description:
IC FPGA 240 I/O 363FCBGA
ECAD Model:
Datasheet:
XC4VLX25-11SF363C

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Specifications
Xilinx Inc. XC4VLX25-11SF363C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VLX25-11SF363C.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    363-FBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Bulk
  • Series
    Virtex®-4 LX
  • Published
    1999
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    363
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.8mm
  • Reach Compliance Code
    not_compliant
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Pin Count
    363
  • JESD-30 Code
    S-PBGA-B363
  • Number of Outputs
    240
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    240
  • RAM Size
    162kB
  • Clock Frequency
    1205MHz
  • Number of Inputs
    240
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    24192
  • Total RAM Bits
    1327104
  • Number of LABs/CLBs
    2688
  • Speed Grade
    11
  • Length
    17mm
  • Height Seated (Max)
    1.99mm
  • Width
    17mm
  • RoHS Status
    Non-RoHS Compliant
Description
XC4VLX25-11SF363C Overview
Fpga chips is supplied in the 363-FBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 240 I/Os for transferring data in a more coherent manner. There are 24192 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Virtex®-4 LX seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 240 outputs incorporated in this device. This FPGA model is contained in Bulk for space saving. Fpga chips is designed wFpga chipsh 363 terminations. The RAM bits that this device offer is 1327104. The RAM si162kBe of this FPGA module reaches 162kB to ensure normal operation of the program. This FPGA is built as an array of 2688 LABs/CLBs. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga semiconductor is equipped wfpga semiconductorh 363 pin count. Typically, fpga semiconductor uses a crystal oscillating at 1205MHz .

XC4VLX25-11SF363C Features
240 I/Os
Up to 1327104 RAM bits


XC4VLX25-11SF363C Applications
There are a lot of Xilinx Inc.
XC4VLX25-11SF363C FPGAs applications.


Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
XC4VLX25-11SF363C More Descriptions
FPGA Virtex-4 LX Family 24192 Cells 90nm (CMOS) Technology 1.2V 363-Pin FCBGA
FPGA - Field Programmable Gate Array
IC FPGA 240 I/O 363FCBGA
Contact for details
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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