XC17S200APD8I

Xilinx Inc. XC17S200APD8I

Part Number:
XC17S200APD8I
Manufacturer:
Xilinx Inc.
Ventron No:
3730368-XC17S200APD8I
Description:
IC PROM SER 200000 I-TEMP 8-DIP
ECAD Model:
Datasheet:
XC17S200APD8I

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Specifications
Xilinx Inc. XC17S200APD8I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S200APD8I.
  • Mounting Type
    Through Hole
  • Package / Case
    8-DIP (0.300, 7.62mm)
  • Surface Mount
    NO
  • Number of Pins
    8
  • Operating Temperature
    -40°C~85°C
  • Packaging
    Tube
  • Published
    1999
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    Not Applicable
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Technology
    CMOS
  • Voltage - Supply
    3V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    225
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    2.54mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC17S200A
  • Pin Count
    8
  • Operating Supply Voltage
    3.3V
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    3V
  • Programmable Type
    OTP
  • Memory Size
    2Mb
  • Supply Current-Max
    0.015mA
  • Output Characteristics
    3-STATE
  • Memory Width
    1
  • Standby Current-Max
    0.001A
  • Parallel/Serial
    SERIAL
  • I/O Type
    COMMON
  • Memory IC Type
    CONFIGURATION MEMORY
  • Height Seated (Max)
    4.5974mm
  • Length
    9.3599mm
  • Width
    7.62mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Contains Lead
Description
XC17S200APD8I Overview
A neat 8-DIP (0.300, 7.62mm) package is used.External packaging for the Tube series.Licensed to operate in -40°C~85°C.With the help of OTP, it can be programmed.This device is fed with a voltage of 3V~3.6V which is applied to it.Mounted in Through Hole is this memory device.Data storage is limited to a size of 2Mb bytes.Search "XC17S200A" for related parts.Supply voltage 3.3V is required.Various functions can be applied to 8 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.There are 8 pins on it.Through SERIAL-processing, data is transmitted from this memory to the CPU.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.015mA.Parts come with 8 pins.There is a configuration of COMMON for the memory's I/O.To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the part.

XC17S200APD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S200APD8I Applications
There are a lot of Xilinx Inc. XC17S200APD8I applications of configuration proms for FPGAs.

cell phones
telecommunications
personal computers
multimedia computers
data buffer
eSRAM
mainframes
personal digital assistants
networking
DVD disk buffer
XC17S200APD8I More Descriptions
Configuration Memory, 1335840X1, Serial, CMOS, PDIP8
XC17S200A EAR99 Tube 1999 ics fpga configuration 7.62mm 0.001A 2Mb 3.3V
PROM Serial 1.6M-bit 3.3V 8-Pin PDIP
IC PROM SER 200000 I-TEMP 8-DIP
Product Comparison
The three parts on the right have similar specifications to XC17S200APD8I.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Programmable Type
    Memory Size
    Supply Current-Max
    Output Characteristics
    Memory Width
    Standby Current-Max
    Parallel/Serial
    I/O Type
    Memory IC Type
    Height Seated (Max)
    Length
    Width
    Radiation Hardening
    RoHS Status
    Lead Free
    Additional Feature
    Clock Frequency
    Organization
    Density
    Terminal Finish
    HTS Code
    Terminal Form
    Reach Compliance Code
    Qualification Status
    Power Supplies
    Operating Mode
    Memory Density
    View Compare
  • XC17S200APD8I
    XC17S200APD8I
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    -40°C~85°C
    Tube
    1999
    e0
    no
    Obsolete
    Not Applicable
    8
    EAR99
    CMOS
    3V~3.6V
    DUAL
    225
    1
    3.3V
    2.54mm
    30
    XC17S200A
    8
    3.3V
    3.6V
    3V
    OTP
    2Mb
    0.015mA
    3-STATE
    1
    0.001A
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    No
    Non-RoHS Compliant
    Contains Lead
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC17256ELPD8I
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    -40°C~85°C
    Tube
    2000
    e0
    -
    Obsolete
    Not Applicable
    8
    EAR99
    CMOS
    3V~3.6V
    DUAL
    225
    1
    3.3V
    2.54mm
    30
    XC17256EL
    8
    3.3V
    3.6V
    3V
    OTP
    256Kb
    0.005mA
    3-STATE
    1
    0.00005A
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    No
    Non-RoHS Compliant
    Contains Lead
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    15MHz
    256KX1
    256 kb
    -
    -
    -
    -
    -
    -
    -
    -
  • XC17256ELPC20I
    Surface Mount
    20-LCC (J-Lead)
    YES
    20
    -40°C~85°C
    Tube
    2000
    e0
    -
    Obsolete
    3 (168 Hours)
    20
    EAR99
    CMOS
    3V~3.6V
    QUAD
    225
    1
    3.3V
    1.27mm
    30
    XC17256EL
    20
    -
    3.6V
    3V
    OTP
    256Kb
    0.005mA
    3-STATE
    1
    0.00005A
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.572mm
    8.9662mm
    8.9662mm
    -
    Non-RoHS Compliant
    Contains Lead
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    15MHz
    256KX1
    -
    Tin/Lead (Sn85Pb15)
    8542.32.00.61
    J BEND
    not_compliant
    Not Qualified
    3.3V
    SYNCHRONOUS
    262144 bit
  • XC1701LPD8C
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    0°C~70°C
    Tube
    2000
    e0
    no
    Obsolete
    Not Applicable
    8
    EAR99
    CMOS
    3V~3.6V
    DUAL
    225
    1
    3.3V
    2.54mm
    30
    XC1701L
    8
    -
    3.6V
    3V
    OTP
    1Mb
    0.01mA
    3-STATE
    1
    0.00005A
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    -
    Non-RoHS Compliant
    Contains Lead
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    15MHz
    1MX1
    -
    -
    -
    -
    not_compliant
    Not Qualified
    3.3V
    SYNCHRONOUS
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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