Xilinx Inc. XC17S30APD8C
- Part Number:
- XC17S30APD8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3730463-XC17S30APD8C
- Description:
- IC PROM SER 30000 C-TEMP 8-DIP
- Datasheet:
- XC17S30APD8C
Xilinx Inc. XC17S30APD8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S30APD8C.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published1999
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- ECCN CodeEAR99
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch2.54mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S30
- Pin Count8
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size300kb
- Supply Current-Max0.005mA
- Output Characteristics3-STATE
- Memory Width1
- Density512 kb
- Standby Current-Max0.00005A
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC17S30APD8C Overview
There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packing on the outside is Tube.0°C~70°C license holder.The OTP programming language can be used to program it.A voltage of 3V~3.6V is applied to it.This memory device is mounted in Through Hole.Data storage is limited to 300kb bytes.To find other similar parts, search for "XC17S30".The supply voltage should be 3.3V.Different functions are associated with 8 terminations.With 3.6V as the maximum voltage, the memory device can be used.To supply the device, a minimum voltage of 3V is a must.The memory chip in question is a CONFIGURATION MEMORY memory chip.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.Pins on it are 8-shaped.SERIAL-process memory transmits data.The memory chip operates at a voltage of no more than 0.005mA.With the part are included 8 pins.A COMMON configuration is used for the memory's I/O.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.
XC17S30APD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S30APD8C Applications
There are a lot of Xilinx Inc. XC17S30APD8C applications of configuration proms for FPGAs.
DVD disk buffer
cell phones
workstations,
personal digital assistants
personal computers
eSRAM
eDRAM
servers
graphics card
telecommunications
There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packing on the outside is Tube.0°C~70°C license holder.The OTP programming language can be used to program it.A voltage of 3V~3.6V is applied to it.This memory device is mounted in Through Hole.Data storage is limited to 300kb bytes.To find other similar parts, search for "XC17S30".The supply voltage should be 3.3V.Different functions are associated with 8 terminations.With 3.6V as the maximum voltage, the memory device can be used.To supply the device, a minimum voltage of 3V is a must.The memory chip in question is a CONFIGURATION MEMORY memory chip.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.Pins on it are 8-shaped.SERIAL-process memory transmits data.The memory chip operates at a voltage of no more than 0.005mA.With the part are included 8 pins.A COMMON configuration is used for the memory's I/O.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.
XC17S30APD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S30APD8C Applications
There are a lot of Xilinx Inc. XC17S30APD8C applications of configuration proms for FPGAs.
DVD disk buffer
cell phones
workstations,
personal digital assistants
personal computers
eSRAM
eDRAM
servers
graphics card
telecommunications
XC17S30APD8C More Descriptions
XC17S30 EAR99 Tube 1999 ics fpga configuration 7.62mm 0.00005A 300kb 3.3V
Configuration Memory, 336768X1, Serial, CMOS, PDSO20
PROM Serial 512K-bit 3.3V 8-Pin PDIP
Product Description Demo for Development.
IC PROM PROG I-TEMP 3.3V 8-SOIC
IC PROM SER 30000 C-TEMP 8-DIP
Configuration Memory, 336768X1, Serial, CMOS, PDSO20
PROM Serial 512K-bit 3.3V 8-Pin PDIP
Product Description Demo for Development.
IC PROM PROG I-TEMP 3.3V 8-SOIC
IC PROM SER 30000 C-TEMP 8-DIP
The three parts on the right have similar specifications to XC17S30APD8C.
-
ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable TypeMemory SizeSupply Current-MaxOutput CharacteristicsMemory WidthDensityStandby Current-MaxParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusLead FreeTerminal FinishAdditional FeatureHTS CodeTerminal FormReach Compliance CodeQualification StatusPower SuppliesOperating ModeClock FrequencyOrganizationMemory DensityJESD-30 CodeView Compare
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XC17S30APD8CThrough Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube1999e0noObsolete1 (Unlimited)8EAR99CMOS3V~3.6VDUAL22513.3V2.54mm30XC17S3083.3V3.6V3VOTP300kb0.005mA3-STATE1512 kb0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNoNon-RoHS CompliantContains Lead-------------
-
Surface Mount20-LCC (J-Lead)YES20-40°C~85°CTube2000e0-Obsolete3 (168 Hours)20EAR99CMOS3V~3.6VQUAD22513.3V1.27mm30XC17256EL20-3.6V3VOTP256Kb0.005mA3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY4.572mm8.9662mm8.9662mm-Non-RoHS CompliantContains LeadTin/Lead (Sn85Pb15)USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS8542.32.00.61J BENDnot_compliantNot Qualified3.3VSYNCHRONOUS15MHz256KX1262144 bit-
-
Surface Mount20-LCC (J-Lead)YES-0°C~70°CTube-e0noObsolete3 (168 Hours)20-CMOS4.75V~5.25VQUAD22515V1.27mm30-20-5.25V4.75VOTP36kb--1--SERIAL-CONFIGURATION MEMORY4.572mm8.9662mm8.9662mm-Non-RoHS Compliant-TIN LEADUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS-J BENDunknownCOMMERCIAL-SYNCHRONOUS-36288X136288 bitS-PQCC-J20
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL22513.3V2.54mm30XC17128EL8-3.6V3VOTP128kb0.005mA3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains Lead-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS--not_compliantNot Qualified3.3VSYNCHRONOUS15MHz-131072 bit-
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