Xilinx Inc. XC17S200APDG8C
- Part Number:
- XC17S200APDG8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3729347-XC17S200APDG8C
- Description:
- IC PROM SER 200K C-TEMP 8-DIP
- Datasheet:
- XC17S200APDG8C
Xilinx Inc. XC17S200APDG8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S200APDG8C.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published1999
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)250
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch2.54mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S200A
- Pin Count8
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size2Mb
- Supply Current-Max0.015mA
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.001A
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
XC17S200APDG8C Overview
This package is based on a neat 8-DIP (0.300, 7.62mm) package which is used by it.Packaging for the external use of Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.Through OTP, it is programmable.A voltage of 3V~3.6V is applied to it.There is a memory device mounted in Through Hole position for this device.A maximum of 2Mb bytes of data can be stored.XC17S200A will give you other related parts.The supply voltage of the device must be 3.3V in order to operate correctly.There are different functions associated with 8 terminations.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.A CONFIGURATION MEMORY memory chip is shown here.When soldering in reflow mode, the temperature should be kept below 250 at all times during the soldering process.There are 8 pins on it.This memory transmit data in the SERIAL process way.The memory chip is allowed to operate from a voltage no higher than 0.015mA.There is a set of 8 pins that are included with the part.A COMMON configuration is used for the memory's I/O.Prior to the use of the part in a circuit, it is recommended that users apply the 3.3V to the part so that the part will run as safely and reliably as possible.
XC17S200APDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200APDG8C Applications
There are a lot of Xilinx Inc. XC17S200APDG8C applications of configuration proms for FPGAs.
personal digital assistants
data buffer
supercomputers
embedded logic
eDRAM
servers
mainframes
workstations,
eSRAM
Cache memory
This package is based on a neat 8-DIP (0.300, 7.62mm) package which is used by it.Packaging for the external use of Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.Through OTP, it is programmable.A voltage of 3V~3.6V is applied to it.There is a memory device mounted in Through Hole position for this device.A maximum of 2Mb bytes of data can be stored.XC17S200A will give you other related parts.The supply voltage of the device must be 3.3V in order to operate correctly.There are different functions associated with 8 terminations.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.A CONFIGURATION MEMORY memory chip is shown here.When soldering in reflow mode, the temperature should be kept below 250 at all times during the soldering process.There are 8 pins on it.This memory transmit data in the SERIAL process way.The memory chip is allowed to operate from a voltage no higher than 0.015mA.There is a set of 8 pins that are included with the part.A COMMON configuration is used for the memory's I/O.Prior to the use of the part in a circuit, it is recommended that users apply the 3.3V to the part so that the part will run as safely and reliably as possible.
XC17S200APDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200APDG8C Applications
There are a lot of Xilinx Inc. XC17S200APDG8C applications of configuration proms for FPGAs.
personal digital assistants
data buffer
supercomputers
embedded logic
eDRAM
servers
mainframes
workstations,
eSRAM
Cache memory
XC17S200APDG8C More Descriptions
Configuration Memory, 1335840X1, Serial, CMOS, PDSO8
PROM Serial 1.6M-bit 3.3V 8-Pin PDIP
IC PROM PROG C-TEMP 3.3V 8-DIP
PROM Serial 1.6M-bit 3.3V 8-Pin PDIP
IC PROM PROG C-TEMP 3.3V 8-DIP
The three parts on the right have similar specifications to XC17S200APDG8C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable TypeMemory SizeSupply Current-MaxOutput CharacteristicsMemory WidthStandby Current-MaxParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusAdditional FeatureHTS CodeTerminal FormReach Compliance CodeQualification StatusPower SuppliesOperating ModeClock FrequencyOrganizationMemory DensityLead FreeView Compare
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XC17S200APDG8CThrough Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube1999e3yesObsolete1 (Unlimited)8EAR99Matte Tin (Sn)CMOS3V~3.6VDUAL25013.3V2.54mm30XC17S200A83.3V3.6V3VOTP2Mb0.015mA3-STATE10.001ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNoRoHS Compliant------------
-
Surface Mount20-LCC (J-Lead)YES20-40°C~85°CTube2000e0-Obsolete3 (168 Hours)20EAR99Tin/Lead (Sn85Pb15)CMOS3V~3.6VQUAD22513.3V1.27mm30XC17256EL20-3.6V3VOTP256Kb0.005mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY4.572mm8.9662mm8.9662mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS8542.32.00.61J BENDnot_compliantNot Qualified3.3VSYNCHRONOUS15MHz256KX1262144 bitContains Lead
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99-CMOS4.5V~5.5VDUAL22515V1.27mm30XC17128E8-5.5V4.5VOTP128kb0.01mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS-GULL WINGnot_compliantNot Qualified5VSYNCHRONOUS15MHz-131072 bitContains Lead
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99-CMOS4.5V~5.5VDUAL22515V2.54mm30XC17128E8-5.5V4.5VOTP128kb0.01mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS--not_compliantNot Qualified5VSYNCHRONOUS15MHz-131072 bitContains Lead
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