Xilinx Inc. XC17S200APD8I
- Part Number:
- XC17S200APD8I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3730368-XC17S200APD8I
- Description:
- IC PROM SER 200000 I-TEMP 8-DIP
- Datasheet:
- XC17S200APD8I
Xilinx Inc. XC17S200APD8I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S200APD8I.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature-40°C~85°C
- PackagingTube
- Published1999
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)Not Applicable
- Number of Terminations8
- ECCN CodeEAR99
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch2.54mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S200A
- Pin Count8
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size2Mb
- Supply Current-Max0.015mA
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.001A
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC17S200APD8I Overview
A neat 8-DIP (0.300, 7.62mm) package is used.External packaging for the Tube series.Licensed to operate in -40°C~85°C.With the help of OTP, it can be programmed.This device is fed with a voltage of 3V~3.6V which is applied to it.Mounted in Through Hole is this memory device.Data storage is limited to a size of 2Mb bytes.Search "XC17S200A" for related parts.Supply voltage 3.3V is required.Various functions can be applied to 8 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.There are 8 pins on it.Through SERIAL-processing, data is transmitted from this memory to the CPU.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.015mA.Parts come with 8 pins.There is a configuration of COMMON for the memory's I/O.To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the part.
XC17S200APD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200APD8I Applications
There are a lot of Xilinx Inc. XC17S200APD8I applications of configuration proms for FPGAs.
cell phones
telecommunications
personal computers
multimedia computers
data buffer
eSRAM
mainframes
personal digital assistants
networking
DVD disk buffer
A neat 8-DIP (0.300, 7.62mm) package is used.External packaging for the Tube series.Licensed to operate in -40°C~85°C.With the help of OTP, it can be programmed.This device is fed with a voltage of 3V~3.6V which is applied to it.Mounted in Through Hole is this memory device.Data storage is limited to a size of 2Mb bytes.Search "XC17S200A" for related parts.Supply voltage 3.3V is required.Various functions can be applied to 8 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.There are 8 pins on it.Through SERIAL-processing, data is transmitted from this memory to the CPU.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.015mA.Parts come with 8 pins.There is a configuration of COMMON for the memory's I/O.To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the part.
XC17S200APD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200APD8I Applications
There are a lot of Xilinx Inc. XC17S200APD8I applications of configuration proms for FPGAs.
cell phones
telecommunications
personal computers
multimedia computers
data buffer
eSRAM
mainframes
personal digital assistants
networking
DVD disk buffer
XC17S200APD8I More Descriptions
Configuration Memory, 1335840X1, Serial, CMOS, PDIP8
XC17S200A EAR99 Tube 1999 ics fpga configuration 7.62mm 0.001A 2Mb 3.3V
PROM Serial 1.6M-bit 3.3V 8-Pin PDIP
IC PROM SER 200000 I-TEMP 8-DIP
XC17S200A EAR99 Tube 1999 ics fpga configuration 7.62mm 0.001A 2Mb 3.3V
PROM Serial 1.6M-bit 3.3V 8-Pin PDIP
IC PROM SER 200000 I-TEMP 8-DIP
The three parts on the right have similar specifications to XC17S200APD8I.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable TypeMemory SizeSupply Current-MaxOutput CharacteristicsMemory WidthStandby Current-MaxParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusLead FreeAdditional FeatureClock FrequencyOrganizationDensityTerminal FinishHTS CodeTerminal FormReach Compliance CodeQualification StatusPower SuppliesOperating ModeMemory DensityView Compare
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XC17S200APD8IThrough Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube1999e0noObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL22513.3V2.54mm30XC17S200A83.3V3.6V3VOTP2Mb0.015mA3-STATE10.001ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNoNon-RoHS CompliantContains Lead-------------
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Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL22513.3V2.54mm30XC17256EL83.3V3.6V3VOTP256Kb0.005mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNoNon-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS15MHz256KX1256 kb--------
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Surface Mount20-LCC (J-Lead)YES20-40°C~85°CTube2000e0-Obsolete3 (168 Hours)20EAR99CMOS3V~3.6VQUAD22513.3V1.27mm30XC17256EL20-3.6V3VOTP256Kb0.005mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY4.572mm8.9662mm8.9662mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS15MHz256KX1-Tin/Lead (Sn85Pb15)8542.32.00.61J BENDnot_compliantNot Qualified3.3VSYNCHRONOUS262144 bit
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0noObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL22513.3V2.54mm30XC1701L8-3.6V3VOTP1Mb0.01mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS15MHz1MX1----not_compliantNot Qualified3.3VSYNCHRONOUS-
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