Xilinx Inc. XC4VLX15-10SFG363C
- Part Number:
- XC4VLX15-10SFG363C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3128023-XC4VLX15-10SFG363C
- Description:
- IC FPGA 240 I/O 363FCBGA
- Datasheet:
- XC4VLX15-10SFG363C
Xilinx Inc. XC4VLX15-10SFG363C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VLX15-10SFG363C.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case363-FBGA, FCBGA
- Number of Pins363
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published1999
- SeriesVirtex®-4 LX
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations363
- Terminal FinishTin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Terminal Pitch0.8mm
- Reach Compliance Codenot_compliant
- Base Part NumberXC4VLX15
- Number of Outputs240
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.32.5V
- Number of I/O240
- RAM Size108kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells13824
- Total RAM Bits884736
- Number of LABs/CLBs1536
- Speed Grade10
- RoHS StatusROHS3 Compliant
XC4VLX15-10SFG363C Overview
The manufacturer of this component is Xilinx Inc. and it falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was first released in 1999 and is part of the Virtex®-4 LX series. It is designed for surface mounting and has a JESD-609 Code of e1. The Moisture Sensitivity Level (MSL) is 4, meaning it can withstand exposure to moisture for up to 72 hours. It has a total of 363 terminations and these are located at the bottom of the chip in a ball form. Currently, it has not been qualified for use. The chip contains 1536 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks) which are used for implementing logic functions.
XC4VLX15-10SFG363C Features
240 I/Os
Up to 884736 RAM bits
363 LABs/CLBs
XC4VLX15-10SFG363C Applications
There are a lot of Xilinx Inc. XC4VLX15-10SFG363C FPGAs applications.
Data Center
Automotive Applications
Software-defined radios
Medical Applications
Filtering and communication encoding
Automation
Consumer Electronics
Data center hardware accelerators
Voice recognition
Audio
The manufacturer of this component is Xilinx Inc. and it falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was first released in 1999 and is part of the Virtex®-4 LX series. It is designed for surface mounting and has a JESD-609 Code of e1. The Moisture Sensitivity Level (MSL) is 4, meaning it can withstand exposure to moisture for up to 72 hours. It has a total of 363 terminations and these are located at the bottom of the chip in a ball form. Currently, it has not been qualified for use. The chip contains 1536 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks) which are used for implementing logic functions.
XC4VLX15-10SFG363C Features
240 I/Os
Up to 884736 RAM bits
363 LABs/CLBs
XC4VLX15-10SFG363C Applications
There are a lot of Xilinx Inc. XC4VLX15-10SFG363C FPGAs applications.
Data Center
Automotive Applications
Software-defined radios
Medical Applications
Filtering and communication encoding
Automation
Consumer Electronics
Data center hardware accelerators
Voice recognition
Audio
XC4VLX15-10SFG363C More Descriptions
FPGA Virtex-4 LX Family 13824 Cells 90nm (CMOS) Technology 1.2V 363-Pin FCBGA
Field Programmable Gate Array, 1536 CLBs, 1028MHz, 13824-Cell, CMOS, PBGA363
FCBGA-363 Programmable Logic Device (CPLDs/FPGAs) ROHS
Field Programmable Gate Array, 1536 CLBs, 1028MHz, 13824-Cell, CMOS, PBGA363
FCBGA-363 Programmable Logic Device (CPLDs/FPGAs) ROHS
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