Xilinx Inc. XC17S30PD8C

Name: XC17S30PD8C
Brand: Xilinx Inc.
SKU: 3246676-XC17S30PD8C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC17S30PD8C

Manufacturer:: Xilinx Inc.

Ventron No:: 3246676-XC17S30PD8C

Description:: IC PROM PROG C-TEMP 5V 8-DIP

ECAD Model:

Datasheet:: XC17S30PD8C

Specifications

Xilinx Inc. XC17S30PD8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S30PD8C.

Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Surface Mount
NO
Number of Pins
8
Operating Temperature
0°C~70°C
Packaging
Tube
Published
1996
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Number of Terminations
8
ECCN Code
EAR99
Technology
CMOS
Voltage - Supply
4.75V~5.25V
Terminal Position
DUAL
Number of Functions
1
Supply Voltage
5V
Terminal Pitch
2.54mm
Reach Compliance Code
not_compliant
Base Part Number
XC17S30
Pin Count
8
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.25V
Power Supplies
5V
Supply Voltage-Min (Vsup)
4.75V
Programmable Type
OTP
Memory Size
300kb
Operating Mode
SYNCHRONOUS
Clock Frequency
10MHz
Supply Current-Max
0.01mA
Output Characteristics
3-STATE
Memory Width
1
Standby Current-Max
0.00005A
I/O Type
COMMON
Memory IC Type
MEMORY CIRCUIT
Height Seated (Max)
4.5974mm
Length
9.3599mm
Width
7.62mm
RoHS Status
Non-RoHS Compliant
Lead Free
Contains Lead

Description

XC17S30PD8C Overview
This package is based on a neat 8-DIP (0.300, 7.62mm) package which is used by it.Packaging for external use.Qualified to perform a variety of tasks within the 0°C~70°C environment.FPGA is programmable through OTP.The voltage fed to it is 4.75V~5.25V.The memory device is mounted in Through Hole.Data storage is limited to 300kb bytes.Search "XC17S30" for related parts.The supply voltage of the device must be 5V in order to operate correctly.With different functions, 8 terminations can be used.This memory device can be used with a maximum voltage of 5.25V.If the device needs to be supplied with power, then a minimum voltage of 4.75V is required.An example of a MEMORY CIRCUIT memory chip can be seen in the picture below.The 8 pins are on the board.A memory chip can operate at a voltage no greater than 0.01mA.With the part are included 8 pins.An IC that can work at 10MHz frequency is a memory IC.This memory has a COMMON configuration for its I/O.Memory is recommended that a 5V power supply be used.

XC17S30PD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S30PD8C Applications
There are a lot of Xilinx Inc. XC17S30PD8C applications of configuration proms for FPGAs.

graphics card
printers
networking
personal computers
Camcorders
networks
servers
cell phones
main computer memory
personal digital assistants

XC17S30PD8C More Descriptions

XC17S30 EAR99 Tube 1996 ics fpga configuration 7.62mm 0.00005A 300kb 5V
Memory Circuit, 247968X1, CMOS, PDSO8
IC PROM PROG C-TEMP 5V 8-DIP
IC PROM SER 300K 8-SOIC
OEMs, CMs ONLY (NO BROKERS)

Product Comparison

The three parts on the right have similar specifications to XC17S30PD8C.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Number of Pins

Operating Temperature

Packaging

Published

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Technology

Voltage - Supply

Terminal Position

Number of Functions

Supply Voltage

Terminal Pitch

Reach Compliance Code

Base Part Number

Pin Count

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

Programmable Type

Memory Size

Operating Mode

Clock Frequency

Supply Current-Max

Output Characteristics

Memory Width

Standby Current-Max

I/O Type

Memory IC Type

Height Seated (Max)

Length

Width

RoHS Status

Lead Free

Terminal Finish

Additional Feature

HTS Code

Terminal Form

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Organization

Memory Density

Parallel/Serial

Pbfree Code

JESD-30 Code

View Compare
XC17S30PD8C

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

0°C~70°C

Tube

1996

e0

Obsolete

Not Applicable

8

EAR99

CMOS

4.75V~5.25V

DUAL

1

5V

2.54mm

not_compliant

XC17S30

8

Not Qualified

5.25V

5V

4.75V

OTP

300kb

SYNCHRONOUS

10MHz

0.01mA

3-STATE

1

0.00005A

COMMON

MEMORY CIRCUIT

4.5974mm

9.3599mm

7.62mm

Non-RoHS Compliant

Contains Lead

-

-

-

-

-

-

-

-

-

-

-

-
XC17256ELPC20I

Xilinx Inc.

Surface Mount

20-LCC (J-Lead)

YES

20

-40°C~85°C

Tube

2000

e0

Obsolete

3 (168 Hours)

20

EAR99

CMOS

3V~3.6V

QUAD

1

3.3V

1.27mm

not_compliant

XC17256EL

20

Not Qualified

3.6V

3.3V

3V

OTP

256Kb

SYNCHRONOUS

15MHz

0.005mA

3-STATE

1

0.00005A

COMMON

CONFIGURATION MEMORY

4.572mm

8.9662mm

8.9662mm

Non-RoHS Compliant

Contains Lead

Tin/Lead (Sn85Pb15)

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

8542.32.00.61

J BEND

225

30

256KX1

262144 bit

SERIAL

-

-

XC17S30PD8C vs XC17256ELPC20I
XC1736EPC20C

Xilinx Inc.

Surface Mount

20-LCC (J-Lead)

YES

-

0°C~70°C

Tube

-

e0

Obsolete

3 (168 Hours)

20

-

CMOS

4.75V~5.25V

QUAD

1

5V

1.27mm

unknown

-

20

COMMERCIAL

5.25V

-

4.75V

OTP

36kb

SYNCHRONOUS

-

-

-

1

-

-

CONFIGURATION MEMORY

4.572mm

8.9662mm

8.9662mm

Non-RoHS Compliant

-

TIN LEAD

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

-

J BEND

225

30

36288X1

36288 bit

SERIAL

no

S-PQCC-J20

XC17S30PD8C vs XC1736EPC20C
XC1701LPD8C

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

0°C~70°C

Tube

2000

e0

Obsolete

Not Applicable

8

EAR99

CMOS

3V~3.6V

DUAL

1

3.3V

2.54mm

not_compliant

XC1701L

8

Not Qualified

3.6V

3.3V

3V

OTP

1Mb

SYNCHRONOUS

15MHz

0.01mA

3-STATE

1

0.00005A

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

Non-RoHS Compliant

Contains Lead

-

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

-

-

225

30

1MX1

-

SERIAL

no

-

XC17S30PD8C vs XC1701LPD8C