Xilinx Inc. XC2S50E-6FTG256I

Name: XC2S50E-6FTG256I
Brand: Xilinx Inc.
SKU: 3133265-XC2S50E-6FTG256I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC2S50E-6FTG256I

Manufacturer:: Xilinx Inc.

Ventron No:: 3133265-XC2S50E-6FTG256I

Description:: IC FPGA 182 I/O 256FTBGA

ECAD Model:

Datasheet:: XC2S50E-6FTG256I

Specifications

Xilinx Inc. XC2S50E-6FTG256I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2S50E-6FTG256I.

Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2008
Series
Spartan®-IIE
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.71V~1.89V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
XC2S50E
Pin Count
256
Number of Outputs
182
Operating Supply Voltage
1.8V
Number of I/O
182
RAM Size
4kB
Clock Frequency
357MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1728
Total RAM Bits
32768
Number of Gates
50000
Number of LABs/CLBs
384
Speed Grade
6
Combinatorial Delay of a CLB-Max
0.47 ns
Number of CLBs
384
Number of Equivalent Gates
23000
Height Seated (Max)
2mm
Length
17mm
Width
17mm
Radiation Hardening
No
RoHS Status
RoHS Compliant
Lead Free
Lead Free

Description

XC2S50E-6FTG256I Overview
Xilinx Inc. is the brand of this part, which is an Embedded - FPGAs (Field Programmable Gate Array) chip belonging to the Embedded - FPGAs (Field Programmable Gate Array) category. It was published in 2008 and is now considered obsolete. The part has a surface mount and a package/case of 256-LBGA. It has 256 terminations located at the bottom with a terminal pitch of 1mm. The RAM size is 4kB and the maximum seated height is 2mm. It does not have radiation hardening.

XC2S50E-6FTG256I Features
182 I/Os
Up to 32768 RAM bits
256 LABs/CLBs

XC2S50E-6FTG256I Applications
There are a lot of Xilinx Inc. XC2S50E-6FTG256I FPGAs applications.

Automotive driver's assistance
Telecommunication
Scientific Instruments
High Performance Computing
Data Center
ASIC prototyping
Data center search engines
Data center hardware accelerators
Random logic
Medical imaging

XC2S50E-6FTG256I More Descriptions

Field Programmable Gate Array, 357MHz, 1728-Cell, CMOS, PQFP208
Product Description Demo for Development.
SPARTAN-IIE FIELD PROGRAMMABLE G

Certification