Xilinx Inc. XC3S1000-5FG456C

XC3S1000-5FG456C Overview
Xilinx Inc. is a well-known brand in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. This particular chip falls under the category of Embedded - FPGAs (Field Programmable Gate Array) and is highly sought after for its versatility and flexibility. The package/case of this chip is 456-BBGA, making it compact and suitable for a wide range of applications. It has an operating temperature range of 0°C to 85°C TJ, ensuring its reliability and stability in various environments. Published in 2006, this chip has been in the market for over a decade and has proven to be a reliable and efficient choice for many users. With a moisture sensitivity level of 3 (168 Hours), it can withstand moderate levels of moisture without compromising its performance. The terminal position of this chip is at the bottom, and its terminal form is ball, making it easy to install and connect. It boasts 333 outputs, making it capable of handling complex tasks and data processing. While it is not yet qualified, it has a high qualification status, making it a promising choice for future projects. With 333 I/Os and 1920 LABs/CLBs, this chip offers a high level of functionality and can be customized to meet specific requirements. Overall, the Xilinx Inc. Embedded - FPGAs chip is a top choice for those looking for a reliable, high-performance, and versatile solution for their embedded systems.

XC3S1000-5FG456C Features
333 I/Os
Up to 442368 RAM bits
456 LABs/CLBs

XC3S1000-5FG456C Applications
There are a lot of Xilinx Inc. XC3S1000-5FG456C FPGAs applications.

Industrial Ethernet
Software-defined radios
Ecosystem
Consumer Electronics
Computer hardware emulation
Cryptography
Voice recognition
Image processing
Distributed Monetary Systems
Medical ultrasounds