Xilinx Inc. XC17S150APD8C
- Part Number:
- XC17S150APD8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3246581-XC17S150APD8C
- Description:
- IC PROM SER 150000 C-TEMP 8-DIP
- Datasheet:
- XC17S150APD8C
Xilinx Inc. XC17S150APD8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S150APD8C.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published1999
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)Not Applicable
- Number of Terminations8
- ECCN CodeEAR99
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch2.54mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S150A
- Pin Count8
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size1.5Mb
- Supply Current-Max0.005mA
- Organization1040096X1
- Output Characteristics3-STATE
- Memory Width1
- Density1 Mb
- Standby Current-Max0.00005A
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC17S150APD8C Overview
An interesting 8-DIP (0.300, 7.62mm) package is used.Tube external packaging.A qualified individual who has the ability to operate within 0°C~70°C.Using OTP, you can program it.The voltage fed to it is 3V~3.6V.I have mounted this memory device in Through Hole.The size of data storage is limited to 1.5Mb.Try searching "XC17S150A" for more parts.There is a voltage requirement of 3.3V for supplying it with power.8 terminations with different functions.There is a maximum voltage of 3.6V that can be applied to this memory device.An operating voltage of 3V is required in order to supply the device.An CONFIGURATION MEMORY memory chip.Reflow soldering should be done at no higher than 225 degrees.The 8 pins are on the board.SERIAL-processing is used to transmit data through this memory using the SERIAL-processing algorithm.The memory chip is allowed to operate from a voltage no higher than 0.005mA.Parts include 8 pins.There is a configuration of COMMON for the memory's I/O.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.
XC17S150APD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S150APD8C Applications
There are a lot of Xilinx Inc. XC17S150APD8C applications of configuration proms for FPGAs.
telecommunications
embedded logic
printers
networking
data buffer
servers
personal computers
Camcorders
main computer memory
eSRAM
An interesting 8-DIP (0.300, 7.62mm) package is used.Tube external packaging.A qualified individual who has the ability to operate within 0°C~70°C.Using OTP, you can program it.The voltage fed to it is 3V~3.6V.I have mounted this memory device in Through Hole.The size of data storage is limited to 1.5Mb.Try searching "XC17S150A" for more parts.There is a voltage requirement of 3.3V for supplying it with power.8 terminations with different functions.There is a maximum voltage of 3.6V that can be applied to this memory device.An operating voltage of 3V is required in order to supply the device.An CONFIGURATION MEMORY memory chip.Reflow soldering should be done at no higher than 225 degrees.The 8 pins are on the board.SERIAL-processing is used to transmit data through this memory using the SERIAL-processing algorithm.The memory chip is allowed to operate from a voltage no higher than 0.005mA.Parts include 8 pins.There is a configuration of COMMON for the memory's I/O.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.
XC17S150APD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S150APD8C Applications
There are a lot of Xilinx Inc. XC17S150APD8C applications of configuration proms for FPGAs.
telecommunications
embedded logic
printers
networking
data buffer
servers
personal computers
Camcorders
main computer memory
eSRAM
XC17S150APD8C More Descriptions
XC17S150A EAR99 Tube 1040096X1 ics fpga configuration 7.62mm 0.00005A 1.5Mb 3.3V
Configuration Memory, 1040096X1, Serial, CMOS, PDSO20
PROM Serial 1M-bit 3.3V 8-Pin PDIP
IC PROM SER 150000 C-TEMP 8-DIP
Configuration Memory, 1040096X1, Serial, CMOS, PDSO20
PROM Serial 1M-bit 3.3V 8-Pin PDIP
IC PROM SER 150000 C-TEMP 8-DIP
The three parts on the right have similar specifications to XC17S150APD8C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable TypeMemory SizeSupply Current-MaxOrganizationOutput CharacteristicsMemory WidthDensityStandby Current-MaxParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusLead FreeAdditional FeatureReach Compliance CodeQualification StatusPower SuppliesOperating ModeClock FrequencyTerminal FormMemory DensityView Compare
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XC17S150APD8CThrough Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube1999e0noObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL22513.3V2.54mm30XC17S150A83.3V3.6V3VOTP1.5Mb0.005mA1040096X13-STATE11 Mb0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNoNon-RoHS CompliantContains Lead---------
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Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0noObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL22513.3V2.54mm30XC1701L8-3.6V3VOTP1Mb0.01mA1MX13-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliantNot Qualified3.3VSYNCHRONOUS15MHz--
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99CMOS4.5V~5.5VDUAL22515V1.27mm30XC17128E8-5.5V4.5VOTP128kb0.01mA-3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliantNot Qualified5VSYNCHRONOUS15MHzGULL WING131072 bit
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99CMOS4.5V~5.5VDUAL22515V2.54mm30XC17128E8-5.5V4.5VOTP128kb0.01mA-3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliantNot Qualified5VSYNCHRONOUS15MHz-131072 bit
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